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Wafer cleaning method and apparatus therefore

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-005/00
출원번호 US-0921565 (1992-07-29)
우선권정보 JP-0113922 (1989-05-06); JP-0087068 (1990-03-30); JP-0092472 (1990-04-07)
발명자 / 주소
  • Tanaka Masato (Hikone JPX) Nishizawa Hisao (Hikone JPX) Hirai Nobuyuki (Hikone JPX) Shinbara Kaoru (Hikone JPX) Yoshioka Hitoshi (Hikone JPX)
출원인 / 주소
  • Dainippon Screen Mfg. Co., Ltd. (JPX 03)
인용정보 피인용 횟수 : 105  인용 특허 : 0

초록

A wafer cleaning method and apparatus in which a cleaning solution is caused to evaporate at a temperature below its boiling point, and cleaning vapor thus produced is applied at a temperature above its dew point to a wafer such as a semiconductor wafer. The wafer is cleaned without formation of col

대표청구항

A method of cleaning a wafer by supplying cleaning vapor to the wafer, comprising the steps of: causing a cleaning solution to evaporate at a temperature below its boiling point to produce said cleaning vapor; and supplying said cleaning vapor to said wafer to clean said wafer at a temperature above

이 특허를 인용한 특허 (105)

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