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Coplanar heatsink and electronics assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0954548 (1992-09-30)
발명자 / 주소
  • Samarov Victor M. (36 Russell St. Carlisle MA 01741) DeCarolis Joseph A. (117 West St. Lunenburg MA 01462) Patel Raoji (90 Flanagan Dr. Framingham MA 01701) Piche Gerald J. (54 Clark Rd. Milford NH 0
인용정보 피인용 횟수 : 73  인용 특허 : 0

초록 ▼

There is provided a method and materials for cooling the power train components, such as transformers, rectifiers, chokes, and the like, of an integrated on-board power supply IOP) using a single heatsink. Spacers are positioned between the power train components and a substrate, the substrate for m

대표청구항 ▼

An apparatus, for providing a coplanar heatsink and electronics assembly, comprising: a substantially planar substrate; heat generating components of different heights positioned on one side of said substrate, each of said components including a heat-removal surface on one side thereof; at least one

이 특허를 인용한 특허 (73)

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