[특허]Modular floor sub-structure for the operational support of computer systems

Modular floor sub-structure for the operational support of computer systems 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	F04H-009/00 F24F-013/10
출원번호	US-0051534 (1993-04-23)
발명자 / 주소	Feeney Edward K. (Worthington OH)
출원인 / 주소	Liebert Corporation (Columbus OH 02)
인용정보	피인용 횟수 : 73 인용 특허 : 0

초록 ▼

A modular floor sub-structure is provided wherein discrete floor modules having bottom surfaces and sides extending upwardly to support paired floor tile are interconnected to sit upon a floor surface and, in turn, support rack-mounted computer components. Select ones of the floor modules contain air cooling coils and blowers, while others are provided with uninterrupted power supplies and still others retain power distribution networks. The cooling system of a given module as well as the UPS components of another given module are provided having a capacity for supporting one computer component. Where more than one computer component is to be supported by the system, then additional modules are provided to develop an expanded elevated floor surface with power and heat removal servicing specific to each computer component. In one embodiment, a step arrangement is provided, the interior of which is utilized to retain flexible chilled water conduits for servicing the cooling coils within adjacently disposed floor modules.

대표청구항 ▼

A floor supported substructure system for a computer system component having a given base peripheral configuration with a base region through which heat removing air may enter, said system component having given operational heat dissipation and power consumption characteristics, comprising: a plurality of floor modules, each having a lower portion supported from said floor and having side portions extending upwardly therefrom to support an elevated floor surface at a given height and defining a chamber intermediate said lower portion and said elevated floor surface; the said elevated floor surface of a first said floor module supporting said computer system component and having an air outlet formed therein for providing air transfer communication to said base region; second and third said floor modules positioned in adjacency with said first module and oriented to effect a substantial alignment of said elevated floor surfaces thereof: a said floor module chamber retaining an air circulation blower having an input and an air flow output to provide a discrete said floor module providing said air flow output at a capacity corresponding with said heat dissipation characteristic; and an air flow path defined by at least one said chamber extending from said blower airflow output to said air outlet.

이 특허를 인용한 특허 (73)

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Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
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Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
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Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
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Bash, Cullen E.; Patel, Chandrakant D.; Beitelmal, Abdlmonem H.; Sharma, Ratnesh K., Cooling of data centers.
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Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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Modular floor sub-structure for the operational support of computer systems 원문보기

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Modular floor sub-structure for the operational support of computer systems 원문보기

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연구과제 타임라인

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이 특허를 인용한 특허 (73)

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