$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Narrow channel finned heat sinking for cooling high power electronic components 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-025/04
출원번호 US-0069683 (1993-06-01)
발명자 / 주소
  • Azar Kaveh (Westwood MA) Caron Richard E. (Salem NH)
출원인 / 주소
  • AT&T Bell Laboratories (Murray Hill NJ 02)
인용정보 피인용 횟수 : 55  인용 특허 : 0

초록 ▼

Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The the

대표청구항 ▼

A heat sink comprising: a plurality of rectangular fins, each having a predetermined thickness and a predetermined height; and at least one channel of a predetermined width between the fins; in which a ratio of the predetermined thickness to the predetermined height is from about 0.005 to about 0.05

이 특허를 인용한 특허 (55)

  1. McIntyre Gerald L., Adjustable-pressure mount heatsink system.
    상세보기
  2. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Bonded cast, pin-finned heat sink and method of manufacture.
    상세보기
  3. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Bonded cast, pin-finned heat sink and method of manufacture.
    상세보기
  4. Bhatti,Mohinder Singh; Joshi,Shrikant Mukund; Reyzin,Ilya, Cooling assembly with impingement cooled heat sink.
    상세보기
  5. Joshi,Shrikant M.; Bhatti,Mohinder S.; Reyzin,Ilya E.; Johnson,Russell S., Cooling assembly with spirally wound fin.
    상세보기
  6. Gerard MacManus GB; Bruce Fryers GB; Nicholas Foley GB; Michael Tate GB, Cooling devices.
    상세보기
  7. Sato, Kaoru; Fujiwara, Yasuhiro; Kamizuru, Shinobu; Tate, Sumio; Sugimoto, Kazuhiko, Cooling element and cooling apparatus using the same.
    상세보기
  8. Fryers Bruce,GBX ; MacManus Gerard,GBX ; Tate Michael,GBX ; Foley Nicholas,GBX, Cooling equipment.
    상세보기
  9. Kubo, Hideo; Suzuki, Masahiro, Electronics device unit.
    상세보기
  10. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Extruded, tiered high fin density heat sinks and method of manufacture.
    상세보기
  11. Gregory T. Wyler ; Peter B. Favini ; Blaine C. Wotring ; Bibek Chapagain, Folded fin heat sink and fan attachment.
    상세보기
  12. Wilson,Michael J.; Wert,Kevin L.; Wattelet,Jonathan; DeKeuster,Richard; Lightner,Donald, Forced fluid heat sink.
    상세보기
  13. Lai,Cheng Tien; Zhou,Zhi Yong; Lu,Cui Jun, Heat dissipation device.
    상세보기
  14. Mennucci Joseph P. ; Mead Charles R., Heat exchanger assembly and method for making the same.
    상세보기
  15. Andrew W. Batchelor AU; Ben Banney AU; David McDonald AU; Tilak T. Chandratilleke AU, Heat exchanger for an electronic heat pump.
    상세보기
  16. Batchelor, Andrew W.; Banney, Ben; McDonald, David; Chandratilleke, Tilak T., Heat exchanger for an electronic heat pump.
    상세보기
  17. Mongia,Rajiv K.; Pokharna,Himanshu, Heat exchanger with cooling channels having varying geometry.
    상세보기
  18. Song, Tae-Ho; Kim, Sung-Jin, Heat sink.
    상세보기
  19. Kojima Masayasu (Takarazuka JPX) Hayashi Chihiro (Takarazuka JPX) Abiko Tetsuo (Nara JPX) Miki Keiji (Amagasaki JPX), Heat sink fin assembly for cooling an LSI package.
    상세보기
  20. Ghosh,Debashis; Bhatti,Mohinder Singh; Reyzin,Ilya; Parisi,Mark Joseph, Heat sink for an electronic device.
    상세보기
  21. Azar Kaveh, Heat sink with arc shaped fins.
    상세보기
  22. Azar Kaveh, Heat sink with flow guide.
    상세보기
  23. Azar Kaveh, Heat sink with open region.
    상세보기
  24. Park,Hee sung; Kim,Sun soo, Heatsink.
    상세보기
  25. Tavassoli Bahman, High performance fan tail heat exchanger.
    상세보기
  26. Mira Ali, High performance sinusoidal heat sink for heat removal from electronic equipment.
    상세보기
  27. Chrysler Gregory M. ; Chu Richard C., Hybrid cooling system for electronics module.
    상세보기
  28. Ghosh, Debashis; Bhatti, Mohinder Singh, Impingement cooled heat sink with low pressure drop.
    상세보기
  29. Ghosh, Debashis; Bhatti, Mohinder Singh, Integrated liquid cooled heat sink for electronic components.
    상세보기
  30. Brindak, Zachary; Young, Henry; Brown, Theodore; Cillessen, Sean; Murphy, Mark, Integrated mounting and cooling apparatus, electronic device, and vehicle.
    상세보기
  31. Mitchell,Jonathan E.; Bunyan,Michael H., Lightweight heat sink.
    상세보기
  32. Bhatti,Mohinder Singh; Ghosh,Debashis; Reyzin,Ilya, Liquid cooled thermosiphon for electronic components.
    상세보기
  33. Reyzin,Ilya; Bhatti,Mohinder Singh, Liquid cooled thermosiphon with flexible coolant tubes.
    상세보기
  34. Azar Kaveh, Method for fabricating a heat sink having nested extended surfaces.
    상세보기
  35. Bhatti, Mohinder Singh; Griffin, Patrick Mitchell, Method of making high performance heat sinks.
    상세보기
  36. Michael D. Armacost ; Peter D. Hoh ; Son V. Nguyen, Method of making silicon article having columns.
    상세보기
  37. Smith Dean L. ; Sobresky Edmund J. ; Kerr Roger S., Method of manufacturing bonded dual extruded, high fin density heat sinks.
    상세보기
  38. Nijhawan, Vijay; Darnell, Gregory N.; Wu, Wuxian, Methods and systems for managing performance and power utilization of a processor employing a fully multithreaded load threshold.
    상세보기
  39. Nijhawan, Vijay B.; Darnell, Gregory N.; Wu, Wuxian, Methods and systems for managing performance and power utilization of a processor employing a fully-multithreaded load threshold.
    상세보기
  40. Nijhawan, Vijay B.; Darnell, Gregory N.; Wu, Wuxian, Methods and systems for managing performance and power utilization of a processor employing a fully-multithreaded load threshold.
    상세보기
  41. Mennucci Joseph P. ; Mead Charles R., Multilayer laminate process.
    상세보기
  42. Mennucci Joseph P. (Manville RI) Mead Charles R. (Newbury MA), Multilayer laminate product and process.
    상세보기
  43. Sorgo, Miksa de, Non-electrically conductive thermal dissipator for electronic components.
    상세보기
  44. Krassowski,Daniel W.; Chen,Gary G., Optimized heat sink using high thermal conducting base and low thermal conducting fins.
    상세보기
  45. Azar Kaveh, Plate fin heat exchanger having fluid control means.
    상세보기
  46. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
    상세보기
  47. Pham,Hung M.; Warner,Wayne R., Refrigeration system including thermoelectric module.
    상세보기
  48. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
    상세보기
  49. Pham,Hung M; Warner,Wayne R, Refrigeration system including thermoelectric module.
    상세보기
  50. Azar Kaveh, Segmented heat sink.
    상세보기
  51. Armacost Michael D. ; Hoh Peter D. ; Nguyen Son V., Silicon article having columns and method of making.
    상세보기
  52. Schramm, Simon Herbert; El-Barbari, Said Farouk Said; Schroeder, Stefan; Yuan, Zhihui, System and method for full range control of dual active bridge.
    상세보기
  53. Mohinder Singh Bhatti ; Russell S. Johnson ; Shrikant M. Joshi, Ultra high fin density heat sink for electronics cooling.
    상세보기
  54. Akei, Masao; Ignatiev, Kirill M; Jayanth, Nagaraj; Pham, Hung M; Caillat, Jean-Luc M, Vapor compression circuit and method including a thermoelectric device.
    상세보기
  55. Akei, Masao; Ignatiev, Kirill; Jayanth, Nagaraj; Pham, Hung M.; Caillat, Jean-Luc M., Vapor compression circuit and method including a thermoelectric device.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로