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Polishing pads used to chemical-mechanical polish a semiconductor substrate

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B24B-007/22
출원번호 US-0054168 (1993-04-30)
발명자 / 주소
  • Yu Chris C. (Austin TX)
출원인 / 주소
  • Motorola, Inc. (Schaumburg IL 02)
인용정보 피인용 횟수 : 112  인용 특허 : 0

초록

The present invention includes a polishing pad to improve polishing uniformity across a substrate and a method using the polishing pad. The polishing pad has a first region that lies closer to the edge of the polishing pad and a second region that lies further from the edge of the polishing pad. The

대표청구항

A polishing pad for polishing a semiconductor substrate, wherein the polishing pad comprises: an edge; a plurality of pores having an average pore size; a first region that is adjacent to the edge; and a second region having a plurality of openings, wherein: the second region is adjacent to the firs

이 특허를 인용한 특허 (112)

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  10. Kramer, Steve, CMP pad having isolated pockets of continuous porosity and a method for using such pad.
  11. Kramer, Steve, CMP pad having isolated pockets of continuous porosity and a method for using such pad.
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  36. Cesna Joseph V., In-situ polishing pad flatness control.
  37. Tang, Wallace T. Y., In-situ real-time monitoring technique and apparatus for detection of thin films during chemical/mechanical polishing planarization.
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  44. Talieh Homayoun (Santa Clara County CA) Weldon David Edwin (Santa Cruz County CA), Linear polisher and method for semiconductor wafer planarization.
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  52. Robinson Karl M., Method and apparatus for increasing-chemical-polishing selectivity.
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  76. Kim Kyung-hyun,KRX, Polishing pad for use in the chemical/mechanical polishing of a semiconductor substrate and method of polishing the substrate using the pad.
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  84. Fruitman, Clinton O.; Meloni, Mark A.; Gopalan, Periya; Yednak, III, Andrew, Polishing pad window for a chemical mechanical polishing tool.
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  86. Doan Trung Tri ; Meikle Scott G., Polishing pad with elongated microcolumns.
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  88. Wiswesser,Andreas Norbert; Oshana,Ramiel; Hughes,Kerry F.; Rohde,Jay; Huo,David Datong; Benvegnu,Dominic J., Polishing pad with window.
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  107. Volodarsky Konstantin ; Weldon David E., Wafer polishing head.
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  110. Ball Michael Bryan, Wafer processing apparatus.
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