이 특허를 인용한 특허 (72)

1. Tsai Ken ; Ghanayem Steve ; Yudovsky Joseph ; Lai Ken, Anti-notch thinning heater.

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2. Tsai Kenneth ; Yudovsky Joseph ; Ghanayem Steve ; Lai Ken K. ; Liu Patricia ; Nakagawa Toshiyuki,JPX ; Mahajani Maitreyee, Apparatus and method for aligning and controlling edge deposition on a substrate.

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3. Tsai Kenneth ; Yudovsky Joseph ; Ghanayem Steve ; Lai Ken K. ; Liu Patricia ; Nakagawa Toshiyuki,JPX ; Mahajani Maitreyee, Apparatus and method for aligning and controlling edge deposition on a substrate.

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4. Ngan Kenny King-Tai (Fremont CA) Marohl Dan (San Jose CA), Apparatus and method for cooling a substrate.

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5. Yasuhara, Hideki; Bandoh, Akira, Apparatus and method for manufacturing compound semiconductor, and compound semiconductor manufactured thereby.

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6. Ling Chen ; Joseph Yudovsky ; Ying Yu ; Lawrence C. Lei, Apparatus for aligning a wafer.

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7. Zhao Jun ; Sajoto Talex ; Selyutin Leonid ; Dornfest Charles ; Wolff Stefan ; Luo Lee ; Juco Eller, Apparatus for ceramic pedestal and metal shaft assembly.

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8. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W. ; Lane Lawrence C. ; McInerney Edward John, Apparatus for preventing deposition on frontside peripheral region and edge of wafer in chemical vapor deposition appar.

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9. Tong, Jose; Lenz, Eric H., Apparatus for reducing polymer deposition on a substrate and substrate support.

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10. Tong,Jose; Lenz,Eric H, Apparatus for reducing polymer deposition on a substrate and substrate support.

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11. Kennedy William S. ; Wicker Thomas E. ; Maraschin Robert A. ; Cook Joel M. ; Schoepp Alan M., Apparatus for reducing polymer deposition on substrate support.

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12. van de Ven Everhardus P. (Saratoga CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (Saratoga CA) Chin Barry L. (Saratoga CA) Burkhart Christopher W. (Los Gatos CA), Apparatus for supporting a substrate and introducing gas flow doximate to an edge of the substrate.

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13. Mizukami Masami,JPX ; Mochizuki Takashi,JPX ; Kawano Yumiko,JPX, CVD film forming method in which a film formation preventing gas is supplied in a direction from a rear surface of an object to be processed.

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14. Mizukami Masami,JPX ; Mochizuki Takashi,JPX ; Kawano Yumiko,JPX, CVD film forming method in which a film formation preventing gas is supplied in a direction from a rear surface of an object to be processed.

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15. Sinha Ashok ; Chang Mei ; Perlov Ilya ; Littau Karl A. ; Morrison Alan F. ; Lei Lawrence Chung-Lai, Chemical vapor deposition of a thin film onto a substrate.

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16. Lee Ray,TWX ; Lin Shih-Po,TWX ; Ho Jim,TWX ; Lin Ming-Hong,TWX, Clamp for affixing a wafer in an etching chamber.

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17. Reynoldson, Ray William, Duplex surface treatment of metal objects.

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18. Jones Phillip Lawrence ; Jafarian-Tehrani Seyed Jafar ; Atlas Boris V. ; Liu David R-Chen ; Tokunaga Ken Edward ; Chen Ching-Hwa, Dynamic feedback electrostatic wafer chuck.

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19. Moslehi, Mehrdad M.; Davis, Cecil J., Edge sealing structure for substrate in low-pressure processing environment.

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20. Woodruff Daniel J. ; Hanson Kyle M., Electroplating reactor including back-side electrical contact apparatus.

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21. Woodruff, Daniel J.; Hanson, Kyle M.; Batz, Jr., Robert W.; Kuechmann, James T., Electroplating reactor including back-side electrical contact apparatus.

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22. Woodruff, Daniel J.; Hanson, Kyle M.; Batz, Jr., Robert W.; Kuechmann, James T., Electroplating reactor including back-side electrical contact apparatus.

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23. Maraschin Robert ; Shufflebotham Paul Kevin ; Barnes Michael Scott, Electrostatic clamp with lip seal for clamping substrates.

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24. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W. ; Lane Lawrence C., Exclusion guard and gas-based substrate protection for chemical vapor deposition apparatus.

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25. Tae Kyung Won ; Quanyuan Shang ; Robert M. Robertson ; Soo Young Choi KR; Kam S. Law ; Robert I. Greene ; John M. White, Film deposition using a finger type shadow frame.

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26. van de Ven Everhardus P. ; Broadbent Eliot K. ; Benzing Jeffrey C. ; Chin Barry L. ; Burkhart Christopher W., Gas-based substrate deposition protection.

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27. Zheng, Hui; Tsai, Kenneth; Wang, Hong; He, Yongxiang; Garcia, III, Jesus G.; Deyo, Daniel M., Guard for electrostatic chuck.

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28. Semyon Sherstinsky ; Alison Gilliam ; Paul Smith ; Leonel A. Zuniga ; Ted Yoshidome ; Nitin Khurana ; Rod Mosely ; Umesh Madhav Kelkar ; Joseph Yudovsky ; Alan Popiolkowski, Heater for processing chamber.

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29. Umotoy Salvador P. ; Morrison Alan F. ; Littau Karl A. ; Marsh Richard A. ; Lei Lawrence Chung-Lai ; DuBois Dale, Heater with shadow ring and purge above wafer surface.

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30. Stevens Joe ; Grunes Howard ; Kogan Igor, High aspect ratio clamp ring.

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31. Benjamin Neil ; Hylbert Jon ; Mangano Stefano, High flow vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and.

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32. Rasheed, Muhammad M.; Iwashita, Teruki; Otake, Hiroshi; Koga, Yuki; Maehara, Kazutoshi; Chen, Xinglong; Gondhalekar, Sudhir; Lubomirsky, Dmitry, Low profile process kit.

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33. Hong, Sukwon; Tran, Toan; Mallick, Abhijit; Liang, Jingmei; Ingle, Nitin K., Low shrinkage dielectric films.

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34. Shufflebotham Paul Kevin ; Barnes Michael Scott, Low voltage electrostatic clamp for substrates such as dielectric substrates.

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35. Cho, Sung Kil; Kim, Hai Won; Woo, Sang Ho; Shin, Seung Woo; Jang, Gil Sun; Oh, Wan Suk, Method and apparatus for manufacturing three-dimensional-structure memory device.

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36. Joseph Yudovsky ; Tom Madar ; Salvador Umotoy ; Son Ngoc Trinh ; Lawrence C. Lei ; Anzhong (Andrew) Chang ; Xiaoxiong (John) Yuan, Method and apparatus for preventing edge deposition.

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37. Treichel Helmuth ; Ravkin Michael ; Anderson Don ; de Larios John M., Method and apparatus for removal of thin films from wafers.

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38. Chen Ling ; Yudovsky Joseph ; Yu Ying ; Lei Lawrence C., Method for aligning a wafer.

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39. Comita Paul B. ; Carlson David K. ; Riley Norma B. ; Fan Doria W. ; Ranganathan Rekha, Method for heating exhaust gas in a substrate reactor.

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40. Thomas Michael E. (Milpitas CA) van de Van Everhardus P. (Cupertino CA) Broadbent Eliot K. (San Jose CA), Method for preventing substrate backside deposition during a chemical vapor deposition operation.

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41. Miura, Tatsuhiko, Method of manufacturing semiconductor device.

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42. Tzu, Gwo-Chuan; Yuan, Xiaoxiong; Khandelwal, Amit; Wang, Benjamin Cheng; Gelatos, Avgerinos V.; Wu, Kai; Karazim, Michael P.; Lin, Jing; Cuvalci, Olkan, Methods and apparatus for thermal based substrate processing with variable temperature capability.

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43. Husain Anwar, Multilayered electrostatic chuck and method of manufacture thereof.

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44. Castro Edward Ross ; Tokunaga Ken Edwin ; Atlas Boris V. ; Liu David Ru-Chen, Negative offset bipolar electrostatic chucks.

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45. James Ashe GB; Christopher David Phillips GB; Stuart Speakman GB; Andrew Lee GB, Passivation of ink jet print heads.

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46. Kenney, Mark D., Perimeter seal for backside cooling of substrates.

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47. Kagami, Tsuyoshi; Irino, Osamu; Kato, Nobuyuki; Ushikawa, Harunori, Purge gas assembly.

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48. Rocha-Alvarez, Juan Carlos; Chen, Chen-An; Yieh, Ellie; Venkataraman, Shankar, Purge heater design and process development for the improvement of low k film properties.

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49. Benjamin Neil ; Mangano Stefano ; Jewett Russell, Scalable helicon wave plasma processing device with a non-cylindrical source chamber having a serpentine antenna.

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50. Yudovsky, Joseph; Lei, Lawrence C.; Umotoy, Salvador; Madar, Tom; Dixit, Girish; Tzu, Gwo-Chuan, Self aligning non contact shadow ring process kit.

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51. Yudovsky, Joseph; Lei, Lawrence C.; Umotoy, Salvador; Madar, Tom; Dixit, Girish; Tzu, Gwo-Chuan, Self aligning non contact shadow ring process kit.

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52. Marohl Dan A. ; Rosenstein Michael, Semiconductor wafer alignment member and clamp ring.

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53. Du Bois, Dale R.; Ayoub, Mohamad A.; Kim, Robert; Bansal, Amit; Fodor, Mark; Nguyen, Binh; Cheng, Siu F.; Yu, Hang; Chan, Chiu; Balasubramanian, Ganesh; Padhi, Deenesh; Rocha, Juan Carlos, Shadow ring for modifying wafer edge and bevel deposition.

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54. Moslehi Mehrdad M. ; Davis Cecil J., Substrate edge seal and clamp for low-pressure processing equipment.

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55. Yamaguchi, Takahiro, Substrate processing apparatus.

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56. Semyon Sherstinsky ; Calvin Augason ; Leonel A. Zuniga ; Jun Zhao ; Talex Sajoto ; Leonid Selyutin ; Joseph Yudovsky ; Maitreyee Mahajani ; Steve G. Ghanayem ; Tai T. Ngo ; Arnold Kholodenk, Substrate support member for a processing chamber.

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57. Goodman, Matt G.; Stoutyesdijk, Jereon; Aggarwal, Ravinder; Halpin, Mike; Keeton, Tony; Hawkins, Mark; Haen, Lee; Ferro, Armand; Brabant, Paul; Vyne, Robert; Bartlett, Gregory M.; Italiano, Joseph P.; Haro, Bob, Substrate support system for reduced autodoping and backside deposition.

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58. Goodman, Matt G.; Stoutyesdijk, Jereon; Aggarwal, Ravinder; Halpin, Mike; Keeton, Tony; Hawkins, Mark; Haen, Lee; Ferro, Armand; Brabant, Paul; Vyne, Robert; Bartlett, Gregory M.; Italiano, Joseph P.; Haro, Bob, Substrate support system for reduced autodoping and backside deposition.

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59. Volfovski, Leon; Kulkarni, Mayur G., Substrate support with heater.

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60. Fujikawa, Takashi; Ishibashi, Masayuki; Iriguchi, Kazuhiro; Kawano, Kouhei, Susceptor for vapor phase epitaxial growth device.

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61. Moslehi, Mehrdad M., Thermally conductive chuck for vacuum processor.

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62. Mehrdad M. Moslehi, Thermally conductive chuck with thermally separated sealing structures.

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63. Moslehi Mehrdad M., Two-stage sealing system for thermally conductive chuck.

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64. Benjamin Neil ; Hylbert Jon ; Mangano Stefano, Universal vacuum chamber including equipment modules such as a plasma generating source, vacuum pumping arrangement and.

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65. Yao Tse-Yong ; Thompson Allen ; Ding Peijun ; Hong Richard, Use of tapered shadow clamp ring to provide improved physical vapor deposition system.

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66. Comita Paul B. ; Carlson David K. ; Riley Norma B. ; Fan Doria W. ; Ranganathan Rekha, Vented lower liner for heating exhaust gas from a single substrate reactor.

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67. Yeh, Su-Yu; Yang, Huai-Tei; Pan, Cheng-Yang; Lai, Jun-Yang, Wafer chuck for producing an inert gas blanket and method for using.

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68. Restaino Darryl D. ; Rossnagel Stephen Mark ; Simon Andrew Herbert ; Smetana Pavel ; Cooney ; III Edward C., Wafer clamp ring for use in an ionized physical vapor deposition apparatus.

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69. Chen, Xinglong; Liu, Dali; Jang, Sung-Ho; Lim, Yong-Ho, Wafer clamping apparatus.

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70. Chen Aihua ; Littau Karl A. ; Zhou Dashun S., Wafer edge deposition elimination.

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71. Chen Aihua ; Littau Karl A. ; Zhou Dashun S., Wafer edge deposition elimination.

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72. van de Ven Everhardus P. (Cupertino CA) Broadbent Eliot K. (San Jose CA) Benzing Jeffrey C. (San Jose CA) Chin Barry L. (Sunnyvale CA) Burkhart Christopher W. (San Jose CA), Wafer surface protection in a gas deposition process.

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