이 특허를 인용한 특허 (43)

1. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

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2. Birang, Manoocher; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

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3. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations.

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4. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Apparatus and method for in-situ endpoint detection for semiconductor processing operations.

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5. Le Roy, Erwan; Tsao, Chun-Cheng; Lundquist, Theodore R.; Jain, Rajesh Kumar, Apparatus and method for optical interference fringe based integrated circuit processing.

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6. Tang, Wallace T. Y., Apparatus for detection of thin films during chemical/mechanical polishing planarization.

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7. Brownell, Michael, Apparatus, system and method for precision depth measurement.

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8. Brownell, Michael, Apparatus, system and method for precision depth measurement.

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9. Hunt, Jeffrey H., Broadband infrared spectral surface spectroscopy.

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10. McAndrew James ; Wang Hwa-Chi ; Jurcik ; Jr. Benjamin J., Chamber effluent monitoring system and semiconductor processing system comprising absorption spectroscopy measurement s.

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11. James McAndrew ; Hwa-Chi Wang ; Benjamin J. Jurcik, Jr., Chamber effluent monitoring system and semiconductor processing system comprising absorption spectroscopy measurement system, and methods of use.

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12. McAndrew James ; Wang Hwa-Chi ; Jurcik ; Jr. Benjamin J., Chamber effluent monitoring system and semiconductor processing system comprising absorption spectroscopy measurement system, and methods of use.

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13. Wang, Haiming; Lee, Shing; Nikoonahad, Mehrdad, Detection of film thickness through induced acoustic pulse-echos.

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14. Jean-Pierre Briand FR, Device and method for ion beam etching using space-time detection.

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15. Hunt,Jeffrey H., Difference-frequency surface spectroscopy.

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16. Zhang, Jimin; Lee, Harry Q.; Wang, Zhihong; Tu, Wen-Chiang, Endpoint detection during polishing using integrated differential intensity.

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17. Hunt, Jeffrey H., Femtosecond optical surface imaging.

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18. Hunt, Jeffrey H., Fiber-optic based surface spectroscopy.

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19. Piwonka-Corle, Timothy R.; Scoffone, Karen F.; Chen, Xing; Lacomb, Jr., Lloyd J.; Stehle, Jean-Louis; Zahorski, Dorian; Rey, John-Pierre, Focused beam spectroscopic ellipsometry method and system.

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20. Inman Ronald S. ; McAndrew James J. F., In-line cell for absorption spectroscopy.

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21. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.

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22. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.

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23. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.

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24. Tang,Wallace T. Y., In-situ real-time monitoring technique and apparatus for endpoint detection of thin films during chemical/mechanical polishing planarization.

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25. Zhou, Wang Long; Yang, Yongwu; Sapirstein, Victor S.; Peng, Shaoqing, Laser-induced breakdown spectroscopy with second harmonic guide light.

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26. Agarwal Vishnu K., Method and apparatus for endpointing a chemical-mechanical planarization process.

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27. Agarwal, Vishnu K., Method and apparatus for endpointing a chemical-mechanical planarization process.

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28. Agarwal, Vishnu K., Method and apparatus for endpointing a chemical-mechanical planarization process.

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29. Agarwal, Vishnu K., Method and apparatus for endpointing a chemical-mechanical planarization process.

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30. Buie, Melisa J.; Poslavsky, Leonid; Lewis, Jennifer, Method and apparatus for measuring etch uniformity of a semiconductor wafer.

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31. Birang, Manoocher; Swedek, Boguslaw A.; Kim, Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

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32. Birang,Manoocher; Swedek,Boguslaw A.; Kim,Hyeong Cheol, Method and apparatus of eddy current monitoring for chemical mechanical polishing.

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33. McAndrew James ; Inman Ronald S., Method and system for sensitive detection of molecular species in a vacuum by harmonic detection spectroscopy.

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34. Birang, Manoocher; Johansson, Nils; Gleason, Allan, Method for in-situ endpoint detection for chemical mechanical polishing operations.

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35. Hunt Jeffrey H., Method of monitoring a thin film of polyimide material using surface spectroscopy.

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36. Hunt, Jeffrey H., Microwave regime surface spectroscopy.

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37. Nikoonahad Mehrdad ; Lee Shing ; Wang Haiming, Non-contact system for measuring film thickness.

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38. Hunt, Jeffrey H., Nonlinear optical system for sensing the presence of contamination on a semiconductor wafer.

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39. Birang, Manoocher; Gleason, Allan, Polishing pad for in-situ endpoint detection.

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40. Inman Ronald S. ; McAndrew James, Polygonal planar multipass cell, system and apparatus including same, and method of use.

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41. Radens Carl J. ; Fairchok Cynthia A., Selective oxide-to-nitride etch process using C.sub.4 F.sub.8 /CO/Ar.

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42. Jean-Marc Girard FR; Benjamin J. Jurcik FR; Jean Friedt FR; James J. F. McAndrew, Semiconductor processing system and method for controlling moisture level therein.

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43. Hunt, Jeffrey H., System and method for imaging contamination on a surface.

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