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Heat sink assembly for solid state devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
  • H01L-023/42
  • H01L-023/44
  • H01L-023/40
출원번호 US-0026515 (1993-03-04)
발명자 / 주소
  • Tata Peter D. (Johnston RI) Rife William B. (Greenville RI)
출원인 / 주소
  • Square Head, Inc. (Warwick RI 02)
인용정보 피인용 횟수 : 74  인용 특허 : 0

초록 ▼

A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. D

대표청구항 ▼

A heat sink assembly for removing heat from an electronic device package comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each ot

이 특허를 인용한 특허 (74)

  1. Palaniappa, Ilavarasan M.; Panavala, Vinayak Reddy; Fedde, Mickiel P., Adapter apparatus with deflectable element socket contacts.
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  4. Beale, Gary; McErlean, Eamon, Apparatus and method for thermal interfacing.
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  5. Lee, Cheng Chi; Fu, Xue Jin; Liu, Zheng Liang; Deng, Wen Qiu, Base for heat sink.
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  6. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers.
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  7. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Central inlet circuit board assembly.
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  8. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly for use in a central inlet chassis configuration.
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  9. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover.
    상세보기
  10. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks.
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  11. Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with integrated shaping and control of flow resistance curve.
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  12. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Closed-loop microchannel cooling system.
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  13. Belady Christian L. ; Cromwell S. Daniel, Cold plate arrangement for cooling processor and companion voltage regulator.
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  14. Santiago,Juan G.; Zeng,Shulin, Control of electrolysis gases in electroosmotic pump systems.
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  15. Ishimine, Junichi, Cooling device capable of contacting target with smaller urging force.
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  16. Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies.
    상세보기
  17. Sinha, Arvind K.; Weckman, Kory W., Electronic module with laterally-conducting heat distributor layer.
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  19. Sinha, Arvind K.; Weckman, Kory W., Electronic module with laterally-conducting heat distributor layer.
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  20. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.
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  21. Azar, Kaveh, Electronics package with integrated lugs for cooling attachment.
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  22. Goodson, Kenneth E.; Chen, Chuan-Hua; Huber, David E.; Jiang, Linan; Kenny, Thomas W.; Koo, Jae-Mo; Laser, Daniel J.; Mikkelsen, James C.; Santiago, Juan G.; Wang, Evelyn Ning-Yi; Zeng, Shulin; Zhang, Electroosmotic microchannel cooling system.
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    상세보기
  24. Goodson,Kenneth E.; Chen,Chuan Hua; Huber,David E.; Jiang,Linan; Kenny,Thomas W.; Koo,Jae Mo; Laser,Daniel J.; Mikkelsen,James C.; Santiago,Juan G.; Wang,Evelyn Ning Yi; Zeng,Shulin; Zhang,Lian, Electroosmotic microchannel cooling system.
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  25. Kuo,Yi Cheng; Chang,Chi Chang; Hsu,Cheng Ming, Fixed pillar with heat loss.
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  26. Segala, Marco, Heat dissipater for integrated circuits.
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  27. William B. Rife, Heat dissipation device with threaded fan module.
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  28. Mennucci Joseph P. ; Mead Charles R., Heat exchanger assembly and method for making the same.
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  36. Rife William B. ; McCullough Kevin A., Heat sink assembly with snap-in cover plate having multiple pressure capability.
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  37. Rife William B., Heat sink assembly with snap-in legs.
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  56. McCullough Kevin Albert (Warwick RI), Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member.
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  57. Autry Sidney David, Positive pressure heat sink conduit.
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