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Multiple-fan microprocessor cooling through a finned heat pipe 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0016843 (1993-02-12)
발명자 / 주소
  • Nelson Daryl (Beaverton OR)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 143  인용 특허 : 0

초록

A computer chassis assembly that includes a heat pipe which thermally couples an electronic package to multiple fan units. The heat pipe provides a computer chassis that sufficiently cools internal heat generating components without placing the components in close proximity to the fans.

대표청구항 ▼

A computer assembly, comprising: a chassis having a baseplate and a back wall; a first fan attached to said back wall, said first fan being adapted to generate a stream of air; a heat sink that is coupled to said chassis and has a plurality of fins that are adjacent to said first fan such that said

이 특허를 인용한 특허 (143)

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