[특허]Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device

Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	B29C-045/02 B29C-045/56
출원번호	US-0904469 (1992-06-25)
발명자 / 주소	Fierkens Richard H. J. (Keurbeck 15 6914 Ae Herwen NLX)
인용정보	피인용 횟수 : 26 인용 특허 : 0

초록 ▼

A molding apparatus having variable-volume cavities is provided. The apparatus consists of a lower and an upper mold defining a cavity for the lead frame, and having a conduit for forcing fluid plastic from a reservoir to the cavity for encapsulating an integrated circuit bonded to a lead frame. A pressure source is used to force the plastic from the reservoir through the conduit into both the upper and lower portions of the cavity surrounding the lead frame. The cavity of the mold is equipped with at least one piston-like insert slideably mounted in a bore hole in the surface of the cavity. The insert can be compressed or expanded to reduce or increase, respectively, the volume of the cavity. Thus, the final size of the cavity in the mold is determined by the position of the insert at the end of the encapsulation process. By allowing the expansion of the insert during a first phase of the molding operation, excess plastic is forced into the cavity. During a second phase, the volume of the cavity is reduced to its final size by the application of back pressure on the insert, causing the excess molten plastic to be forced out of the cavity together with residual air bubbles trapped in the plastic.

대표청구항 ▼

A compression-cavity mold for encapsulating a thin-package integrated circuit lead frame in plastic, comprising: a plastic-package mold assembly comprising an integral lower mold defining a lower cavity that includes shallow impressions wherein the integrated circuit lead frame is placed and comprising an integral upper mold defining an upper cavity, said upper mold being adapted for placement on said lower mold; a reservoir for the plastic material used in the mold assembly; a conduit in said mold assembly connecting said reservoir to said upper cavity and said lower cavity, so that plastic in said reservoir has a path of travel through said conduit and into both said upper and lower cavities; first pressure means for forcing the plastic in said reservoir through said conduit and into said upper and lower cavities; a bore hole in at least one of said integral upper and lower molds, said bore hole being coaxial with the lead frame and extending outwardly from the cavity associated with said at least one of said integral upper and lower molds; an insert slideably mounted in said bore hole, said insert consisting of a body having the same cross-sectional shape as the cross-sectional shape of the bore hole and having an inner surface that matches the intended shape of the cavity associated with said at least one of said upper and lower molds, and said insert being adapted for inward movement with respect to said mold associated with said bore hole in response to a pressure exerted on the insert, so that the position of the insert in the bore hole defines the thickness of the plastic forced into the mold assembly by said first pressure means; and second pressure means applied directly to said insert for causing the insert to slide inwardly with respect to said mold associated with said bore hole, thereby forcing excess plastic in said upper and lower cavities to flow through said conduit back into said reservoir, so that the thickness of the plastic forced into the mold assembly by said first pressure means can be reduced to a predetermined final thickness desired for the package of the integrated circuit lead frame.

이 특허를 인용한 특허 (26)

Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Apparatus for circuit encapsulation.
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Tanaka, Yasuo; Matsumoto, Jiro, Apparatus for making semiconductor device.
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Seng, Jimmy Chew Hwee; Xia, Dingwei, Apparatus for molding a semiconductor wafer and process therefor.
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John R. Saxelby, Jr. ; Walter R. Hedlund, III, Circuit encapsulation.
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Saxelby, Jr., John R.; Hedlund, III, Walter R., Circuit encapsulation.
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Hao, Ji Yuan; Ong, See Yap; Su, Jian Xiong; Kuah, Teng Hock; Chiw, Ee Ling, Compression molding of an electronic device.
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Centofante Charles A., Electronic device encapsulated directly on a substrate.
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Centofante, Charles A., Electronic device encapsulated directly on a substrate.
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Centofante Charles A., Injection molding encapsulation for an electronic device directly onto a substrate.
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Boutin Lynda,CAX ; Letourneau Martial A.,CAX ; Tetreault Real,CAX, Integrated circuit chip package.
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Chow, Seng Guan; Huang, Rui; Kuan, Heap Hoe, Integrated circuit package system with wire-in-film encapsulation.
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Yoshiike, Kazuaki, Lead frame for resin sealed semiconductor device.
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Manzione Louis T. (Summit NJ) Weld John D. (Succasunna NJ), Method of encapsulating large substrate devices using reservoir cavities for balanced mold filling.
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Yoshiike, Kazuaki, Method of forming the resin sealed semiconductor device using the lead frame.
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Centofante Charles A., Mold for injection molding encapsulation over small device on substrate.
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Rho Hee Sun,KRX ; Choi Hee Kook,KRX ; Cho In Sik,KRX ; Park Tae Sung,KRX, Mold for semiconductor packages.
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Yoshiike, Kazuaki, Molding apparatus for use in manufacture of resin shielding semiconductor device.
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Maekawa, Masanori; Takahashi, Tomokazu, Molding die set and resin molding apparatus having the same.
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Fumio Miyajima JP, Resin molding machine.
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Ogata,Kenji; Nishiguchi,Masashi; Mitsui,Yoshihiro, Resin sealing mold and resin sealing method.
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Ogata,Kenji; Nishiguchi,Masashi; Mitsui,Yoshihiro, Resin sealing mold and resin sealing method.
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Chou, Ta-Te; Zhang, Xiong-Jie; Li, Xian; Fu, Hai; Tian, Yong-Qi, Semiconductor device and method for manufacturing a semiconductor device.
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Farnworth, Warren M., Systems and methods for compressing an encapsulant adjacent a semiconductor workpiece.
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Boutin Lynda,CAX ; Letourneau Martial A.,CAX ; Tetreault Real,CAX, Transfer molding method for forming integrated circuit package.
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John J. Lajza, Jr. ; Charles R. Ramsey ; Robert M. Smith, Ultra mold for encapsulating very thin packages.
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Lajza ; Jr. John J. ; Ramsey Charles R. ; Smith Robert M., Ultra mold for encapsulating very thin packages.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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연합인증

Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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연합인증

Compression-cavity mold for plastic encapsulation of thin-package integrated circuit device 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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이 특허를 인용한 특허 (26)

관련 콘텐츠

특허 원문 보기

IPC 상위 출원인

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