|국가/구분||United States(US) Patent 등록|
|국제특허분류(IPC7판)||C03C-008/24 C03C-008/14 C03C-003/21|
|미국특허분류(USC)||501/15 ; 501/17 ; 501/46 ; 501/73|
|발명자 / 주소|
|출원인 / 주소|
|인용정보||피인용 횟수 : 28 인용 특허 : 0|
A sealing glass composition suitable for bonding ceramic surfaces at low temperatures and which includes in weight percent 5-50% thallium oxide, 10-40% vanadium oxide, 5-30% tellurium oxide, 1.5-15% arsenic oxide and 1-5% phosphorous oxide. Other additives may be included, such as bismuth oxide. A paste formulated from said glass and a filler for the purpose of adjusting the fluidity and/or dielectric constant of the paste.
A sealing glass composition suitable for use in bonding to a ceramic surface at low temperatures comprising in weight percent 0.5-50% thallium oxide, 10-40% vanadium oxide, 5-30% tellurium oxide, 1-15% arsenic oxide, 1-5% phosphorous oxide, 0-10% magnesium chloride, 0-10% barium oxide, 0-10% barium chloride, 0-10% strontium oxide, 0-10% strontium chloride, 0-5% antimony oxide, 0-3% indium oxide, 0-5% silica, 0-5% alumina, 0-15% copper oxide, 0-10% cobalt oxide, 0-15% of each of lithium oxide, sodium oxide and potassium oxide, 0-25% lead oxide and 0-10% s...