이 특허를 인용한 특허 (46)

1. Hoecker, Rainer, Arrangement for using a plate shaped element with through-openings for cooling a component.

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2. Suzuki,Fuminori; Takagi,Akira, Control apparatus having fluid passage for cooling purpose.

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3. Vögerl, Andreas; Bauer, Gerhard; Henniger, Jürgen; Trenner, Uwe; Karrer, Helmut; Wenk, Alexander; Gebhardt, Marion, Control appliance for using in the engine compartment or in the transmission of a motor vehicle and cooling system for such a control appliance.

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4. Dede, Ercan Mehmet; Liu, Yan, Cooling apparatuses and power electronics modules.

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5. Nakahama, Takafumi, Cooling device for heat source.

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6. Jadric, Ivan; Hoover, Stephen M.; Rogers, Kathleen S.; Todd, Michael S., Cooling member.

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7. Jadric, Ivan; Hoover, Steve M.; Rogers, Kathleen S.; Todd, Michael S.; Fox, Mathias R.; Keizer, Christopher J.; Perry, Ronald C.; Boerma, Matthew T.; Warner, Justin D.; Slothower, Scott V.; Muszynski, Julie S.; Laforme, David J., Cooling member.

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8. Kendall Rodney Arthur, Cooling method and apparatus for charged particle lenses and deflectors.

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9. Marmillion Patricia McGuinness ; Palagonia Anthony Michael ; Pierson Bernadette Ann ; Schmidt Dennis Arthur, Cooling method for silicon on insulator devices.

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10. Altshuler,Gregory B.; Caruso,Joseph P.; Zenzie,Henry H.; Burke, III,James G.; Erofeev,Andrei V., Cooling system for a photo cosmetic device.

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11. Altshuler, Gregory B.; Caruso, Joseph P.; Zenzie, Henry H.; Burke, III, James G.; Erofeev, Andrei V., Cooling system for a photocosmetic device.

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12. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.

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13. Schnetzka, Harold R.; Jadric, Ivan; Hoover, Steve; Rogers, Kathleen S.; Yanik, Mustafa Kemel, Cooling systems for variable speed drives and inductors.

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14. Campbell, Levi A.; DeCusatis, Casimer M.; Ellsworth, Jr., Michael J., Coupling metal clad fiber optics for enhanced heat dissipation.

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15. Lee, Rong-Jung, Device and method for removing heat from object by spraying cooling agent.

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16. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.

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17. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus.

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18. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Electronic apparatus including liquid cooling unit.

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19. Weaver, Stanton Earl; De Bock, Hendrik Pieter Jacobus, Electronic device cooling with autonomous fluid routing and method of assembly.

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20. Burward-Hoy Trevor, Electronic package cooling system and heat sink with heat transfer assembly.

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21. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Environmentally isolated enclosure for electronic components.

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22. Peugh, Darrel E.; Myers, Bruce A.; Oberlin, Gary E., Fluid cooled electronic assembly.

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23. Burward-Hoy Trevor, Heat exchanger for electronic equipment.

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24. Przilas Mark B. ; Mimlitch ; III Robert H. ; Bruce Robert A., Hermetic connector for a closed compartment.

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25. Shedd, Timothy A., High efficiency thermal management system.

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26. Bhunia, Avijit; Moffatt, Alex P.; Gardner, Mark R.; Chen, Chung-Lung, High power module cooling system.

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27. Dinh, Khanh, High reliability cooling system for LED lamps using dual mode heat transfer loops.

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28. Azar Kaveh, In-board chip cooling system.

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29. Joshi, Shailesh N., Jet impingement cooling apparatuses having enhanced heat transfer assemblies.

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30. Frey Toni ; Stuck Alexander,CHX ; Zehringer Raymond,CHX, Liquid cooling device for a high-power semiconductor module.

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31. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat exchanger therefor.

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32. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.

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33. Suzuki, Masumi; Aoki, Michimasa; Tsunoda, Yosuke; Ohnishi, Masuo; Hattori, Masahiko, Liquid cooling unit and heat receiver therefor.

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34. Steven N. Roy ; John F. Judge ; Harold R. Schnetzka, Liquid-cooled power semiconductor device heatsink.

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35. Gerald A. Budelman, Method and apparatus for improving the thermal performance of heat sinks.

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36. Bezama, Raschid J.; Natarajan, Govindarajan; Sikka, Kamal K.; Toy, Hilton T., Microjet module assembly.

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37. Bezama, Raschid J.; Natarajan, Govindarajan; Sikka, Kamal K.; Toy, Hilton T., Microjet module assembly.

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38. Edwards Michael Ray ; Morris Garron Koch ; Estes Kurt Arthur ; Pais Martin, Multi-mode, two-phase cooling module.

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39. Karz Robert S. (Webster NY), Parallel flow water cooling system for printbars.

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40. Robertson James R. ; Parkhill Scott Thomas ; Staton Tim M., Reservoir apparatus for an electronically controlled electric pump.

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41. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.

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42. Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.

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43. Glezer, Ari; Mahalingam, Raghavendran; Heffington, Samuel, Synthetic jet heat pipe thermal management system.

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44. Mahalingam, Raghavendran; Glezer, Ari, Thermal management of batteries using synthetic jets.

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45. Rau, Matthew Joseph; Dede, Ercan Mehmet; Joshi, Shailesh N.; Garimella, Suresh V., Vehicles, power electronics modules and cooling apparatuses with single-phase and two-phase surface enhancement features.

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46. Cummings, Eric Bryant; Moore, Kevin Christopher, Water-cooled photovoltaic receiver and assembly method.

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