$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Electronic assembly including heat absorbing material for limiting temperature through isothermal solid-solid phase tran

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
출원번호 US-0061096 (1993-05-14)
발명자 / 주소
  • Elwell Dennis F. (San Clemente CA)
출원인 / 주소
  • Hughes Aircraft Company (Los Angeles CA 02)
인용정보 피인용 횟수 : 45  인용 특허 : 0

초록

A solid polyhydric alcohol material (16) is provided in thermal contact with an electronic component (14) which will be damaged if its temperature rises above a certain value. The material (16), known as a phase change material (PCM), exhibits an isothermal solid-solid phase transition at a predeter

대표청구항

An electronic assembly, comprising: an electronic component that generates heat when operated; a thermally conductive heat sink in direct contact with said electronic component for dissipating heat generated by said electronic component; and a mass of a heat absorbing material in direct contact with

이 특허를 인용한 특허 (45)

  1. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  2. Searls, Damion T.; Dishongh, Terrance J.; Pullen, David, Apparatus and method for passive phase change thermal management.
  3. Freeland Mark, Bonding material and phase change material system for heat burst dissipation.
  4. Hall,Daniel F.; Miura,Jason K.; Zamel,James M., Cast laser optical bench.
  5. Zamel,James Michael; St. Pierre,Randall; Szot,John A., Diode-pumped solid-state laser gain module.
  6. Standing, Martin, Electronic component.
  7. Standing, Martin, Electronic component having a heat-sink thermally coupled to a heat-spreader.
  8. Standing, Martin, Electronic component having a heat-sink thermally coupled to a heat-spreader.
  9. Joshi, Shailesh N.; Dede, Ercan Mehmet, Electronic device assemblies and vehicles employing dual phase change materials.
  10. Joshi, Shailesh N.; Dede, Ercan Mehmet, Electronic device assemblies and vehicles employing dual phase change materials.
  11. Gordon Kerry W., Heat absorber and combination electrical apparatus producing heat and heat absorber.
  12. Andre Ali, Heat exchanger having phase change material for a portable computing device.
  13. Weaver, Matthew, Heat removal system and method for light emitting diode lighting apparatus.
  14. Weaver, Matthew, Heat removal system and method for light emitting diode lighting apparatus.
  15. Pidwerbecki, David; Uan-Zo-li, Alexander B., High heat capacity electronic components and methods for fabricating.
  16. Eesley, Gary Lynn; Morelli, Donald T.; Bhatti, Mohinder Singh, High performance heat exchange assembly.
  17. Bhatti, Mohinder Singh; Joshi, Shrikant M.; Johnson, Russell S., High-performance heat sink for electronics cooling.
  18. Elias,J. Michael; Cepas,Bruce M.; Korn,James A., Integrated power and cooling architecture.
  19. Hitchcock, Robert; Kingman, James; Weaver, Matthew D.; Cochran, Dustin; Ghose, Sanjoy, LED lamp assembly with thermal management system.
  20. Hitchcock, Robert; Kingman, James; Weaver, Matthew; Cochran, Dustin; Ghose, Sanjoy, LED lamp assembly with thermal management system.
  21. Stephens, IV, Edward F.; Feeler, Courtney Ryan; Junghans, Jeremy Scott, Laser diode ceramic cooler having circuitry for control and feedback of laser diode performance.
  22. Stephens, IV,Edward Franklin, Laser diode package with an internal fluid cooling channel.
  23. Stephens, IV,Edward Franklin, Laser diode package with an internal fluid cooling channel.
  24. Deri, Robert J.; Kotovsky, Jack; Spadaccini, Christopher M., Laser diode package with enhanced cooling.
  25. Heberle Geoffrey O., Laser system using phase change material for thermal control.
  26. Heberle, Geoffrey O., Laser system using phase change material for thermal control.
  27. Nakiboglu, Günes, Lithography apparatus and a method of manufacturing a device.
  28. Golnas Anastasios M. ; Merz Robert ; Prinz Fritz B., Method for embedding electric or optical components in high-temperature metals.
  29. Searls,Damion T.; Dishongh,Terrance J.; Pullen,David, Method for passive phase change thermal management.
  30. Edwards,David L.; Fleischman,Thomas; Zucco,Paul A., Method of forming anisotropic heat spreading apparatus for semiconductor devices.
  31. Stephens, IV, Edward F., Method of manufacturing laser diode packages and arrays.
  32. Weaver, Matt; Kingman, James, Methods of selecting one or more phase change materials to match a working temperature of a light-emitting diode to be cooled.
  33. Stephens, IV, Edward F.; Feeler, Courtney Ryan; Junghans, Jeremy Scott, Microchannel cooler for a single laser diode emitter based system.
  34. Coleman, Steven M.; Stephens, Edward F., Microchannel cooler for high efficiency laser diode heat extraction.
  35. Glover Richard John,CAX ; Bishop Michael Reginald,CAX ; Tencer Michal Stefan,CAX, Packaging system for thermally controlling the temperature of electronic equipment.
  36. Geoffrey O. Heberle, Passively cooled solid-state laser.
  37. Yoneyama, Rei; Harada, Kozo; Oshima, Isao; Otsubo, Yoshitaka; Kawahara, Rena, Semiconductor device and heat-conductive sheet.
  38. Carmona, Manuel; Legen, Anton; Wennemuth, Ingo, Semiconductor device comprising a housing and a semiconductor chip partly embedded in a plastic housing composition, and method for producing the same.
  39. Goodman, Kenneth Randall, Solid state phase change flasking for a downhole tool component.
  40. Chang, Kuang-Yu; Chiou, Ing-Jer, Thermal buffering element.
  41. Bao, Zhongping; Burrell, James D.; Cheng, Liang, Thermal management of integrated circuits using phase change material and heat spreaders.
  42. Weaver, Matthew; Kingman, James; Ghose, Sanjoy, Thermal storage system using encapsulated phase change materials in LED lamps.
  43. Weaver, Matthew; Kingman, James; Ghose, Sanjoy, Thermal storage system using encapsulated phase change materials in LED lamps.
  44. McComb, Timothy; Di Teodoro, Fabio, Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier.
  45. McComb, Timothy; Di Teodoro, Fabio, Tunable system for generating an optical pulse based on a double-pass semiconductor optical amplifier.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트