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Apparatus for supercritical cleaning 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B08B-003/10
출원번호 US-0967219 (1992-10-27)
발명자 / 주소
  • Mielnik Richard J. (Erie PA) Metalonis John A. (Erie PA) Reber Richard K. (Erie PA) Rosio Larry R. (Erie PA) Shore Stephen H. (Erie PA) Smith Charles W. (Erie PA)
출원인 / 주소
  • Autoclave Engineers, Ltd. (Erie PA 02)
인용정보 피인용 횟수 : 63  인용 특허 : 0

초록

An apparatus for precision cleaning with carbon dioxide includes a pressure vessel having a removable cleaning drum with a sanitized work zone, a separator for regenerating spent carbon dioxide, and pressure and temperature monitoring and control devices to maintain the carbon dioxide in a supercrit

대표청구항

A system for cleaning a workpiece with a supercritical cleaning fluid, comprising: a pressure vessel, an open ended cleaning drum positioned in the vessel and defining a work zone for receiving the workpiece, said pressure vessel enclosing an annular space around said drum, said pressure vessel havi

이 특허를 인용한 특허 (63)

  1. Cotte, John Michael; McCullough, Kenneth John; Moreau, Wayne Martin; Pope, Keith R.; Simons, John P.; Taft, Charles J., Apparatus for cleaning filters.
  2. Marshall, Mary C.; Franjione, John G.; Freitas, Christopher J.; Roberds, William T.; Pollard, Gordon D.; Blake, Jill, Apparatus for contaminant removal using natural convection flow and changes in solubility concentrations by temperature.
  3. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of a workpiece.
  4. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Apparatus for supercritical processing of multiple workpieces.
  5. Lee, Hyo-san; Hong, Chang-ki; Lee, Kun-tack; Han, Jeong-nam, Apparatus for treating wafers using supercritical fluid.
  6. Preston, A. Duane; Turner, Jon R.; Svoboda, Charles, Carbon dioxide dry cleaning system.
  7. Jones,William Dale, Control of fluid flow in the processing of an object with a fluid.
  8. Kuo, Tzu-Chen, Fluid driven agitator used in densified gas cleaning system.
  9. Sheydayi,Alexei; Sutton,Thomas, Gate valve for plus-atmospheric pressure semiconductor process vessels.
  10. Sutton, Thomas R.; Biberger, Maximilan A., High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism.
  11. Jones, William D., High pressure fourier transform infrared cell.
  12. Mizobata,Ikuo; Muraoka,Yusuke; Saito,Kimitsugu; Kitakado,Ryuji; Inoue,Yoichi; Sakashita,Yoshihiko; Watanabe,Katsumi; Yamagata,Masahiro; Oshiba,Hisanori, High pressure processing apparatus and method.
  13. Mizobata,Ikuo; Muraoka,Yusuke; Saito,Kimitsugu; Kitakado,Ryuji; Inoue,Yoichi; Sakashita,Yoshihiko; Watanabe,Katsumi; Yamagata,Masahiro; Oshiba,Hisanori, High pressure processing apparatus and method.
  14. Biberger, Maximilian A.; Layman, Frederick Paul; Sutton, Thomas Robert, High pressure processing chamber for semiconductor substrate.
  15. Biberger,Maximilian A.; Layman,Frederick Paul; Sutton,Thomas Robert, High pressure processing chamber for semiconductor substrate.
  16. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  17. Jones,William Dale, High-pressure processing chamber for a semiconductor wafer.
  18. Sheydayi,Alexei, Method and apparatus for clamping a substrate in a high pressure processing system.
  19. Goshi,Gentaro, Method and apparatus for cooling motor bearings of a high pressure pump.
  20. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method and apparatus for supercritical processing of multiple workpieces.
  21. Parent,Wayne M.; Goshi,Gentaro, Method and system for cooling a pump.
  22. Parent,Wayne M., Method and system for determining flow conditions in a high pressure processing system.
  23. Parent, Wayne M.; Geshell, Dan R., Method and system for passivating a processing chamber.
  24. Hansen,Brandon; Lowe,Marie, Method and system for treating a substrate with a high pressure fluid using fluorosilicic acid.
  25. McDermott,Wayne Thomas; Parris,Gene Everad; Roth,Dean Van John; Subawalla,Hoshang, Method for removal of flux and other residue in dense fluid systems.
  26. Kawamura,Kohei; Asano,Akira; Miyatani,Koutarou; Hillman,Joseph T.; Palmer,Bentley, Method for supercritical carbon dioxide processing of fluoro-carbon films.
  27. Biberger, Maximilian Albert; Layman, Frederick Paul; Sutton, Thomas Robert, Method for supercritical processing of multiple workpieces.
  28. Arai Kunio,JPX ; Inomata Hiroshi,JPX ; Smith Richard Lee,JPX, Method for using high density compressed liquefied gases in cleaning applications.
  29. Biberger, Maximilian A.; Schilling, Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  30. Biberger,Maximilian A.; Schilling,Paul E., Method of depositing metal film and metal deposition cluster tool including supercritical drying/cleaning module.
  31. Yates, Donald L., Method of reducing water spotting and oxide growth on a semiconductor structure.
  32. Yates,Donald L., Method of reducing water spotting and oxide growth on a semiconductor structure.
  33. Yates,Donald L., Method of reducing water spotting and oxide growth on a semiconductor structure.
  34. Yates,Donald L., Method of reducing water spotting and oxide growth on a semiconductor structure.
  35. Biberger,Maximilian Albert; Layman,Frederick Paul; Sutton,Thomas Robert, Method of supercritical processing of a workpiece.
  36. Sheydayi,Alexei, Non-contact shuttle valve for flow diversion in high pressure systems.
  37. Evans Jeffrey Jonathan ; Hong Siu-Ping ; Ray Urmi ; Thiele Trudy Murrell, Optical fiber preform cleaning method.
  38. Sheydayi,Alexei, Pressure energized pressure vessel opening and closing device and method of providing therefor.
  39. Uehara, Katsuhiro; Sakashita, Yoshihiko; Kanda, Takeshi; Nishimoto, Takeo, Pressure processing device.
  40. Schulmeyr, Josef; Geyer, Stefan; Gehrig, Manfred, Pressure vessel arrangement comprising an external pressure vessel and at least one insert basket.
  41. Wuester,Christopher D., Process flow thermocouple.
  42. Fogelman, Kimber D.; Worley, Vincent; Sullivan, Peter, Process flowstream collection system.
  43. McDermott,Wayne Thomas; Subawalla,Hoshang; Johnson,Andrew David; Schwarz,Alexander, Processing of semiconductor components with dense processing fluids and ultrasonic energy.
  44. Subawalla,Hoshang; Parris,Gene Everad; Rao,Madhukar Bhaskara; Kretz,Christine Peck, Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols.
  45. Smith ; Jr. William Charles (Verbank NY) Lord Donn Allan (Hyde Park NY), Programmable apparatus for cleaning semiconductor elements.
  46. Mullee, William H.; de Leeuwe, Marc; Roberson, Jr., Glenn A., Removal of CMP residue from semiconductor substrate using supercritical carbon dioxide process.
  47. Mullee William H. ; de Leeuwe Marc ; Roberson ; Jr. Glenn A., Removal of CMP residue from semiconductors using supercritical carbon dioxide process.
  48. Summerfield John W. ; Markiewicz John P. ; Moses John M. ; Barcus Randall L., Removal of contaminants from materials.
  49. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  50. Mullee, William H., Removal of photoresist and photoresist residue from semiconductors using supercritical carbon dioxide process.
  51. William H. Mullee ; Maximilian A. Biberger ; Paul E. Schilling, Removal of photoresist and residue from substrate using supercritical carbon dioxide process.
  52. Koch Robert, Removal of polishing residue from substrate using supercritical fluid process.
  53. Mullee William H., Removal of resist or residue from semiconductors using supercritical carbon dioxide.
  54. Leblond, Danny, Rotative cleaning and sanitizing device.
  55. Malchesky, Paul S., Sub-critical fluid cleaning and antimicrobial decontamination system and process.
  56. Joyce, Patrick C.; Tipton, Adrianne; Shrinivasan, Krishnan; Hess, Dennis W.; Myneni, Satyanarayana; Levitin, Galit, Supercritical solutions for cleaning photoresist and post-etch residue from low-k materials.
  57. Fury,Michael A.; Sherrill,Robert Wade, System and method for mid-pressure dense phase gas and ultrasonic cleaning.
  58. Gale,Glenn; Hillman,Joseph T.; Jacobson,Gunilla; Palmer,Bentley, System and method for processing a substrate using supercritical carbon dioxide processing.
  59. Fogelman, Kimber D.; Wikfors, Edwin E.; Berger, Terry A., System and process for an active drain for gas-liquid separators.
  60. Jacobson,Gunilla; Yellowaga,Deborah, Treatment of a dielectric layer using supercritical CO.
  61. Kevwitch, Robert, Treatment of substrate using functionalizing agent in supercritical carbon dioxide.
  62. Sheydayi,Alexei, Vacuum chuck utilizing sintered material and method of providing thereof.
  63. Yoshizumi Satoshi,JPX ; Oda Toshiharu,JPX, Weathered reef-building coral material.
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