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Packaging structure of small-sized computer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0885979 (1992-05-20)
우선권정보 JP-0129850 (1991-05-31)
발명자 / 주소
  • Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Ohba Takao (Hadano JPX) Iwai Susumu (Hadano JPX)
출원인 / 주소
  • Hitachi, Ltd. (JPX 03)
인용정보 피인용 횟수 : 92  인용 특허 : 0

초록 ▼

In a small-sized computer of a natural air-cooling type, a high-temperature radiator promotes natural convection so as to increase a quantity of heat radiation and to raise the allowable limit of heat generation of LSI chips, thereby improving the processing speed of the computer. For this purpose,

대표청구항 ▼

A portable computer having an air natural convection and heat radiation structure including computer component parts which generate heat and are provided in a casing, wherein a high-temperature radiator is heat-conductively connected to said heat generating computer component parts via a heat-conduc

이 특허를 인용한 특허 (92)

  1. Sato Yasue,JPX ; Kawate Shinichi,JPX ; Azuma Hisanobu,JPX, Air cooling for flat panel displays.
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  4. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
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  6. Mongia, Rajiv K.; Machiroutu, Sridhar V., Apparatus and method to efficiently cool a computing device.
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  8. Bhatia Rakesh, Apparatus for cooling electronic components within a computer system enclosure.
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  9. Haley Kevin (San Jose CA) Aghazadeh Mostafa (Chandler AZ) Xie Hong (Chandler AZ), Apparatus for dissipating heat in a hinged computing device.
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  10. John R. Sterner, Apparatus to enhance cooling of electronic device.
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  12. John R. Sterner, Apparatus to enhance cooling of electronic device.
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  13. John R. Sterner, Apparatus to enhance cooling of electronic device.
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  14. John R. Sterner, Apparatus to enhance cooling of electronic device.
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  19. Lee, Chia-Chen, Casing for reducing airflow resistance, cooling device, and server using the same.
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  25. Glover, Troy W.; June, Michael S.; Kamath, Vinod; Scott, III, Whitcomb R., Controlling airflow in a computer chassis.
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  26. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
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  28. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
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  29. Bhatia Rakesh, Cooling fan for computing devices with split motor and fan blades.
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  31. Su,Yo Yo; Chen,Mao Chiang, Cooling-fan-free system module.
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  32. Shimizu, Nobuyoshi, Display apparatus and adjustment mechanism.
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  36. Akira Ueda JP; Masumi Suzuki JP; Minoru Hirano JP, Electronic apparatus having a heat dissipation member.
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  45. Sammakia Bahgat Ghaleb ; Sathe Sanjeev Balwant, Electronic packages and method to enhance the passive thermal management of electronic packages.
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  46. Rakesh Bhatia ; Karen Regis, Fan based heat exchanger.
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  47. Bhatia Rakesh, Flat fan heat exchanger and use thereof in a computing device.
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  48. Mitchell Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
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  49. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
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  50. Mitchell, Nathan A., Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus.
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  51. Cipolla, Thomas Mario; Mok, Lawrence Shungwei, Formed hinges with heat pipes.
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  52. Mecredy ; III Henry E., Heat dissipating lid hinge structure with laterally offset heat pipe end portions.
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  53. Colin Fuller GB; Anthony Bristow GB; Stephen Cross GB; David Woodhouse GB; David Sturge GB, Heat dissipation in electrical apparatus.
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  54. Hsu Richard T., Heat dissipation system for a laptop computer using a heat pipe.
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  55. Bhatia Rakesh, Heat exchanger for a portable computing device and docking station.
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  56. Rakesh Bhatia, Heat exchanger for a portable computing device and docking station.
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  57. Bhatia Rakesh, Heat exchanger system for cooling a hinged computing device.
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  58. Altic James E. ; Karl Rex A. ; Vinson Samuel L., Heat frame for portable computer.
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  59. Bhatia Rakesh ; Haley Kevin, Heat pipe exchanger system for cooling a hinged computing device.
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  60. Yamada,Shigeru; Chiba,Toshimi, Keyboard apparatus.
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  61. Nishijima Akio,JPX, Keyboard device.
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  62. Bhatia Rakesh, Keyboard having an integral heat pipe.
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  63. Tracy, Mark S.; Ashcraft, Britt C.; Lev, Jeffrey A.; Walker, Paul N., Laptop computer user thermal isolation apparatus.
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  64. Agata, Hiroaki; Jamal-Eddine, Tarek J.; Mok, Lawrence S., Method and arrangement for enhancing the cooling capacity of portable computers.
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  65. DiStefano, Eric; Seshan, Krishna, Mobile computer having a housing with openings for cooling.
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  66. Enserink Anton Rudolf,NLX, Neck connection for a stringed instrument made in one piece, and method for the production thereof.
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  67. McBroom, Michael D.; Andre, Bartley K.; Silvanto, Mikael M.; Donarski, Matthew A.; Salvatti, Alexander V.; Boothe, Daniel K.; Mihelich, Ryan J.; Paseman, Sabrina K., One piece frame for a component in an electronic device.
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  68. David D. Staggers ; Stephen L. Ballou ; Edmund A. Singer, Passively operated thermally diodic packaging method for missile avionics.
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  71. Cipolla Thomas Mario ; Mok Lawrence Shungwei, Portable computer rotational heat pipe heat transfer.
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  72. Dickie, James P, Portable computer with integrated PDA I/O docking cradle.
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  73. Refai-Ahmed, Gamal, Portable computing device with thermal management.
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  74. Satake Shigeru,JPX, Portable information apparatus with heat sink for promoting heat radiation from circuit components.
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  75. Ronald D. Smith, Projection system.
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  76. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
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  77. Jones Leroy, RF grounding and heat distribution system for a portable computer including a slip joint hinge with a banana plug type.
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  78. Klopotek Peter J., Radiative keyboard heating apparatus.
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  79. North, Travis C.; Helberg, Christopher M.; Shelnutt, Austin M., Skin based system cooling using internal system fan.
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  80. Mok Lawrence Shungwei, Spring loaded heat pipe connector for hinged apparatus package.
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  81. O'Connor Michael ; Haley Kevin J., Thermal connector for joining mobile electronic devices to docking stations.
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  82. Nakanishi, Tohru; Nishiio, Toshihiko, Thermal controller for computer, thermal control method for computer and computer equipped with thermal controller.
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  83. Jondrow Timothy J., Thermal dissipation and EMI shielding structure for notebook computers.
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  84. MacDonald, Mark, Thermal management of an electronic device.
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  85. Heirich, Douglas L.; Lundgren, David A.; Olson, Robert N.; Upadhya, Girish; Forsblad, Larry; Riccio, Daniel J., Thermal management system.
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  86. Heirich, Douglas L.; Lundgren, David A.; Olson, Robert N.; Upadhya, Girish; Forsblad, Larry; Riccio, Daniel J., Thermal management system.
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  87. Heirich, Douglas L.; Lundgren, David A.; Olson, Robert N.; Upadhya, Girish; Forsblad, Larry; Riccio, Daniel J., Thermal management system.
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  88. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient computer incorporating deploying CPU module.
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  89. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
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  90. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
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  91. Janik Craig M. ; Boyle Dennis J. ; Mongan Ryan H. ; Shawver Michael J., Thermally efficient portable computer incorporating deploying CPU module.
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  92. Ford, Daniel A.; Kaufman, James H.; Melroy, Owen R.; Miner, Cameron S.; Roche, Kevin P., Visual heat sink for computers and method of use.
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