Printed circuit board for an injection molding apparatus
IPC분류정보
국가/구분
United States(US) Patent
등록
국제특허분류(IPC7판)
B29C-045/20
B29C-045/78
출원번호
US-0988863
(1992-12-10)
발명자
/ 주소
Schmidt, Harald
출원인 / 주소
Husky Injection Molding Systems Ltd.
대리인 / 주소
Bachman & LaPointe
인용정보
피인용 횟수 :
21인용 특허 :
3
초록▼
An injection molding station includes a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board associated with the mold manifold plate; and a power source; wherein the at least one pr
An injection molding station includes a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board associated with the mold manifold plate; and a power source; wherein the at least one printed circuit board electrically connects the power source with the heaters. Each printed circuit board has at least one power layer printed with a plurality of power supply tracks, the power supply tracks being connected at a first end to the power source and at a second end to a respective heater. Each nozzle may also have a respective temperature sensing device, the printed circuit board having at least one sensor layer printed with sensor tracks, the sensor tracks being connected at a first end to a respective temperature sensing device, and at a second end to a controlling device.
대표청구항▼
1. An injection molding apparatus, comprising: a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board, associated with the mold manifold plate; a power source; wherein the at l
1. An injection molding apparatus, comprising: a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board, associated with the mold manifold plate; a power source; wherein the at least one printed circuit board electrically connects the power source with the heaters; and wherein the at least one printed circuit board comprises at least one power layer printed with a plurality of power supply tracks, each power supply track being connected at a first end to the power source and at a second end to a respective housing heater. 2. An injection molding apparatus according to claim 1, wherein the at least one printed circuit board is mounted to the mold manifold plate. 3. An injection molding apparatus according to claim 1 wherein the at least one printed circuit board comprises layers made from a polyimide material. 4. An injection molding apparatus according to claim 1, wherein the printed circuit board is coated with a conformal coating operative to protect the at least one printed circuit board from gases generated during an injection molding process. 5. An injection molding apparatus comprising: a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board, associated with the mold manifold plate; a power source; wherein the at least one printed circuit board electrically connects the power source with the housing heaters; wherein the mold manifold plate has a front face, the at least one printed circuit board being mounted to the front face of the mold manifold plate whereby the at least one printed circuit board is servicable without disassembling the injection molding apparatus; and wherein the mold manifold plate has at least one circuit board channel formed in the front face, the at least one printed circuit board being mounted in the at least one circuit board channel. 6. An injection molding apparatus according to claim 5 wherein the mold manifold plate has additional channels formed therein between the heaters and the at least one circuit board channel, a connector for each heater being disposed in an additional channel and connected to the at least one printed circuit board. 7. An injection molding apparatus, comprising: a mold manifold plate housing a plurality of injection molding nozzles and housing heaters for the plurality of injection molding nozzles; at least one printed circuit board, associated with the mold manifold plate; a power source; wherein the at least one printed circuit board electrically connects the power source with the housing heaters; wherein each nozzle of the plurality of injection molding nozzles has a respective housing heater and further has a respective temperature sensing means whereby the temperature of each nozzle is monitored; and wherein the at least one printed circuit board comprises at least one power layer printed with a plurality of power supply tracks and at least one sensor layer printed with a plurality of sensor tracks, each power supply track being connected at a first end to the power source and at a second end to a respective housing heater, each sensor track being connected at a first end to a respective one of said temperature sensing means, and at a second end to a controlling means for receiving input from sensor tracks and controlling power supplied to said power supply tracks. 8. An injection molding apparatus according to claim 7, wherein the temperature sensing means is a plurality of resistance temperature detectors. 9. An injection molding apparatus according to claim 7, wherein the controlling means is an integral element of the at least one printed circuit board. 10. An injection molding apparatus according to claim 7, wherein the temperature sensing means is a plurality of thermocouples each having a junction disposed at a respective injection molding nozzle and wherein the sensor tracks are thermocouple wires. 11. An injection molding apparatus according to claim 10 wherein a heater and a thermocouple for each injection molding nozzle are disposed in the mold manifold plate and electrically connected to plug means for connection to the printed circuit board. 12. An injection molding apparatus according to claim 11, wherein the plug means comprises a plurality of two piece connectors, each two piece connector having a fixed plug and a movable plug, the fixed plug being mounted to the printed circuit board through a first pair of conductive pins contacting a respective pair of power supply tracks and a second pair of conductive pins contacting a respective pair of sensor tracks, the movable plug being connected to the heater and thermocouple of a respective nozzle. 13. An injection molding apparatus according to claim 12 wherein the fixed plug and movable plug of each two piece connector are releasably joined at a conductive pin connection. 14. An injection molding apparatus according to claim 13 wherein at least one of each first pair of conductive pins, second pair of conductive pins and conductive pin connection includes means for protecting from attack of gasses generated during injection molding. 15. An injection molding apparatus according to claim 14, wherein the protecting means includes a gold plating applied to each first pair of conductive pins, second pair of conductive pins and conductive pin connection. 16. An injection molding apparatus according to claim 11 wherein the mold manifold plate has a plurality of wells for accommodating each injection molding nozzle, the respective heater and temperature sensing means for each nozzle being disposed in a respective well of the plurality of wells. 17. An injection molding apparatus according to claim 16 wherein the mold manifold plate has a rear face and at least one manifold channel formed in the rear face and intersecting the plurality of wells, the system further including at least one manifold disposed in the at least one manifold channel, the injection molding nozzles being connected to the manifold in alignment with the wells of the mold manifold plate, the manifold further having a melt channel for conveying material to be injection molded from a source of the material to the injection molding nozzles. 18. An injection molding apparatus comprising: a plurality of injection molding nozzles for injection molding molten plastic material; a plurality of heaters associated with the plurality of injection molding nozzles for heating the plurality of injection molding nozzles and the molten plastic material therein; a power source for the plurality of heaters; at least one printed circuit board associated with the power source and the plurality of heaters and electrically connecting the power source with the plurality of heaters; and wherein the at least one printed circuit board includes at least one power layer printed thereon with at least one power supply track, the at least one power supply track being connected at a first location to the power source and at a second location to a respective heater. 19. An injection molding apparatus according to claim 18 further including at least one of a mold manifold plate and a mold cavity plate, wherein the printed circuit board is associated with at least one of the mold manifold plate and the mold cavity plate. 20. An injection molding apparatus according to claim 19 wherein the printed circuit board is mounted to at least one of the mold manifold plate and the mold cavity plate. 21. An injection molding apparatus according to claim 20 wherein the mold manifold plate has a front face, the at least one printed circuit board being mounted to the front face of the mold manifold plate whereby the at least one printed circuit board is serviceable without disassembling the injection molding apparatus. 22. An injection molding apparatus according to claim 19 wherein said printed circuit board is mounted in at least one circuit board channel formed on at least one of said mold manifold plate and mold cavity plate. 23. An injection molding apparatus comprising: a plurality of injection molding nozzles for injection molding molten plastic material; a plurality of heaters associated with the plurality of injection molding nozzles for heating the plurality of injection molding nozzles and the molten plastic material therein; a power source for the plurality of heaters; a temperature sensing means for each nozzle whereby the temperature of each nozzle is monitored; and at least one printed circuit board associated with the temperature sensing means, said printed circuit board including at least one sensor layer printed with a plurality of sensor tracks, each sensor track being connected at a first location to a respective one of said temperature sensing means and at a second location to a controlling means for receiving input from the sensor tracks. 24. An injection molding apparatus according to claim 23 wherein the temperature sensing means is a plurality of thermocouples each having a junction disposed at a respective injection molding nozzle. 25. An injection molding apparatus according to claim 23 further including at least one of a mold manifold plate and a mold cavity plate, wherein the printed circuit board is associated with at least one of the mold manifold plate and the mold cavity plate. 26. An injection molding apparatus according to claim 25 wherein the printed circuit board is mounted to at least one of the mold manifold plate and the mold cavity plate.
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이 특허에 인용된 특허 (3)
Hinz Edward W. (Schiller Park IL), Electric heater construction.
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