이 특허를 인용한 특허 (52)

1. Mount, David J., Adding energy to a cleaning process fluid for removing photo resist, residues and particles from semiconductor substrates, photo masks, reticles, disks and flat-panel displays.

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2. Frattini, Paul L.; Varrin, Robert Douglas; Hunt, Edwin Stephen, Apparatus and method for ultrasonically cleaning irradiated nuclear fuel assemblies.

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3. Hahn, Christopher; Lee, Hanjoo, Apparatus for ejecting fluid onto a substrate and system and method incorporating the same.

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4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.

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5. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.

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6. Wohlgemuth, Oliver, Cleaning device for rotationally symmetrical bodies.

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7. DeSimone Joseph M. ; Romack Timothy ; Betts Douglas E. ; McClain James B., Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants.

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8. DeSimone Joseph M. ; Romack Timothy J. ; Betts Douglas E. ; McClain James B., Cleaning process using carbon dioxide as a solvent and employing molecularly engineered surfactants.

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9. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.

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10. Reber, Daniel; Loher, Urs; Skidmore, Aaron, Device and method for temperature compensation testing of digital load cells.

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11. Kuo, Tzu-Chen, Fluid driven agitator used in densified gas cleaning system.

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12. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.

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13. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.

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14. Jones, William D., High pressure fourier transform infrared cell.

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15. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.

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16. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.

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17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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18. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.

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19. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.

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20. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.

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21. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.

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22. Montierth,Garry L.; Miranda,Henry R.; Maraviov,Sharyl L.; Busnaina,Ahmed A., Method and apparatus to process substrates with megasonic energy.

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23. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.

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24. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.

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25. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.

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26. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.

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27. Bran, Mario E., Method for megasonic processing of an article.

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28. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.

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29. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.

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30. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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31. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.

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32. Bran, Mario E., Method of manufacturing integrated circuit devices.

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33. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.

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34. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.

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35. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.

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36. Wuester,Christopher D., Process flow thermocouple.

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37. Steven L. Peace ; Paul Z. Wirth ; Eric Lund, Reactor for processing a workpiece using sonic energy.

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38. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.

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39. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.

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40. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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41. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.

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42. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.

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43. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.

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44. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.

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45. Ching, Gil; Perrut, Vincent; Ruch, Vincent; Fresquet, Gilles, Substrate processing apparatus for processing substrates using dense phase gas and sonic waves.

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46. Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit, Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials.

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47. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.

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48. Bran, Mario E., System for megasonic processing of an article.

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49. McDermott,Wayne Thomas; Roth,Dean Van John; Ockovic,Richard Carl, Transmission of ultrasonic energy into pressurized fluids.

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50. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.

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51. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.

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52. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.

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