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Semiconductor device package having locating mechanism for properly positioning semiconductor device within package 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/02
출원번호 US-0016938 (1993-02-12)
우선권정보 JP-0059246 (1992-02-14); JP-0090166 (1992-03-17); JP-0112398 (1992-04-06)
발명자 / 주소
  • Kobayashi Kenzi (Tokyo JPX) Mori Hajime (Tokyo JPX) Yamaguti Yukio (Tokyo JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 137  인용 특허 : 0

초록 ▼

A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chi

대표청구항 ▼

A semiconductor device comprising: a circuit board; an IC (Integrated Circuit) chip packaged on said circuit board face down; a cap bonded to said circuit board at edges of an open end thereof and bonded to a top of said IC chip at a bottom thereof for hermetically sealing said IC chip; and position

이 특허를 인용한 특허 (137)

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  60. Sutardja, Sehat, Integrated chip package having intermediate substrate.
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  62. Sutardja, Sehat, Integrated chip package having intermediate substrate with capacitor.
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  65. Lo Randy H. Y.,TWX ; Wu Chi Chuan,TWX, Integration of heat conducting apparatus and chip carrier in IC package.
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