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Encapsulated electronic package

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/02
  • H01L-023/28
출원번호 US-0906346 (1992-06-30)
발명자 / 주소
  • Pennisi Robert W. (Boca Raton FL) Gold Glenn E. (Coconut Creek FL) Juskey Frank J. (Coral Springs FL) Urbish Glenn F. (Coral Springs FL)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 62  인용 특허 : 0

초록

An encapsulated electronic package (10) is made by bonding one or more semiconductor devices or integrated circuits (16) to a printed circuit board with an adhesive (14), and covering with a glob top encapsulant (15). The printed circuit board has a metal circuit pattern (12) on one side, and, optio

대표청구항

An electronic package, comprising: a printed circuit board having a metal circuit pattern disposed on a first major surface thereof; a semiconductor device attached to the printed circuit board by means of an adhesive; an encapsulant covering the semiconductor device and portions of the printed circ

이 특허를 인용한 특허 (62)

  1. Kosteva Stephen John ; Passante David Michael ; Rudik William John ; Russell David John ; Whitcomb Jonathan Craig, Apparatus and process for improved die adhesion to organic chip carriers.
  2. Thummel Steven G., Apparatus for encasing array packages.
  3. Thummel, Steven G., Apparatus for encasing array packages.
  4. Thummel, Steven G., Apparatus for encasing array packages.
  5. Franca Neto,Luiz M.; Bloechel,Bradley A., Apparatus to provide connection between a microelectronic device and an antenna.
  6. Thornton, Darren Mark, Blast movement monitor.
  7. Thornton, Darren Mark; Sheridan, Graham Anthony, Blast movement monitor.
  8. Zak Robert L., Chip-on-board printed circuit assembly using aluminum wire bonded to copper pads.
  9. Zak Robert L., Chip-on-board printed circuit manufacturing process using aluminum wire bonded to copper pads.
  10. Brown Robert Walter ; Pollack Richard Stephen ; Letkomiller Joseph Michael, Circuit module.
  11. Robert Walter Brown ; Richard Stephen Pollack ; Joseph Michael Letkomiller, Circuit module.
  12. Diehlmann Ralf,DEX ; Block Volker,DEX, Electrical circuit.
  13. Kazuyoshi Amami JP; Hiroaki Takezawa JP; Tsukasa Shiraishi JP; Yoshihiro Bessho JP, Electrical mounting structure having an elution preventive film.
  14. Chew, Tong Fatt; Leong, Ak Wing, Electronic device having a dimensionally-stable electrically-conductive flexible substrate.
  15. Fuller,Jason L.; Hall,Frank L.; Jiang,Tongbi, Electronic device package.
  16. Lotfi Ashraf Wagih ; Weld John David ; Wolf Karl Erich ; Woods William Lonzo, Encapsulated package for power magnetic devices and method of manufacture therefor.
  17. Fukutomi,Naoki; Tsubomatsu,Yoshiaki; Inoue,Fumio; Yamazaki,Toshio; Ohhata,Hirohito; Hagiwara,Shinsuke; Taguchi,Noriyuki; Nomura,Hiroshi, Fabrication process of semiconductor package and semiconductor package.
  18. Lin, Wei-Yi; Yang, Hui-Neng; Shen, Po-Hui; Liu, Cheng-Chieh; Lee, Kun-Ming; Yan, Cheng-Wei, Fan and frame thereof.
  19. Suresh Ramalingam ; Nagesh Vodrahalli ; Michael J. Costello ; Mun Leong Loke ; Ravi V. Mahajan, Integrated circuit package having a substrate vent hole.
  20. Preston, Nigel Ashley; Gray, Robert William, Intrinsically safe portable programmer for enclosed electronic process control equipment.
  21. Thompson, D. Scott; Kecman, Fedja, LED device having a dome lens.
  22. Ruiz Oscar Jaime ; Shafe Mathew Kayhan, Laminated hard disk head suspension and etching process.
  23. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Light emitting device with multilayer silicon-containing encapsulant.
  24. Matsui,Nobuyuki; Nagai,Hideo; Mukai,Kenji; Shimizu,Masanori, Light emitting diode module.
  25. Armstrong Joseph H. ; Misra Mohan S. ; Kapuria Anil K., Low cost protective coating and method for a die-on-board electronic assembly.
  26. Leif Bergstedt SE; Herbert Zirath SE, Method and arrangement pertaining to microwave lenses.
  27. Thummel Steven G., Method for encasing array packages.
  28. Thummel Steven G., Method for encasing array packages.
  29. Thummel, Steven G., Method for encasing array packages.
  30. Thummel,Steven G., Method for encasing plastic array packages.
  31. Joseph M. Brand ; Scott Gooch, Method of encapsulating semiconductor devices utilizing a dispensing apparatus with rotating orifices.
  32. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
  33. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making a light emitting device having a molded encapsulant.
  34. Thompson, D. Scott; Leatherdale, Catherine A.; Boardman, Larry D.; Ouderkirk, Andrew J.; Kecman, Fedja, Method of making light emitting device having a molded encapsulant.
  35. Thompson, D. Scott; Boardman, Larry D.; Leatherdale, Catherine A., Method of making light emitting device with multilayer silicon-containing encapsulant.
  36. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A., Method of making light emitting device with silicon-containing encapsulant.
  37. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A., Method of making light emitting device with silicon-containing encapsulant.
  38. Boardman,Larry D.; Thompson,D. Scott; Leatherdale,Catherine A.; Ouderkirk,Andrew J., Method of making light emitting device with silicon-containing encapsulant.
  39. Baba Shinji,JPX ; Shibata Jun,JPX ; Ueda Tetsuya,JPX, Method of manufacturing semiconductor device.
  40. Kim, Tae Hoon; Kim, Jong Hoon; Kim, Dae Won; Choi, Hyeong Seok, Method of manufacturing wafer level package and wafer level package manufactured thereby.
  41. Matsuo Takahiro,JPX ; Maruyama Yoshio,JPX ; Hikita Osamu,JPX ; Kadoriku Shinji,JPX, Module for packaged IC.
  42. Gates ; Jr. Louis E. (Westlake Village CA), Multi-layer film adhesive for electrically isolating and grounding an integrated circuit chip to a printed circuit subst.
  43. Shino, Yoshiyuki; Higuma, Masahiko, Non-contact information recording medium for ink-jet recording and image forming process.
  44. Kierse, Oliver J.; Lillelund, Christian, Packages and methods for packaging.
  45. Lillelund, Christian, Packages and methods for packaging microphone devices.
  46. Bauer, Michael; Bemmerl, Thomas; Fuergut, Edward; Jerebic, Simon; Vilsmeier, Hermann, Panel and semiconductor device having a composite plate with semiconductor chips.
  47. Scranton Alec B. ; Rangarajan Bharath ; Baikerikar Kiran K., Photopolymerizable compositions for encapsulating microelectronic devices.
  48. Hidenori Kimbara JP; Nobuyuki Ikeguchi JP; Katsuji Komatsu JP, Printed wiring board for semiconductor plastic package.
  49. Hidenori Kimbara JP; Nobuyuki Ikeguchi JP; Katsuji Komatsu JP, Printed wiring board for semiconductor plastic package.
  50. Ramalingam, Suresh; Vodrahalli, Nagesh; Costello, Michael J.; Loke, Mun Leong; Mahajan, Ravi V., Process for assembling an integrated circuit package having a substrate vent hole.
  51. Okuda Hiroshi,JPX, Resin-molded electronic circuit device.
  52. Carter Kenneth Raymond ; Hawker Craig Jon ; Hedrick James Lupton ; Miller Robert Dennis ; Gaynes Michael Anthony ; Buchwalter Stephen Leslie, Reworkable thermoplastic encapsulant.
  53. Carter Kenneth Raymond ; Hawker Craig Jon ; Hedrick James Lupton ; Miller Robert Dennis ; Gaynes Michael Anthony ; Buchwalter Stephen Leslie, Reworkable thermoplastic hyper-branched encapsulant.
  54. Luechinger, Christoph B., Ribbon bonding in an electronic package.
  55. Luechinger, Christoph B., Ribbon bonding in an electronic package.
  56. Joseph M. Brand ; Scott Gooch, Semiconductor device encapsulators.
  57. Brand, Joseph M.; Gooch, Scott, Semiconductor device encapsulators, methods of encapsulating semiconductor devices and methods of forming electronic packages.
  58. Suzuya, Nobuhito; Yoshimura, Atsushi; Mukaida, Hideko, Semiconductor device, and method and apparatus for manufacturing the same.
  59. Lobsinger, Joshua David; Shane, Michael John; Brosas, Ronaldo Francisco Hernandez, Semiconductor package having filler metal of gold/silver/copper alloy.
  60. Noda Yuuji,JPX, Structure and method for mounting an electric part.
  61. Lumbard Marvin, Surface mount LED alphanumeric display.
  62. Warren Robert W., Top of die chip-on-board encapsulation.
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