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Polishing pad with controlled abrasion rate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24D-003/00
출원번호 US-0773477 (1991-10-09)
발명자 / 주소
  • Tuttle Mark E. (Boise ID)
출원인 / 주소
  • Micron Technology, Inc. (Boise ID 02)
인용정보 피인용 횟수 : 165  인용 특허 : 0

초록

A polishing pad is provided, having its face shaped to produce controlled nonuniform removal of material from a workpiece. Non-uniformity is produced as a function of distance from the pad\s rotational axis (the working radius). The pad face is configured with both raised, contact regions and voided

대표청구항

A polishing pad rotatable about a central axis, said pad having a circular, planar face perpendicular to said axis, said face to be brought in spinning contact with a workpiece during a polishing operation, said face comprising both raised and voided regions, said raised and voided regions being con

이 특허를 인용한 특허 (165)

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