초록 ▼

A container or carrier for securely carrying a substrate such as a reticle, mask, wafer, or the like during a semiconductor manufacturing process or during the transport of the substrate. The container includes a housing having an opening through which the substrate may be inserted and removed. The

A container or carrier for securely carrying a substrate such as a reticle, mask, wafer, or the like during a semiconductor manufacturing process or during the transport of the substrate. The container includes a housing having an opening through which the substrate may be inserted and removed. The housing includes an open box and a lid, the lid securely held in place by a unique latching mechanism. A door that is hinged upon the lid and held in place by biasing springs substantially seals the housing opening. Within the housing are a plurality of suction cups upon which the substrate rests and which apply suction to firmly engage the substrate on only one side when the substrate is in a contained position. The suction cups hold the substrate in the contained position thereby preventing relative motion between the container and the substrate. The invention further provides for increasing the suction applied by the suction cups to the substrate by applying additional suction to modified suction cups from a vacuum pump. The invention also provides a method for securely containing a substrate within a container. The method including the step of fixing the substrate in a contained position within the substrate using suction.

대표청구항 ▼

1. An apparatus for containing a planar substrate, the apparatus comprising: (a) a housing capable of containing a substrate and having an opening through which the substrate may be inserted and removed in a direction substantially parallel to a plane of the substrate; (b) closure means for cove

1. An apparatus for containing a planar substrate, the apparatus comprising: (a) a housing capable of containing a substrate and having an opening through which the substrate may be inserted and removed in a direction substantially parallel to a plane of the substrate; (b) closure means for covering the housing opening to substantially seal a substrate within the housing; and (c) fixing means for supporting a substrate by contacting only a first planar surface of the substrate and for applying suction to only the first planar surface of the substrate to substantially fix the substrate in a contained position within the housing when the substrate is set upon the fixing means. 2. The apparatus of claim 1 wherein the fixing means includes: (a) at least one suction cup positioned within the housing so as to apply suction to and engage the first planar surface of a substrate when the substrate is received in the contained position. 3. The apparatus of claim 2 wherein the fixing means includes: (a) a plurality of suction cups positioned within the housing so as to apply suction to and engage points around a periphery of the first planar surface of a substrate when the substrate is received in the contained position. 4. The apparatus of claim 1 further comprising: (a) at least two support members for supporting a substrate in the contained position; and (b) a plurality of suction cups disposed on the support members so as to apply suction to and engage points around a periphery of the first planar surface of a substrate when the substrate is received in the contained position. 5. The apparatus of claim 1 wherein the housing is: (a) at least partially constructed of an electrically conductive material. 6. The apparatus of claim 1 further comprising: (a) auxiliary suction means for applying additional suction from a vacuum source to the fixing means in order to more securely fix a substrate in the contained position. 7. The apparatus of claim 6 further comprising: (a) auxiliary suction activation means for activating the auxiliary suction means when motion of the housing is detected. 8. The apparatus of claim 6 further comprising: (a) auxiliary suction activation means for activating the auxiliary suction means to provide a minimum level of suction to the fixing means. 9. The apparatus of claim 1 further comprising: (a) a latching means for firmly securing a hinged lid to an open box wherein the hinged lid and the open box together form the housing. 10. In a container or carrier for containing a planar substrate, including a housing capable of containing a substrate and having an opening through which a substrate may be inserted and removed in a direction substantially parallel to a plane of the substrate and a closure means for covering the housing opening to substantially seal a substrate within the housing, the improvement comprising: (a) fixing means for supporting a substrate by contacting only a first planar surface of the substrate and for applying suction to only the first planar surface of the substrate to substantially fix the substrate in a contained position within the housing when the substrate is set upon the fixing means. 11. A method for securely containing a planar substrate, the method comprising the steps of: (a) positioning a substrate within a housing having an opening through which the substrate may be inserted and removed in a direction substantially parallel to a plane of the substrate; (b) covering the housing opening to substantially seal the substrate within the housing; and (c) applying suction to only a first planar surface of the substrate to substantially fix the substrate within the housing. 12. The method of claim 11 wherein the step of applying suction to a first planar surface of the substrate to substantially fix the substrate in a contained position within the housing includes: (a) applying suction to the first planar surface of the substrate with at least one suction cup positioned within the housing. 13. The method of claim 11 wherein the step of applying suction to a first planar surface of the substrate to substantially fix the substrate in a contained position within the housing includes: (a) applying suction with a plurality of suction cups to the first planar surface of the substrate at points around a periphery of the first planar surface of the substrate. 14. The method of claim 11 further comprising the step of: (a) constructing the housing at least partially of an electrically conductive material. 15. The method of claim 11 further comprising the step of: (a) applying additional suction from a vacuum source to the first planar surface of the substrate in order to more securely fix the substrate in the contained position. 16. In a method for securely containing a planar substrate, including the steps of positioning a substrate within a housing having an opening through which the substrate may be inserted and removed in a direction substantially parallel to a plane of the substrate and covering the housing opening to substantially seal the substrate within the housing, the improvement comprising: (a) applying suction to only a first planar surface of the substrate to substantially fix the substrate within the housing.