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Area array semiconductor device having a lid with functional contacts 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • A01L-023/02
  • A01L-023/12
출원번호 US-0024124 (1993-03-01)
발명자 / 주소
  • Higgins
  • III Leo M. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 165  인용 특허 : 0

초록 ▼

An area array semiconductor device (10) having a lid with functional I/O contacts can be manufactured. In one embodiment, a semiconductor die (12) is mounted in a die cavity (16) of a substrate (14). A plurality of wire bonds (20) connect the die to conductive traces (18) on a surface of the substra

대표청구항 ▼

An area array semiconductor device comprising: a polymeric substrate having a first plurality of conductive traces and a die cavity; a semiconductor die having an active surface and an inactive surface, wherein the inactive surface is bonded to the substrate in the die cavity; a plurality of electri

이 특허를 인용한 특허 (165)

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  151. Liu, Chenglin; Liou, Shiann-Ming, Thermal enhanced package.
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  152. Liu, Chenglin; Liou, Shiann-Ming, Thermal enhanced package.
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  153. Zhao, Sam Ziqun; Khan, Reza-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array package.
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  154. Zhao, Sam Ziqun; Khan, Reaz-ur Rahman; Law, Edward; Papageorge, Marc, Thermally and electrically enhanced ball grid array packaging.
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  155. Wilson James Warren ; Engle Stephen Robert ; Moore Scott Preston, Thermally enhanced ball grid array package.
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  156. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  157. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  158. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  159. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  160. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  161. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  162. Lin, Mou-Shiung, Top layers of metal for high performance IC's.
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  163. Kim Jin Sung,KRX, UFBGA package equipped with interface assembly including a photosoluble layer.
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  164. Honer, Kenneth Allen; Damberg, Philip, Ultra-thin near-hermetic package based on rainier.
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  165. Murtuza, Masood; Venkateswaran, Muthiah; Chauhan, Satyendra S., Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad.
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