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Signal conditioning and interconnection for an acoustic transducer 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H04R-017/00
출원번호 US-0062665 (1993-05-17)
발명자 / 주소
  • Greenstein Michael (Los Altos CA)
출원인 / 주소
  • Hewlett-Packard Company (Palo Alto CA 02)
인용정보 피인용 횟수 : 86  인용 특허 : 0

초록

An ultrasonic device having an acoustic transducer with a lamination of parallel integrated circuit chips having active circuitry. A backing member made of a material for attenuating acoustic waves provides Z-axis conduction of signals from the parallel integrated circuit chips to individual piezoel

대표청구항

An acoustic transducer comprising: an array of transducer elements having forward and rearward faces; a backing member having a plurality of conductors extending therethrough, said backing member coupled to said rearward faces of said transducer elements, said conductors having first ends exposed to

이 특허를 인용한 특허 (86)

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