이 특허를 인용한 특허 (43)

1. Thummel Steven G., Apparatus for encasing array packages.

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2. Thummel, Steven G., Apparatus for encasing array packages.

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3. Thummel, Steven G., Apparatus for encasing array packages.

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4. Siamak Fazelpour, Electronic device attachment methods and apparatus for forming an assembly.

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5. Goldstein Robert,RUX ; Osipenko Nikolai,RUX ; Hawkins George, Encapsulation means and method.

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6. Kuo,Yian Liang; Huang,Yung Sheng; Lin,Yu Ting, Heat spreader ball grid array (HSBGA) design for low-k integrated circuits (IC).

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7. Brand, Joseph M., Integrated circuit device.

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8. Joseph M. Brand, Integrated circuit device and synchronous-link dynamic random access memory device.

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9. Camacho, Zigmund R.; Merilo, Dioscoro A.; Bathan, Henry Descalzo; Tay, Lionel Chien Hui, Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof.

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10. Camacho, Zigmund Ramirez; Merilo, Dioscoro A.; Bathan, Henry Descalzo; Tay, Lionel Chien Hui, Integrated circuit package system with removable backing element having plated terminal leads and method of manufacture thereof.

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11. Park, YiSu; Lee, KyungHoon; Yang, Joungln; Park, SangMi; Choi, DaeSik, Integrated circuit packaging system having warpage prevention structures.

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12. Ramakrishna, Kambhampati; Chow, Seng Guan, Leadframe package for MEMS microphone assembly.

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13. Ramakrishna, Kambhampati; Chow, Seng Guan, Leadframe package for MEMS microphone assembly.

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14. Tao,Su, Leadless semiconductor package.

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15. Farnworth, Warren; Kinsman, Larry; Moden, Walter, Method and apparatus for a semiconductor package for vertical surface mounting.

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16. Kaldenberg Peter Jacobus,NLX, Method for encapsulating an integrated circuit having a window.

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17. Thummel Steven G., Method for encasing array packages.

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18. Thummel Steven G., Method for encasing array packages.

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19. Thummel, Steven G., Method for encasing array packages.

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20. Thummel,Steven G., Method for encasing plastic array packages.

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21. Batish,Rakesh, Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method.

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22. Brand Joseph M., Method of forming a synchronous-link dynamic random access memory edge-mounted device.

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23. Chow, Seng Guan; Kim, Oh Sug; Do, Byung Tai, Method of manufacture for semiconductor package with flow controller.

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24. Brand, Joseph M., Methods of forming an integrated circuit device.

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25. Park, Seong Won; Hsia, Cheng Yu; Kim, Yong Suk, Molding compound flow controller.

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26. Matayabas, Jr.,James C.; Oskarsdottir,Gudbjorg H.; Patel,Mitesh C., Package stress management.

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27. Matayabas, Jr.,James C.; Oskarsdottir,Gudbjorg H.; Patel,Mitesh C., Package stress management.

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28. Chen, Nan-Cheng; Hsu, Chih-Tai, Package-on-package with fan-out WLCSP.

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29. Scranton Alec B. ; Rangarajan Bharath ; Baikerikar Kiran K., Photopolymerizable compositions for encapsulating microelectronic devices.

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30. Takahashi, Hideyuki; Makino, Haruhiko, Semiconductor apparatus and electronic system.

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31. Nakamura, Atsushi; Nishi, Kunihiko, Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof.

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32. Shinogi, Hiroyuki, Semiconductor device having stacked dice disposed on base substrate.

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33. Chow, Seng Guan; Kim, Oh Sug; Do, Byung Tai, Semiconductor package with flow controller.

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34. Chuang,Jui Yu; Chan,Lien Chi; Huang,Chih Ming, Semiconductor package with lead frame as chip carrier and method for fabricating the same.

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35. Tao Su,TWX ; Lin Chun-Hung,TWX ; Huang Tai-Chun,TWX, Semiconductor package with wire protection and method therefor.

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36. Manteghi Kamran, SiO2 wire bond insulation in semiconductor assemblies.

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37. Tao Su,TWX ; Lo Kuang-Lin,TWX ; Chou Kuang-Chun,TWX ; Chen Shih-Chih,TWX, Stacked chip assembly utilizing a lead frame.

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38. Wang, Yu-Po; Lin, Chung-Chi; Huang, Chien-Ping, Substrate with dam bar structure for smooth flow of encapsulating resin.

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39. Batish, Rakesh; Kulicke, C. Scott; Hmiel, Andrew; VonSeggern, Walt, System and method for preventing and alleviating short circuiting in a semiconductor device.

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40. Batish, Rakesh; Hmiel, Andrew F.; Sandgren, Glenn; VonSeggern, Walt; Kulicke, C. Scott, System and method for reducing or eliminating semiconductor device wire sweep.

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41. Batish,Rakesh; Hmiel,Andrew F.; Sandgren,Glenn; VonSeggern,Walt; Kulicke,C. Scott, System for reducing or eliminating semiconductor device wire sweep.

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42. Chen, Nan-Cheng; Hsu, Chih-Tai, System-in-package with fan-out WLCSP.

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43. Magno, Sheila Rima C.; Do, Byung Tai; Guillermo, Dennis; Dimaano, Jr., Antonio B., Wire sweep resistant semiconductor package and manufacturing method therefor.

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