$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0829358 (1992-01-30)
우선권정보 EP-0200392 (1991-02-25)
발명자 / 주소
  • Leyssens Francois J. C. (Mortsel BEX) Rombouts Hendrikus M. J. (Zoersel BEX)
출원인 / 주소
  • Alcatel N.V. (Amsterdam NLX 03)
인용정보 피인용 횟수 : 73  인용 특허 : 0

초록

A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, includes a heat exchanger for delivering heat to a

대표청구항

A cooling system for a plurality of circuit boards, each circuit board having a substantially planar thermally conductive thermal sink having longitudinal sides and being in thermal contact with a plurality of electronic components dissipating heat, said cooling system including: a heat exchanger fo

이 특허를 인용한 특허 (73)

  1. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  2. Yatskov,Alexander I., Apparatuses and methods for cooling electronic devices in computer systems.
  3. Yatskov,Alexander I., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  4. Yatskov,Alexander I.; Hellriegel,Stephen V. R., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  5. Yatskov,Alexander I.; Hellriegel,Stephen V.R., Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures.
  6. Azar, Kaveh, Cabinet cooling with heat pipe.
  7. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert; Taubert, Tomasz, Cable interface for electronic equipment enclosure.
  8. Tavassoli,Kamran; Porreca,Paul J.; Sullivan,Robert C., Card cage with parallel flow paths having substantially similar lengths.
  9. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping case.
  10. Gustine,Gary; Ham,Charles; Kusz,Matthew J.; Sawyer,Michael, Clamping case.
  11. Gustine, Gary; Ham, Charles; Kusz, Matthew; Sawyer, Michael, Clamping receptacle.
  12. Gustine,Gary; Ham,Charles; Kusz,Matthew; Sawyer,Michael, Clamping receptacle.
  13. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  14. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  15. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
  16. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  17. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  18. Sharp, Anthony C.; Hudz, Andrew; Jeffery, Peter, Cooling airflow distribution device.
  19. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  20. Sharp,Anthony C.; Hudz,Andrew; Jeffery,Peter, Cooling airflow distribution device.
  21. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  22. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  23. Borror, Steven A.; Dipaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  24. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  25. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  26. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  27. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  28. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  29. Day, Tony, Data center cooling.
  30. Day, Tony, Data center cooling.
  31. Day, Tony, Data center cooling.
  32. Day, Tony, Data center cooling.
  33. Day, Tony, Data center cooling.
  34. Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
  35. Hutchison, Randall D.; Schiffbauer, Robert, Electronic equipment enclosure.
  36. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  37. Craft ; Jr. Thomas F. ; Kay Jason A. ; Pawlenko Ivan ; D'Alessio Alfonso J. ; Tancreto Anthony R. ; Shevchuk George, Enclosure for electronic components.
  38. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
  39. Broome, John P., Equipment rack with integral HVAC and power distribution features.
  40. Chu Richard C. ; Chrysler Gregory M., Evaporator for use in an extended air cooling system for electronic components.
  41. Ferris, Matthew D.; Petersen, Cyle D., Heat dissipation for electronic enclosures.
  42. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.
  43. Katsui, Tadashi, Heat sink and information processor using heat sink.
  44. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  45. Tadashi Katsui JP, Heat sink and information processor using heat sink.
  46. Doll,Wade J., Heat-spreading devices for cooling computer systems and associated methods of use.
  47. Sawyer, Michael; Kusz, Matthew J.; Gustine, Gary; Ham, Charles G.; Daniels, Fredrick A., Housings for circuit cards.
  48. Kelley,Douglas P.; Yatskov,Alexander I., Inlet flow conditioners for computer cabinet air conditioning systems.
  49. Madara,Steven; Sillato,Stephen; Harvey,Thomas; Baer,Daniel, Integrated heat exchangers in a rack for vertical board style computer systems.
  50. L. Ronald Hoover ; Jon Zuo ; A. L. Phillips, Integrated thermal architecture for thermal management of high power electronics.
  51. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
  52. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
  53. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.
  54. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick A.; Bishop, Michelle; King, Lane; Kusz, Matthew J., Mechanical housing.
  55. Gustine, Gary; Ham, Charles G.; Sawyer, Michael; Daniels, Fredrick; Bishop, Michelle; King, Lane; Kusz, Matthew, Mechanical housing.
  56. Gustine,Gary; Ham,Charles G.; Sawyer,Michael; Daniels,Frederick; Bishop,Michelle; King,Lane; Kusz,Matthew, Mechanical housing.
  57. Arney, Susanne; Cheng, Jen-Hau; Kolodner, Paul R.; Kota-Venkata, Krishna-Murty; Scofield, William; Salamon, Todd R.; Simon, Maria E., Mechanically-reattachable liquid-cooled cooling apparatus.
  58. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  59. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  60. Tracewell,Matthew S.; Chen,Gary G., Method and system for dissipating thermal energy from conduction-cooled circuit card assemblies which employ remote heat sinks and heat pipe technology.
  61. Barth, Michael K.; Ham, Charles G.; Tennis, Gene; Kusz, Matthew; Sjodin, Chad J.; Ferris, Matthew; Petersen, Cyle D., Methods and systems of heat transfer for electronic enclosures.
  62. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert, Modular electronic equipment enclosure comprising sealed cable interface module.
  63. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  64. Sarraf David B. ; Toth Jerome E. ; Gernert Nelson J., Stress relieved integrated circuit cooler.
  65. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  66. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  67. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  68. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
  69. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
  70. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  71. Garner, Scott D., Thermal management system and method for electronics system.
  72. Garner, Scott D., Thermal management system and method for electronics system.
  73. Garner,Scott D., Thermal management system and method for electronics system.

관련 콘텐츠

섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로