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Liquid metal heat conducting member and integrated circuit package incorporating same 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0040732 (1993-03-31)
발명자 / 주소
  • Layton Wilbur T. (San Diego CA) Morange Blanquita O. (San Diego CA) Torres Angela M. (Vista CA)
출원인 / 주소
  • Unisys Corporation (Blue Bell PA 02)
인용정보 피인용 횟수 : 51  인용 특허 : 0

초록 ▼

An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as includi

대표청구항 ▼

An integrated circuit package which is comprised of an integrated circuit chip, a substrate which holds said chip, and a heat conduction mechanism coupled to said chip which provides a path for conducting heat from said chip to a fluid mechanism, wherein said heat conduction mechanism further includ

이 특허를 인용한 특허 (51)

  1. Martin, Yves; Van Kessel, Theodore G., Active liquid metal thermal spreader.
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  2. Martin,Yves; Van Kessel,Theodore G., Active liquid metal thermal spreader.
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  3. Pierson Mark V. ; Spink ; Jr. Kenneth L. ; Youngs ; Jr. Thurston B., Advanced chip packaging structure for memory card applications.
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  4. Johnson James E. ; Darcy Ronald J., Apparatus capable of high power dissipation during burn-in of a device under test.
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  5. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
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  6. Thomas H. DiStefano ; Zlata Kovac ; John W. Smith, Bondable compliant pads for packaging of a semiconductor chip and method therefor.
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  7. Freeland Mark, Bonding material and phase change material system for heat burst dissipation.
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  8. Johnson, James E.; Darcy, Ronald J., Burn-in board with adaptable heat sink device.
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  9. Humfeld, Keith Daniel; Shewchuk, Steven Michael, Controlling the heating of a composite part.
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  10. Kauppila, Richard W.; Kauppila, Raymond W., Cooling arrangement for conveyors and other applications.
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  11. Craig G. Heim ; Wade Leslie Hooker ; Ajit Kumar Trivedi, Cooling method for electronic components.
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  12. Heim Craig G. ; Hooker Wade Leslie ; Trivedi Ajit Kumar, Cooling structure for electronic components.
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  13. Daves Glenn G. ; Edwards David L., Customizable lid for improved thermal performance of modules using flip chips.
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  14. Knowles, Timothy R.; Seaman, Christopher L., Dendritic fiber material.
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  15. Knowles,Timothy R.; Seaman,Christopher L., Dendritic fiber material.
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  16. Refai-Ahmed, Gamal; Ramalingam, Suresh; Elftmann, Daniel; Philofsky, Brian D.; Torza, Anthony, Dynamic mounting thermal management for devices on board.
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  17. Deeney Jeffrey L., Electrically conductive thermal interface.
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  18. Knowles,Timothy R.; Seaman,Christopher L., Fiber adhesive material.
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  19. Mornet, Eric; Roucoules, Christine, Heat exchange device.
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  20. Queheillalt,Douglas T.; Wadley,Haydn N. G.; Katsumi,Yasushi, Heat exchange foam.
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  21. Bivona Kevin G. ; Coffin Jeffrey T. ; Drofitz ; Jr. Stephen S. ; Goldmann Lewis S. ; Interrante Mario J. ; Iruvanti Sushumna ; Sherif Raed A., Hermetic CBGA/CCGA structure with thermal paste cooling.
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  22. Calmidi, Varaprasad V.; Johnson, Eric A.; Stutzman, Randall J., Liquid metal thermal interface for an electronic module.
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  23. Macris, Chris; Sanderson, Thomas R.; Ebel, Robert G., Liquid metal thermal interface material system.
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  24. Deng, Tao; Wetzel, Todd Garrett; de Bock, Hendrik Pieter Jacobus; Russ, Boris Alexander, Locking device and method for making the same.
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  25. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Mesh structure to avoid thermal grease pump-out in integrated circuit heat sink attachments.
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  26. Fann, Yuan-Chang; Chen, Chun-Mu; Wong, Cheng-Chou; Tu, Chih-Tsung; Hwang, Jen-Dong, Metal thermal interface material and thermal module and packaged microelectronic component containing the material.
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  27. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
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  28. Senyk, Borys S.; Moresco, Larry L., Method and an apparatus for cooling a computer.
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  29. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
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  30. Senyk,Borys S.; Moresco,Larry L., Method and an apparatus for cooling a computer.
    상세보기
  31. Chiu Chia-Pin ; Sharaf Nadir ; Solbrekken Gary ; Cooks Correy D., Method for an integrated circuit thermal grease mesh structure.
    상세보기
  32. Jairazbhoy Vivek Amir ; Todd Michael George ; Reddy Prathap Amerwai, Method for cooling electronic components.
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  33. Babcock, James Wittman; Tustaniwskyj, Jerry Ihor; Morange, Blanquita Ortega, Method of fabricating a heat exchanger, for regulating the temperature of multiple integrated circuit modules, having a face of a solid malleable metal coated with a release agent.
    상세보기
  34. Daves Glenn G. ; Edwards David L., Methods for customizing lid for improved thermal performance of modules using flip chips.
    상세보기
  35. Smith John W., Methods of making microelectronic connections with liquid conductive elements.
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  36. Smith John W., Methods of making microelectronic corrections with liquid conductive elements.
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  37. John W. Smith, Microelectronic connections with liquid conductive elements.
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  38. Smith John W., Microelectronic connections with liquid conductive elements.
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  39. Smith, John W., Microelectronic connections with liquid conductive elements.
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  40. Richard F. Hill ; Forest Hampton, III, Multi-layer structure and method for forming a thermal interface with low contact resistance between a microelectronic component package and heat sink.
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  41. Hill, Richard F.; Strader, Jason L., Multi-layer structure having a thermal interface with low contact resistance between a microelectronic component package and a heat sink.
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  42. Kim, Joo Han; Kirk, Graham Charles; Labhart, Jay Todd; Shah, Binoy Milan; Utturkar, Yogen Vishwas; Charmarthy, Pramod; Deng, Tao, Reusable phase-change thermal interface structures.
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  43. Ihara, Takumi; Mouri, Masami, Semiconductor device.
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  44. Chiu, Chia-Pin; Shipley, James C.; Simmons, Craig B., Short carbon fiber enhanced thermal grease.
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  45. Cheon,Kioan, Soft cooling jacket for electronic device.
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  46. Viswanath, Ram S., Thermal design for minimizing interface in a multi-site thermal contact condition.
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  47. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
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  48. Dias,Rajen C.; Liu,Yongmei, Thermal interface apparatus, systems, and fabrication methods.
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  49. Solbrekken, Gary L.; Simmons, Craig B.; Chiu, Chia-Pin, Thermal interface material on a mesh carrier.
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  50. Bhagwagar, Dorab Edul, Thermal interface materials and methods for their preparation and use.
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  51. Choong-Un Kim ; Seung-Mun You, Thermal joint and method of use.
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