이 특허를 인용한 특허 (178)

1. Nishikawa Shigeo,JPX ; Sugihara Eiichi,JPX ; Takedachi Masahiro,JPX ; Yorita Kaoru,JPX ; Inoue Haruo,JPX ; Shimada Yoko,JPX ; Eriguchi Michio,JPX, Addition method of supercritical carbon dioxide, and production process of expanded thermoplastic resin product by making use of the addition method.

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2. Farrar, Paul A., Apparatus and method for high density multi-chip structures.

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3. Farrar, Paul A., Apparatus and method for high density multi-chip structures.

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4. Farrar, Paul A., Apparatus and method for high density multi-chip structures.

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5. Powers, Steven Ray, Apparatus and method for interleaving polymeric roll for gas impregnation and solid-state foam processing.

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6. Laver,Terry C.; Keller,Brian; England,Alfred B.; Dostal,David F., Apparatus and method for low-density cellular wood plastic composites.

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7. Arai,Takashi, Apparatus for supplying a resin material to an injection molding machine.

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8. Keiser LeRoy H., Articles including microcellular foam materials as components thereof.

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9. Ahn, Kie Y.; Forbes, Leonard, Bipolar transistors with low-resistance emitter contacts.

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10. Ahn, Kie Y.; Forbes, Leonard, Bipolar transistors with low-resistance emitter contacts.

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11. Ahn,Kie Y.; Forbes,Leonard, Bipolar transistors with low-resistance emitter contacts.

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12. Cardona, Juan C.; Levesque, Kevin J.; Burnham, Theodore A.; Matthieu, Alan F.; Kim, Roland Y., Blowing agent delivery system.

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13. Kim, Roland Y., Blowing agent introduction systems and methods.

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14. Kim, Roland Y., Blowing agent introduction systems and methods.

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15. Kim,Roland Y., Blowing agent introduction systems and methods.

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16. Burnham, Theodore A.; Ng, Jeffrey L., Blowing agent metering system.

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17. Singh, Rajiv R.; Pham, Hang T.; Shankland, Ian, Compositions containing tetrafluoropropene and carbon dioxide.

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18. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride.

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19. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride films.

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20. Ahn, Kie Y.; Forbes, Leonard, Conductive layers for hafnium silicon oxynitride films.

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21. Semersky, Frank E.; Voyles, William D., Container having a foamed wall.

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22. Semersky, Frank E., Container having foam layer.

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23. Daly Andrew T. ; Decker Owen H. ; Wursthorn Karl R. ; Houda Frank R., Continuous processing of powder coating compositions.

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24. Daly Andrew T. ; Decker Owen H. ; Wursthorn Karl R. ; Houda Frank R. ; Grundowski Leo T. ; Ernst Carl W., Continuous processing of powder coating compositions.

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25. Daly Andrew T. ; Decker Owen H. ; Wursthorn Karl R. ; Houda Frank R. ; Grundowski Leo T. ; Ernst Carl W., Continuous processing of powder coating compositions.

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26. Daly, Andrew T.; Decker, Owen H.; Wursthorn, Karl R.; Houda, Frank R.; Grundowski, Leo T.; Ernst, Carl W., Continuous processing of powder coating compositions.

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27. Farrar Paul A., Copper metallurgy in integrated circuits.

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28. Farrar, Paul A., Copper metallurgy in integrated circuits.

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29. Branch, Gregory L., Deep drawn microcellularly foamed polymeric containers made via solid-state gas impregnation thermoforming.

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30. Branch, Gregory L., Deep drawn microcellularly foamed polymeric containers made via solid-state gas impregnation thermoforming.

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31. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.

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32. Sandhu, Gurtej S.; Durcan, D. Mark, Devices with nanocrystals and methods of formation.

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33. Cotte,John M.; McCullough,Kenneth John; Moreau,Wayne Martin; Petrarca,Kevin; Simons,John P.; Taft,Charles J.; Volant,Richard, Dielectric material.

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34. Cardona, Juan C., Discontinuous blowing agent delivery system and method.

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35. Peter R. Iacovelli, Disposable food tray.

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36. Hollenberg, David H., Drinking straw prepared from flattened polymeric tubular conduit, method of making same and dispenser therefor.

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37. Farrar,Paul A., Electronic apparatus having a core conductive structure within an insulating layer.

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38. Ahn,Kie Y.; Forbes,Leonard, Electronic apparatus with deposited dielectric layers.

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39. Shmidt Creston D. ; Imeokparia Daniel D. ; Suh Kyung W. ; Malone Bruce A. ; Franklin Ken, Extruded, open-cell microcellular alkenyl aromatic polymer foams, process for making and articles made therefrom.

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40. Shmidt Creston D. ; Imeopkaria Daniel D. ; Suh Kyung W. ; Malone Bruce A. ; Franklin Ken, Extruded, open-cell microcellular alkenyl aromatic polymer foams, process for making, and articles made therefrom.

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41. Shmidt Creston D. ; Suh Kyung W. ; Imeokparia Daniel D. ; Malone Bruce A. ; Franklin Ken, Extruded, open-cell microcellular alkenyl aromatic polymer forms, process for making, and articles made therefrom.

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42. Kishbaugh,Levi A.; Levesque,Kevin J.; Guillemette,Albert H.; Chen,Liqin; Xu,Jingyi; Okamoto,Kelvin T., Fiber-filled molded articles.

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43. Arai,Takashi, Foam molding method and apparatus.

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44. Kramer, Stephen J., Foamed mechanical planarization pads made with supercritical fluid.

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45. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper and other metals.

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46. Farrar Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

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47. Farrar, Paul A., Forming submicron integrated-circuit wiring from gold, silver, copper, and other metals.

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48. Suh Nam P. ; Hermann Torsten,DEX, Gear throttle as a nucleation device in a continuous microcellular extrusion system.

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49. Farrar Paul A. ; Forbes Leonard, High-Q inductive elements.

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50. Paul A. Farrar ; Leonard Forbes, High-Q inductive elements.

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51. Fukushima Toshiharu,JPX ; Itoh Takako,JPX, High-strength synthetic resin foam and process of fabrication thereof.

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52. Noble, Wendell P.; Forbes, Leonard, Highly conductive composite polysilicon gate for CMOS integrated circuits.

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53. Wendell P. Noble ; Leonard Forbes, Highly conductive composite polysilicon gate for CMOS integrated circuits.

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54. Steckle ; Jr. Warren P. (Los Alamos NM) Apen Paul G. (Los Alamos NM) Mitchell Michael A. (Los Alamos NM), Highly cross-linked nanoporous polymers.

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55. Steckle ; Jr. Warren P. ; Apen Paul G. ; Mitchell Michael A., Highly cross-linked nanoporous polymers.

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56. Farrar,Paul A., Hplasma treatment.

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57. Farrar,Paul A., Hydrophobic foamed insulators for high density circuits.

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58. Vadala, Jr.,Joseph P.; Kishbaugh,Levi A.; Levesque,Kevin J.; Pierick,David E., In-mold decorated articles and methods.

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59. Yamaki, Hiroshi, Injection molding method.

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60. Pierick, David E.; Anderson, Jere R.; Cha, Sung W.; Chen, Liqin; Stevenson, James F.; Laing, Dana E., Injection molding of polymeric material.

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61. Pierick, David E.; Anderson, Jere R.; Cha, Sung Woon; Chen, Liqin; Stevenson, James F.; Laing, Dana E., Injection molding of polymeric material.

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62. Pierick,David E.; Anderson,Jere R.; Cha,Sung Woon; Chen,Liqin; Stevenson,James F.; Laing,Dana E., Injection molding of polymeric material.

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63. Farrar, Paul A., Insulators for high density circuits.

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64. Farrar, Paul A., Insulators for high density circuits.

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65. Farrar, Paul A., Integrated circuit and seed layers.

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66. Farrar,Paul A., Integrated circuit and seed layers.

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67. Farrar,Paul A., Integrated circuit and seed layers.

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68. Farrar, Paul A., Integrated circuit device structure including foamed polymeric material.

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69. Farrar, Paul A., Integrated circuit insulators and related methods.

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70. Farrar, Paul A., Integrated circuit insulators and related methods.

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71. Farrar Paul A., Integrated circuit with oxidation-resistant polymeric layer.

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72. Tupil Srinath P. ; Buchner Klaus,CHX ; Lahmann Patrick M., Lamination of microcellular articles.

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73. Barnes, II, Thomas F.; Hamilton, James T., Lighting fixture employing a partially reflective partially transmittive polymeric reflector.

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74. Farrar, Paul A., Low dielectric constant STI with SOI devices.

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75. Farrar, Paul A., Low dielectric constant STI with SOI devices.

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76. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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77. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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78. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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79. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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80. Farrar, Paul A., Low dielectric constant shallow trench isolation.

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81. Paul A. Farrar, Low dielectric constant shallow trench isolation.

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82. Handa Paul,CAXITX K4A 2M4 ; Zhang Zhiyi,CAXITX K1L 6Y1, Manufacturing foams by stress-induced nucleation.

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83. Dontula, Narasimharao; Greener, Jehuda; Fleischer, Cathy A.; Park, Chul B.; Lee, Patrick C.; Wang, Jin; Naguib, Hani E., Manufacturing process for open celled microcellular foam.

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84. Farrar, Paul A., Mask on a polymer having an opening width less than that of the opening in the polymer.

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85. Farrar, Paul A., Memory system with conductive structures embedded in foamed insulator.

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86. Teraoka,Atsuo; Tsuda,Fumiaki; Ohyabu,Hideo, Method and apparatus for forming thermoplastic resin foam.

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87. Burnham Theodore A. ; Cha Sung W. ; Walat Robert H. ; Kim Roland Y. ; Anderson Jere R. ; Stevenson James F. ; Suh Nam P. ; Pallaver Matthew, Method and apparatus for microcellular polymer extrusion.

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88. Burnham, Theodore A.; Cha, Sung W.; Walat, Robert H.; Kim, Roland Y.; Anderson, Jere R.; Stevenson, James F.; Suh, Nam P.; Pallaver, Matthew, Method and apparatus for microcellular polymer extrusion.

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89. Blizard Kent ; Tupil Srinath ; Malavich William, Method and apparatus for microcellular polypropylene extrusion, and polypropylene articles produced thereby.

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90. Okamoto, Akio; Miyamoto, Kazuaki, Method for foam injection molding of thermoplastic resin.

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91. Teraoka, Atsuo; Tsuda, Fumiaki; Ohyabu, Hideo, Method for forming thermoplastic resin foam.

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92. Nadella, Krishna, Method for infusing a gas into a thermoplastic material, and related systems.

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93. Nadella, Krishna; Wang, Xiaoxi; Kumar, Vipin, Method for joining thermoplastic polymer material.

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94. Farrar Paul A. ; Forbes Leonard, Method for making high-Q inductive elements.

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95. Ahn,Kie Y.; Forbes,Leonard, Method for making integrated circuits.

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96. Dubin, Valery, Method for making interconnects and diffusion barriers in integrated circuits.

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97. Sanyal, Jeet, Method for manufacturing coaxial wire with foamed insulation.

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98. Okamoto, Akio; Miyamoto, Kazuaki, Method for multilayer molding of thermoplastic resins and multilayer molding apparatus.

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99. Schlummer, Christian; Habibi-Naini, Sasan, Method for the manufacture of a molding composition.

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100. Farrar, Paul A.; Noble, Wendell P., Method of forming buried conductors.

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101. Yamaki, Hiroshi, Method of injection molding of thermoplastic resin.

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102. Joseph M. DeSimone ; Saad A. Khan ; Joseph R. Royer ; Richard J. Spontak ; Teri Anne Walker, Method of making foamed materials using surfactants and carbon dioxide.

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103. Polzin, Bruce C., Method of manufacture of paint application.

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104. Xu, Jingyi; Cardona, Juan C.; Kishbaugh, Levi A., Method of processing polymers using a single screw.

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105. Arai,Takashi, Method of storing material into which gas saturates.

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106. Farrar, Paul A., Method of using foamed insulators in three dimensional multichip structures.

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107. Farrar,Paul A., Method of using foamed insulators in three dimensional multichip structures.

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108. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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109. Ahn, Kie Y.; Forbes, Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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110. Ahn,Kie Y.; Forbes,Leonard, Methods and apparatus for making integrated-circuit wiring from copper, silver, gold, and other metals.

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111. Nadella, Krishna V.; Powers, Steven; Malone, Thomas, Methods and pressure vessels for solid-state microcellular processing of thermoplastic rolls or sheets.

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112. Forbes Leonard ; Farrar Paul A. ; Ahn Kie Y., Methods and structures for gold interconnections in integrated circuits.

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113. Ahn, Kie Y.; Forbes, Leonard; Farrar, Paul A., Methods and structures for metal interconnections in integrated circuits.

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114. Ahn,Kie Y.; Forbes,Leonard; Farrar,Paul A., Methods and structures for metal interconnections in integrated circuits.

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115. Forbes, Leonard; Farrar, Paul A.; Ahn, Kie Y., Methods and structures for silver interconnections in integrated circuits.

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116. Ahn Kie Y. ; Forbes Leonard, Methods for making copper and other metal interconnections in integrated circuits.

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117. Ahn,Kie Y.; Forbes,Leonard, Methods for making copper and other metal interconnections in integrated circuits.

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118. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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119. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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120. Ahn,Kie Y.; Forbes,Leonard, Methods for making integrated-circuit wiring from copper, silver, gold, and other metals.

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121. Valery Dubin, Methods for making interconnects and diffusion barriers in integrated circuits.

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122. Xu Jingyi, Methods for manufacturing foam material including systems with pressure restriction element.

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123. Xu, Jingyi, Methods for manufacturing foam material including systems with pressure restriction element.

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124. Xu,Jingyi, Methods for manufacturing foam material including systems with pressure restriction element.

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125. DeSimone, Joseph M.; Khan, Saad A.; Royer, Joseph R.; Spontak, Richard J.; Walker, Teri Anne; Gay, Yvon J.; Siripurapu, Srinivas, Methods of making foamed materials of blended thermoplastic polymers using carbon dioxide.

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126. Anderson, Jere R.; Straff, Richard S.; Okamoto, Kelvin T.; Blizard, Kent; Pierick, David E., Microcelluar extrusion/blow molding process and article made thereby.

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127. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.

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128. Blizard Kent ; Okamoto Kelvin T. ; Anderson Jere R., Microcellular articles and methods of their production.

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129. Suh Kyung W. ; Yamada Michio,JPX ; Schmidt Creston D. ; Imeokparia Daniel D., Microcellular foams containing an infrared attenuating agent and a method of using.

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130. Pallaver, Matthew; Cha, Sung W., Microcellular thermoplastic elastomeric structures.

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131. Daum, Ulrich; Rakutt, Dietmar, Microcellular thermoset foams and method for producing the same.

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132. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture.

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133. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package filled with liquid or pressurized gas and associated method of manufacture.

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134. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device package with conductive elements and associated method of manufacture.

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135. Eldridge, Jerome M.; Farrar, Paul A., Microelectronic device with package with conductive elements and associated method of manufacture.

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136. Parks, Jay S., Microelectronic die including low RC under-layer interconnects.

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137. Parks, Jay S., Microelectronic die including low RC under-layer interconnects.

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138. Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.

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139. Farrar, Paul A.; Eldridge, Jerome M., Multi-chip electronic package and cooling system.

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140. Nadella, Krishna; Branch, Gregory; Kumar, Vipin; Waggoner, Michael, Multi-layered foamed polymeric objects and related methods.

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141. Nadella, Krishna; Branch, Gregory; Kumar, Vipin; Waggoner, Michael A., Multi-layered foamed polymeric objects and related methods.

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142. Nadella, Krishna; Wang, Xiaoxi, Multi-layered foamed polymeric objects having segmented and varying physical properties and related methods.

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143. Ahn,Kie Y.; Forbes,Leonard; Eldridge,Jerome M., Multilevel copper interconnect with double passivation.

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144. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

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145. Ahn,Kie Y.; Forbes,Leonard, Multilevel copper interconnects with low-k dielectrics and air gaps.

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146. Bellare, Anuj; Fitz, Wolfgang; Gomoll, Andreas H.; Scott, Richard D.; Thornhill, Thomas S., Nanocomposite surgical materials and method of producing them.

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147. Bellare,Anuj; Fitz,Wolfgang; Gomoll,Andreas H.; Scott,Richard D.; Thornhill,Thomas S., Nanocomposite surgical materials and method of producing them.

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148. Sandler, Jan Kurt Walter; Francis, Timothy; Lopes, Pedro Manuel Sampaio, Nanoporous polymer foams.

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149. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.

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150. Farrar,Paul A., Packaging of electronic chips with air-bridge structures.

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151. Lee,Hee Sung; Lee,Chul; Lee,Ryeong; Kim,Jea Myung, Pellet-type foams of non-crosslinked polypropylene resin having lower melting point and process and device for producing the same and molded foams therefrom.

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152. Jere R. Anderson ; Kelvin T. Okamoto, Polyethylene foams and methods of their production.

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153. Anderson, Jere R.; Okamoto, Kelvin T.; Blizard, Kent G., Polymer foam processing with low blowing agent levels.

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154. Chen, Ligin; Blizard, Kent; Kim, Roland; Burnham, Ted, Polymer processing system and apparatus.

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155. Xu,Jingyi; Cardona,Juan C.; Kishbaugh,Levi A., Polymer processing systems including screws.

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156. Farrar, Paul A., Polynorbornene foam insulation for integrated circuits.

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157. Raukola Jaako,FIX ; Kirjavainen Kari,FIX ; Minkkinen Hannu,FIX, Procedure for the manufacture of a foamed plastic product.

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158. Cotte,John M.; McCullough,Kenneth John; Moreau,Wayne Martin; Petrarca,Kevin; Simons,John P.; Taft,Charles J.; Volant,Richard, Process of insulating a semiconductor device using a polymeric material.

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159. Branch, Gregory; Nadella, Krishna, Roll fed flotation/impingement air ovens and related thermoforming systems for corrugation-free heating and expanding of gas impregnated thermoplastic webs.

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160. Branch, Gregory; Nadella, Krishna, Roll fed flotation/impingement air ovens and related thermoforming systems for corrugation-free heating and expanding of gas impregnated thermoplastic webs.

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161. Ahn,Kie Y.; Forbes,Leonard, Selective electroless-plated copper metallization.

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162. Kumar Vipin (Seattle WA) Schirmer Henry G. (Spartanburg SC), Semi-continuous production of solid state polymeric foams.

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163. Farrar, Paul A., Structures and methods to enhance copper metallization.

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164. Farrar, Paul A., Structures and methods to enhance copper metallization.

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165. Farrar, Paul A., Structures and methods to enhance copper metallization.

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166. Farrar,Paul A., Structures and methods to enhance copper metallization.

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167. Farrar,Paul A., Structures and methods to enhance copper metallization.

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168. Daly, Andrew T.; Decker, Owen H.; Wursthorn, Karl R.; Houda, Frank R.; Grundowski, Leo T.; Ernst, Carl W., System for continuous processing of powder coating compositions.

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169. Farrar, Paul A., Three-dimensional multichip module.

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170. Farrar,Paul A., Three-dimensional multichip module.

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171. Paul A. Farrar, Three-dimensional multichip module.

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172. Qiu, Yiping; Mohamed, Mansour H.; Xu, Wei, Three-dimensionally reinforced cellular matrix composite and method of making same.

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173. Gehlsen, Mark David; Vall, David Loren; Perman, Craig Allen; Albrecht, Bonnie Weiskopf, Uniform small cell foams and a continuous process for making same.

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174. Gehlsen, Mark David; Vall, David Loren; Perman, Craig Allen; Albrecht, Bonnie Weiskopf, Uniform small cell foams and a continuous process for making same.

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175. Gehlsen, Mark David; Vall, David Loren; Perman, Craig Allen; Albrecht, Bonnie Weiskopf, Uniform small cell foams and a continuous process for making same.

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176. Gehlsen, Mark David; Vall, David Loren; Perman, Craig Allen; Albrecht, Bonnie Weiskopf, Uniform small cell foams and a continuous process for making same.

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177. Mark David Gehlsen ; David Loren Vall ; Craig Allen Perman ; Bonnie Weiskopf Albrecht, Uniform small cell foams and a continuous process for making same.

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178. Kim, Roland Y.; Burnham, Theodore A., Valve for injection molding.

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