$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Heat transfer device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28F-007/00
  • H05K-007/20
출원번호 US-0017402 (1993-02-10)
발명자 / 주소
  • Banks Bruce A. (Olmsted Township
  • Cuyahoga County OH) Gaier James R. (Strongsville OH)
출원인 / 주소
  • The United States of America as represented by the Administrator of the National Aeronautics & Space Administration (Washington DC 06)
인용정보 피인용 횟수 : 55  인용 특허 : 0

초록 ▼

Gas derived graphite fibers generated by the decomposition of an organic gas are joined with a suitable binder. This produces a high thermal conductivity composite material which passively conducts heat from a source, such as a semiconductor, to a heat sink. The fibers may be intercalated. The inter

대표청구항 ▼

A heat transfer device for conducting heat from an element having a first temperature to a copper member having a tapered slot therein and a second temperature lower than said first temperature resulting in a temperature differential comprising an intercalated graphite fiber composite having a hot e

이 특허를 인용한 특허 (55)

  1. Browne James M., Apparatus for making thermally conductive film.
    상세보기
  2. Ingram,Jason W., Conductive heat transfer system and method for integrated circuits.
    상세보기
  3. Zamel,James M.; Wickham,Michael G.; Brosnan,Stephen J., Cooled high power laser lens array.
    상세보기
  4. Hara, Takeo; Iwanaga, Shin-ichiro; Sato, Hozumi; Setaka, Ryoji, Curing composition for forming a heat-conductive sheet, heat-conductive sheet, production thereof and heat sink structure.
    상세보기
  5. Reis, Bradley E.; Smalc, Martin David; Laser, Brian J.; Kostyak, Gary Stephen; Skandakumaran, Prathib; Getz, Matthew G.; Frastaci, Michael, Cycling LED heat spreader.
    상세보기
  6. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Cycling LED heat spreader.
    상세보기
  7. Knowles, Timothy R.; Seaman, Christopher L., Dendritic fiber material.
    상세보기
  8. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.
    상세보기
  9. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards.
    상세보기
  10. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards.
    상세보기
  11. Koon Robert W. ; Steelman Thomas E., Enhanced heat transfer in printed circuit boards and electronic components thereof.
    상세보기
  12. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.
    상세보기
  13. Guy James K., Fiber optic bundle interstitial cooling using heat pipe technology.
    상세보기
  14. Kondo, Daiyu; Sato, Shintaro; Iwai, Taisuke, Graphite structure, electronic component and method of manufacturing electronic component.
    상세보기
  15. Heimerdinger Maro W. ; Connolly Jerome J., Heat blanket buffer assembly.
    상세보기
  16. Lin,Jhy Chain; Chen,Ga Lane, Heat collector.
    상세보기
  17. Krassowski, Daniel W.; Chen, Gary G., Heat dissipating component using high conducting inserts.
    상세보기
  18. Wang, Jack; Cheng, Cheng-Hua; Lin, Michael; Ma, Charles, Heat dissipating device for a CPU.
    상세보기
  19. Slaton, David S.; McDonald, David L., Heat sink and method of forming a heatsink using a wedge-lock system.
    상세보기
  20. Michael Z. Eckblad ; Pardeep K. Bhatti, Heat spreader, electronic package including the heat spreader, and methods of manufacturing the heat spreader.
    상세보기
  21. Reis,Bradley E.; Smalc,Martin David; Laser,Brian J.; Kostyak,Gary Stephen; Skandakumaran,Prathib; Getz,Matthew G.; Frastaci,Michael, Heat spreaders with vias.
    상세보기
  22. Reis, Bradley E.; Cartiglia, James R., Heat spreading circuit assembly.
    상세보기
  23. Arnold Judson V. ; Peoples James R. ; McKague Elbert L., High heat density transfer device.
    상세보기
  24. Mariner John Thomas ; Sayir Haluk, High thermal conductivity composite and method.
    상세보기
  25. Webb, Brent J., High thermal conductivity heat transfer pad.
    상세보기
  26. Rawal Suraj Prakash, High thermal conductivity plugs for structural panels.
    상세보기
  27. De Lorenzo, David S.; Montgomery, Stephen W.; Fite, Robert J., Increasing thermal conductivity of thermal interface using carbon nanotubes and CVD.
    상세보기
  28. Reis,Bradley E.; Cartiglia,James R., LED with integral via.
    상세보기
  29. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
    상세보기
  30. Montgomery, Stephen W.; Aldridge, Tomm V., Method and apparatus for producing aligned carbon nanotube thermal interface structure.
    상세보기
  31. Yao, Yuan; Dai, Feng-Wei; Wang, Ji-Cun; Zhang, Hui-Ling; Wang, You-Sen; Liu, Chang-Hong, Method for making thermal interface material.
    상세보기
  32. Reynolds, III, Robert Anderson; Mercuri, Robert Angelo; Greinke, Ronald Alfred, Method for preparing fuel cell component substrate of flexible graphite material having improved catalytic properties.
    상세보기
  33. Browne James M., Method of making and using thermally conductive joining film.
    상세보기
  34. Li, Jun; Meyyappan, Meyya; Dangelo, Carlos, Nanoengineered thermal materials based on carbon nanotube array composites.
    상세보기
  35. Li,Jun; Meyyappan,Meyya, Nanoengineered thermal materials based on carbon nanotube array composites.
    상세보기
  36. Koning, Paul A.; White, Bryan M., Nanotube modified solder thermal intermediate structure, systems, and methods.
    상세보기
  37. Koning,Paul A.; White,Bryan M., Nanotube modified solder thermal intermediate structure, systems, and methods.
    상세보기
  38. Dubin, Valery M.; Dory, Thomas S., Packaging of integrated circuits with carbon nano-tube arrays to enhance heat dissipation through a thermal interface.
    상세보기
  39. Dubin, Valery M; Dory, Thomas S., Packaging of integrated circuits with carbon nanotube arrays to enhance heat dissipation through a thermal interface.
    상세보기
  40. Norley,Julian; Brady,John Joseph; Getz, Jr.,George; Klug,Jeremy, Resin-impregnated flexible graphite articles.
    상세보기
  41. Brunnbauer, Markus; Fink, Markus; Jetten, Hans-Gerd, Semiconductor module having a semiconductor chip stack and method.
    상세보기
  42. Brunnbauer, Markus; Fink, Markus; Jetten, Hans-Gerd, Semiconductor module having a semiconductor chip stack and method.
    상세보기
  43. Steiner, Thomas Walter; Medard de Chardon, Briac; Kanemaru, Takao, Stirling cycle transducer for converting between thermal energy and mechanical energy.
    상세보기
  44. Grip, Robert E.; Rawdon, Blaine K.; Jalewalia, Gurpreet S., Structurally isolated thermal interface.
    상세보기
  45. Steiner, Thomas Walter; Medard de Chardon, Briac; Kanemaru, Takao, Thermal acoustic passage for a stirling cycle transducer apparatus.
    상세보기
  46. Misra, Sanjay, Thermal diffusion apparatus.
    상세보기
  47. Zhang,Yuegang; Garner,C. Michael; Berlin,Andrew A.; Rao,Valluri; White,Bryan M.; Koning,Paul A., Thermal interface apparatus, systems, and methods.
    상세보기
  48. Chen, Ga-Lane; Leu, Charles, Thermal interface material.
    상세보기
  49. Bonneville W. Scott ; Cooney John E. ; Peck Scott O., Thermal interface materials using thermally conductive fiber and polymer matrix materials.
    상세보기
  50. White, Bryan M.; Koning, Paul A.; Zhang, Yuegang; Garner, C. M., Thermal intermediate apparatus, systems, and methods.
    상세보기
  51. White,Bryan M.; Koning,Paul A.; Zhang,Yuegang; Garner,C. Michael, Thermal intermediate apparatus, systems, and methods.
    상세보기
  52. Jewram, Radesh; Misra, Sanjay, Thermally and electrically conductive interconnect structures.
    상세보기
  53. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
    상세보기
  54. Teo, Tat Ming; Chiang, Troy Wy Piew; Zhao, JianBing, Thermally conductive flexible member for heat transfer.
    상세보기
  55. Herzl Alfred, Thermally conductive support structure.
    상세보기

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로