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Apparatus for cooling electronic devices 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0051958 (1993-04-26)
발명자 / 주소
  • Hilbrink Johan O. (Cincinnati OH)
출원인 / 주소
  • NCR Corporation (Dayton OH 02)
인용정보 피인용 횟수 : 56  인용 특허 : 0

초록 ▼

An arrangement for cooling electronic components in a system. Several circuit boards are connected to a backplane electrically and through heat pipes, which are mounted on the boards and provide connections between the electronic components on the board and the cooling system. The circuit boards, in

대표청구항 ▼

An electronic assembly, comprising: an electronic circuit component; a circuit board on which said electronic circuit component is mounted; cooling apparatus for providing a cooling medium for cooling said electronic circuit component, said cooling apparatus having a body and a housing surrounding t

이 특허를 인용한 특허 (56)

  1. Ishimine Junichi,JPX ; Suzuki Masahiro,JPX, Air-cooled electronic apparatus.
    상세보기
  2. Dibene, II, Joseph T.; Hartke, David H.; Derian, Edward J.; Hoge, Carl E.; Broder, James M.; San Andres, Jose B.; Riel, Joseph S., Apparatus for delivering power to high performance electronic assemblies.
    상세보기
  3. Joseph Ted Dibene, II ; David H. Hartke ; James Hjerpe Kaskade ; Carl E. Hoge, Apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  4. Eriksson Mats,SEX, Arrangement and method for the remote cooling of radio transceivers.
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  5. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert; Taubert, Tomasz, Cable interface for electronic equipment enclosure.
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  6. Randall D. Hutchison ; Robert Shiffbauer ; Kevan Smith, Concentrical slot telecommunications equipment enclosure.
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  7. Harris Willard Stephen ; Kemink Randall Gail ; McClafferty William David ; Schmidt Roger Ray, Cooling device for hard to access non-coplanar circuit chips.
    상세보기
  8. Goto Kazuhiko,JPX ; Mashiko Koichi,JPX ; Saito Yuji,JPX ; Nguyen Thang Toan,JPX ; Mochizuki Masataka,JPX ; Eguchi Katsuo,JPX ; Hasegawa Hitoshi,JPX, Cooling device for notebook personal computer.
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  9. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
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  10. Gasquet, Jean-Claude; Tanghe, Alcina, Device supporting a light-emitting diode for an automobile signalling system, and a method of manufacturing such a device.
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  11. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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  12. Tadayon, Pooya; Monzon, Franklin G.; Dujari, Prateek, Electrical energy-generating heat sink system and method of using same to recharge an energy storage device.
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  13. Tadayon,Pooya; Zaerpoor,Koorosh, Electrical energy-generating system and devices and methods related thereto.
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  14. Moore David A., Electronic apparatus with plug-in heat pipe module cooling system.
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  15. Hileman Vince P., Electronic card with blind mate heat pipes.
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  16. Gale Geoffrey N.,CAX ; Watkins John H.,CAX, Electronic circuitry.
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  17. Oyamada Takashi,JPX, Electronic device having a plug-in unit with a heat sink structure.
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  18. Hutchison, Randall D.; Schiffbauer, Robert, Electronic equipment enclosure.
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  19. Hutchison Randy ; Shiffbauer Robert, Enclosure for telecommunications equipment.
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  20. Leon,Eduardo; Harwood,Walter; Bond,William; Hernandez,Frank; Vaidya,Avinash K., Heat pipe cooled electronics enclosure.
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  21. Dellacona, Richard, High speed fault tolerant mass storage network information server.
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  22. Dellacona,Richard, High speed information processing and mass storage system and method, particularly for information and application servers.
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  23. Brian A. Scott, Integrated circuit refrigeration device.
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  24. Meyer ; IV George A. ; Toth Jerome E., Integrated circuit with taped heat pipe.
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  25. Hartke, David H.; DiBene, II, Joseph Ted, Integrated power delivery with flex circuit interconnection for high density power circuits for integrated circuits and systems.
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  26. Dibene ; II Joseph Ted ; Hartke David, Inter-circuit encapsulated packaging.
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  27. Joseph Ted DiBene, II ; David Hartke, Inter-circuit encapsulated packaging for power delivery.
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  28. Laetsch, Erich K., Local loop telecommunication repeater housing having mounting slots enabling replaceable repeater and voltage protector assemblies.
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  29. Laetsch, Erich K., Local loop telecommunication repeater housings employing thermal collection, transfer and distribution via solid thermal conduction.
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  30. Wall Charles B. ; Peeples Johnston W. ; Craps Terry ; DiGiacomo Robert, Method and apparatus for cooling an integrated circuit device.
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  31. DiBene, II, Joseph Ted; Hartke, David H., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  32. DiBene, II,Joseph T.; Hartke,David H.; Kaskade,James J. Hjerpe; Hoge,Carl E., Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management.
    상세보기
  33. DiBene, II,Joseph T.; Derian,Edward J., Micro-spring interconnect systems for low impedance high power applications.
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  34. Yang, Sophia S.; Jacobsen, Alan J., Micro-truss materials having in-plane material property variations.
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  35. Carter, William B.; Gross, Adam F.; Guinn, Keith V.; Jacobsen, Alan J.; Kisailus, David, Microtruss based thermal heat spreading structures.
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  36. Carter, William B.; Brewer, Peter D.; Gross, Adam F.; Rogers, Jeffrey L.; Guinn, Keith V.; Jacobsen, Alan J., Microtruss based thermal plane structures and microelectronics and printed wiring board embodiments.
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  37. Memory, Stephen B.; Ganaway, Fredrick E.; Rogers, C. James; DeVuono, Anthony C.; Phillips, Alfred; Zuo, Zhijun, Modular cooling system and thermal bus for high power electronics cabinets.
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  38. Smith, Kevan; Marosfalvy, Hans; Hutchison, Randall D.; Schiffbauer, Robert, Modular electronic equipment enclosure comprising sealed cable interface module.
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  39. Johnson, Scott T., Multiple liquid loop cooling for electronics.
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  40. Dellacona Richard, Network information server.
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  41. Facusse, Mario E.; Kosch, David Scott, Passive cooling enclosure system and method for electronics devices.
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  43. Facusse, Mario, Passive cooling system and method for electronics devices.
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  44. Yasuhiro Muramatsu JP, Printed circuit board for surface connection and electronic apparatus employing the same.
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  45. Hileman Vince P. ; Harpell Gary A., Refrigeration cooled disk storage assembly.
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  46. Hartke, David H.; DiBene, II, J. Ted, Right-angle power interconnect electronic packaging assembly.
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  47. Goth Gary F. ; Loparco John J. ; Singh Prabjit, Sealed multi-chip module cooling system.
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  48. Derian, Edward J.; DiBene, II, Joseph Ted; Hartke, David H., Separable power delivery connector.
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  49. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., System and method for processor power delivery and thermal management.
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  50. Hutchison, Randall D.; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
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  51. Lin, Wanlai; Hutchison, Randall D.; Smith, Kevan; Taubert, Tomasz, Telecommunications enclosure with individual, separated card holders.
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  52. Randall D. Hutchinson ; Tomasz Taubert, Telecommunications enclosure with individual, separated card holders.
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  53. Hoss Shawn P. ; Moss David L., Thermal connection system for modular computer system components.
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  54. Centola, Bruno; Gomez, Claude, Thermal connector for transferring heat between removable printed circuit boards.
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  55. Dibene, II, Joseph Ted; Hartke, David H.; Hoge, Carl E.; Derian, Edward J., Ultra-low impedance power interconnection system for electronic packages.
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  56. Jacob Tzlil IL; Ronen Zagoory IL, Utilizing a convection cooled electronic circuit card for producing a conduction cooled electronic card module.
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