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HDI impedance matched microwave circuit assembly 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H03H-007/38
  • H05K-003/10
  • H05K-003/30
출원번호 US-0869090 (1992-04-14)
발명자 / 주소
  • Kornrumpf William P. (Albany NY) Wojnarowski Robert J. (Ballston Lake NY) Eichelberger Charles W. (Schenectady NY)
출원인 / 주소
  • General Electric Company (Schenectady NY 02)
인용정보 피인용 횟수 : 52  인용 특허 : 0

초록

Active components of a microwave system are interconnected on a substrate by a dielectric-overlay, high-density-interconnect structure in a manner which provides close impedance matching, minimizes impedance discontinuities and substantially increases the yield of good circuits.

대표청구항 ▼

A electronic system comprising: a substrate having a first surface; a ground plane conductor disposed on said first surface; an electronic component disposed on a surface of said ground plane conductor, said component having a first surface facing away from said ground plane conductor and a terminal

이 특허를 인용한 특허 (52)

  1. Dov, Lewis R.; Casey, John F., Apparatus and method to form ground connections.
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  2. Chen, Howard E., Apparatus and methods related to ground paths implemented with surface mount devices.
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  3. Theuss, Horst, Device and method for manufacturing a device.
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  4. Theuss, Horst, Device and method for manufacturing a device.
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  5. Tuominen, Risto; Palm, Petteri, Electric module having a conductive pattern layer.
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  6. Rose, James Wilson; Durocher, Kevin Matthew; Sherman, Donna Marie; Astley, Oliver Richard, Electrical interface for a sensor array.
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  7. Tuominen, Risto; Palm, Petteri, Electronic module with a conductive-pattern layer and a method of manufacturing same.
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  8. Tuominen, Risto; Palm, Petteri, Electronic module with a conductive-pattern layer and a method of manufacturing same.
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  9. Nalla, Ravi K; Delaney, Drew, Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages.
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  10. Nalla, Ravi K; Delaney, Drew W, Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages.
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  11. Wachtler Kurt P. ; Walter David N. ; Mowatt Larry J., HDI land grid array packaged device having electrical and optical interconnects.
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  12. Boulay, Jean Marie; Ghannam, Ayad, High power semiconductor device for wireless applications and method of forming a high power semiconductor device.
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  13. Masuda, Kazutoshi, High-frequency device.
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  14. Saso Toru,JPX, High-frequency integrated circuit device and manufacture method thereof.
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  15. Ishikawa Yohei,JPX ; Sakamoto Koichi,JPX ; Yamashita Sadao,JPX ; Kajikawa Takehisa,JPX, High-frequency semiconductor device having microwave transmission line being formed by a gate electrode source electrode and a dielectric layer in between.
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  16. Dove Lewis R ; Casey John F ; Blume Anthony R, Integrated low cost thick film RF module.
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  17. Burdick, Jr., William Edward; Rose, James Wilson; Durocher, Kevin Matthew; Fillion, Raymond Albert, Interconnection method using an etch stop.
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  18. Burdick, Jr., William Edward; Rose, James Wilson; Durocher, Kevin Matthew; Fillion, Raymond Albert, Interconnection structure with etch stop.
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  19. Astley, Oliver Richard; Rose, James Wilson; Lacey, Joe James; Short, Jonathan David; Joshi, Ashutosh, Interface assembly for thermally coupling a data acquisition system to a sensor array.
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  20. Tuominen, Risto; Palm, Petteri; Iihola, Antti, Manufacture of a circuit board and circuit board containing a component.
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  21. Tuominen, Risto; Palm, Petteri; Lihola, Antti, Manufacture of a circuit board containing a component.
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  22. Coomer, Boyd L., Method and system to manufacture stacked chip devices.
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  23. Pogge H. Bernhard ; Davari Bijan ; Greschner Johann,DEX ; Kalter Howard L., Method for fabricating a very dense chip package.
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  24. Tuominen, Risto; Iihola, Antti; Palm, Petteri, Method for manufacturing a circuit board.
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  25. Tuominen, Risto; Iihola, Antti; Palm, Petteri, Method for manufacturing a circuit board structure.
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  26. Tuominen, Risto; Iihola, Antti; Palm, Petteri, Method for manufacturing a circuit board structure.
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  27. Tuominen, Risto; Iihola, Antti; Palm, Petteri, Method for manufacturing a circuit board structure, and a circuit board structure.
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  28. Iihola, Antti; Jokela, Timo, Method for manufacturing an electronic module.
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  29. Tuominen, Risto; Palm, Petteri; Iihola, Antti, Method for manufacturing an electronic module and an electronic module.
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  30. Tuominen, Risto; Palm, Petteri; Iihola, Antti, Method for manufacturing an electronic module and an electronic module.
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  31. Iihola, Antti; Jokela, Timo, Method for manufacturing an electronic module in an installation base.
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  32. Iihola, Antti; Jokela, Timo; Palm, Petteri; Tuominen, Risto, Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layer.
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  33. Lee Alfred E. ; Davidheiser Roger A. ; Lau James C., Method of making compact integrated microwave assembly system.
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  34. Chua,Swee Kwang; Low,Siu Waf; Chia,Yong Poo; Eng,Meow Koon; Neo,Yong Loo; Boon,Suan Jeung; Huang,Suangwu; Zhou,Wei, Method of making multichip wafer level packages and computing systems incorporating same.
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  35. Guida, Renato, Method of reducing shear stresses on IC chips and structure formed thereby.
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  36. Renato Guida, Method of reducing shear stresses on IC chips and structure formed thereby.
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  37. Buer,Kenneth V., Methods and devices for providing bias to a monolithic microwave integrated circuit.
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  38. Buer,Kenneth V, Methods for providing bias to a monolithic microwave integrated circuit.
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  39. Almeida, Antonio; Joshi, Shankar; Rohde, Meta; Sridharan, Mahadevan, Microwave frequency surface mount components and methods of forming same.
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  40. Buer, Kenneth V., Monolithic microwave integrated circuit with bondwire and landing zone bias.
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  41. Pogge H. Bernhard ; Iyer Subramania S., Process for precise multichip integration and product thereof.
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  42. Chen, Howard E.; Read, Matthew Sean; Nguyen, Hoang Mong; LoBianco, Anthony James; Zhang, Guohao; Hoang, Dinhphuoc Vu, Racetrack design in radio frequency shielding applications.
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  43. Chen, Howard E.; Read, Matthew Sean; Nguyen, Hoang Mong; LoBianco, Anthony James; Zhang, Guohao; Hoang, Dinhphuoc Vu, Racetrack layout for radio frequency isolation structure.
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  44. Chen, Howard E.; Read, Matthew Sean; Nguyen, Hoang Mong; LoBianco, Anthony James; Zhang, Guohao; Hoang, Dinhphuoc Vu, Racetrack layout for radio frequency shielding.
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  45. Chen, Howard E.; Read, Matthew Sean; Nguyen, Hoang Mong; LoBianco, Anthony James; Zhang, Guohao; Hoang, Dinhphuoc Vu, Radio frequency isolation structure with racetrack.
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  46. Hsu, Chien-Min; Wu, Shih-Hsien; Chang, Jing-Yao; Chang, Tao-Chih; Cheng, Ren-Shin; Lee, Min-Lin, Signal transmission board and method for manufacturing the same.
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  47. Pogge H. Bernhard ; Iyer Subramania S., Structure for precision multichip assembly.
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  48. Pogge H. Bernhard ; Davari Bijan ; Greschner Johann,DEX ; Kalter Howard L., Very dense chip package.
    상세보기
  49. Pogge H. Bernhard ; Greschner Johann,DEX ; Kalter Howard Leo ; Rosner Raymond James, Very dense integrated circuit package.
    상세보기
  50. Pogge H. Bernhard ; Greschner Johann,DEX ; Kalter Howard Leo ; Rosner Raymond James, Very dense integrated circuit package and method for forming the same.
    상세보기
  51. Pogge H. Bernhard, Wafer thickness compensation for interchip planarity.
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  52. Pogge, H. Bernhard, Wafer thickness compensation for interchip planarity.
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