초록 ▼

An adsorption cooling apparatus includes a hermetically sealed cylindrical capsule that contains a first thermal medium, a moisture absorber on its first side and an adsorbent on its second side. The capsule reciprocatively moves and slidably contacts with a cooling vessel containing a low temperatu

An adsorption cooling apparatus includes a hermetically sealed cylindrical capsule that contains a first thermal medium, a moisture absorber on its first side and an adsorbent on its second side. The capsule reciprocatively moves and slidably contacts with a cooling vessel containing a low temperature thermal medium on the first side and with a heating vessel containing a high temperature thermal medium on the second side. The capsule is cooled by an external airflow when it is moved to the cooling vessel, so that the first thermal medium absorbed in the moisture absorber evaporates and the low temperature thermal medium in the cooling vessel is cooled because of the latent heat of evaporation of the first thermal medium. The so cooled low temperature thermal medium is utilized for cooling the object to be cooled. The first thermal medium having evaporated from the moisture absorber is adsorbed by the adsorbent. When the capsule has moved to the heating vessel, the adsorbent is heated by the heating vessel, and the first thermal medium having been adsorbed in the adsorbent is desorbed and released from the adsorbent. The first thermal medium so released is again absorbed by the moisture absorber when the capsule has moved back to the cooling vessel, and the capsule is cooled again by the airflow to repeat the cycle.

대표청구항 ▼

An adsorption cooling apparatus, comprising: (a) a hermetically sealed capsule made of a thermally conductive material, said capsule having a first side and a second side and containing a first thermal medium, a moisture absorber on said first side that can absorb said first thermal medium and an ad

An adsorption cooling apparatus, comprising: (a) a hermetically sealed capsule made of a thermally conductive material, said capsule having a first side and a second side and containing a first thermal medium, a moisture absorber on said first side that can absorb said first thermal medium and an adsorbent on said second side that can adsorb said first thermal medium at a low temperature and can desorb said first thermal medium at a high temperature, between said moisture absorber and said adsorbent in said capsule being a vacant space; (b) a cooling vessel containing a low temperature second thermal medium that is used for cooling an object to be cooled by the apparatus, aid cooling vessel having a cooling hole into which said capsule can be slidably fitted on said first side; (c) a heating vessel containing a high temperature third thermal medium, said heating vessel having a heating hole into which said capsule can be slidably fitted on said second side; (d) means for reciprocally and periodically moving said capsule in a manner that said capsule is moved into said cooling hole on said first side and, reversely, said capsule is moved into said heating hole on said second side; and (e) means for cooling said capsule that has been moved into said cooling hole on said first side so that said first thermal medium adsorbed by said adsorbent within said capsule while the capsule is cooled, whereby said second thermal medium in said cooling vessel is cooled because of a latent heat of evaporation of the first thermal medium, said adsorbent being heated by said heating means when said capsule is moved into said heating hole on said second side so that said first thermal medium adsorbed in said adsorbent in the capsule is desorbed and released from said adsorbent and the so released first thermal medium is again absorbed by said moisture absorber within said capsule; wherein said means for cooling said capsule includes heat dissipating fins externally mounted on said capsule and a cooling fan to produce a cooling airflow so that said fins are subjected to said airflow when said capsule is moved into said cooling hole on aid first side.