이 특허를 인용한 특허 (71)

1. Hsu, Louis L.; Ji, Brian L.; Liu, Fei; Murray, Conal E., Air channel interconnects for 3-D integration.

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2. Bhatia Rakesh ; Padilla Robert D., Apparatus for managing heat in a computer environment or the like.

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3. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Atomizer.

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4. Carl Kabrell FI; Reijo Lehtiniemi FI; Jukka Rantala FI; Timo Heikkila FI; Tapio Tuamainen FI, Cooling apparatus based on heat energy bound to working fluid in phase transition.

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5. Searby,Tom J., Cooling apparatus for electronic devices.

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6. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion.

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7. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.

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8. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.

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9. Parish, IV, Overton L.; DeVilbiss, Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.

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10. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.

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11. Parish, IV,Overton L.; DeVilbiss,Roger S., Cooling apparatus having low profile extrusion and method of manufacture therefor.

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12. Ouyang, Chien, Cooling technique using a heat sink containing swirling magneto-hydrodynamic fluid.

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13. Ouyang,Chien, Cooling technique using multiple magnet array for magneto-hydrodynamic cooling of multiple integrated circuits.

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14. Chrysler, Gregory M.; Maveety, James G., Die having a via filled with a heat-dissipating material.

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15. Lakhi Nandlal Goenka ; Zhong-You Shi, Electrical circuit board and method for making the same.

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16. Cheng, Ying-Yen; Hsiao, Ya-Lin, Electronic assembly and electronic device.

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17. Baba, Shunji; Fukuzono, Kenji; Hoshino, Yuki, Electronic device and method for manufacturing same.

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18. Schick,Philippe, Electronic device package with an integrated evaporator.

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19. Stefanoski, Zoran, Embedded heat pipe in a hybrid cooling system.

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20. Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.

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21. Ouyang, Chien, Enhanced heat pipe cooling with MHD fluid flow.

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22. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporator employing a liquid superheat tolerant wick.

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23. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.

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24. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Evaporators including a capillary wick and a plurality of vapor grooves and two-phase heat transfer systems including such evaporators.

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25. Ouyang,Chien, Feedback controlled magneto-hydrodynamic heat sink.

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26. Ouyang, Chien, Ferrofluid-cooled heat sink.

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27. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Flow controller.

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28. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Geometrically reoriented low-profile phase plane heat pipes.

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29. Garner, Scott, Heat dissipation unit with direct contact heat pipe.

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30. Quisenberry,Tony; Havis,Clark R., Heat pipe connection system and method.

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31. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.

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32. Furukawa Yuichi,JPX ; Sumitani Mitsugu,JPX ; Ito Tomio,JPX, Heat sink for portable electronic devices.

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33. Ouyang,Chien, Heat sink having ferrofluid-based pump for nanoliquid cooling.

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34. Ouyang,Chien, Heat sink having magnet array for magneto-hydrodynamic hot spot cooling.

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35. Shabany, Younes, Heat transfer system with integrated evaporator and condenser.

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36. Brownell Michael ; McCutchan Dan ; Xie Hong ; Haley Kevin, Injection molded thermal interface system.

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37. Patel Janak G., Integrated heatsink and heatpipe.

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38. Ouyang, Chien; Gross, Kenneth C., Intelligent microchannel cooling.

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39. Wu, Jiahn-Chang, LED matrix substrate with convection holes.

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40. Arik, Mehmet; Weaver, Jr., Stanton Earl, Light emitting chip apparatuses with a thermally superconducting heat transfer medium for thermal management.

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41. Harrah, Shane, Lighting device package.

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42. Ouyang, Chien, Magneto-hydrodynamic heat sink.

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43. Ouyang,Chien, Magneto-hydrodynamic heat sink.

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44. Ouyang,Chien, Magneto-hydrodynamic heat sink.

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45. Ouyang, Chien, Magneto-hydrodynamic hot spot cooling heat sink.

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46. Porter, George K.; Wolf, Seth B.; Albrecht, Charles W., Manifolded fluid delivery system.

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47. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.

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48. Quisenberry, Tony, Method and system for automotive battery cooling.

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49. Quisenberry, Tony, Method for automotive battery cooling.

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50. Garner, Scott, Method for forming a heat dissipation device.

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51. Parish, Overton L.; Quisenberry, Tony; Havis, Clark R., Method of removing heat utilizing geometrically reoriented low-profile phase plane heat pipes.

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52. Chrysler, Gregory M.; Maveety, James G., Micro-chimney and thermosiphon die-level cooling.

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53. Chrysler,Gregory M.; Maveety,James G., Micro-chimney and thermosiphon die-level cooling.

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54. Chrysler,Gregory M.; Maveety,James G., Micro-chimney and thermosiphon die-level cooling.

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55. Kinoshita, Satoshi; Egawa, Akira, Microchannel structure and manufacturing method therefor, light source device, and projector.

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56. Fuesser Hans-Juergen,DEX ; Zachai Reinhard,DEX ; Muench Wolfram,DEX ; Gutheit Tim,DEX, Microcooling device and method of making it.

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57. Ouyang, Chien; Gross, Kenneth C., Multichannel cooling system with magnetohydrodynamic pump.

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58. Rightley, Michael J.; Adkins, Douglas R.; Mulhall, James J.; Robino, Charles V.; Reece, Mark; Smith, Paul M.; Tigges, Chris P., Parallel-plate heat pipe apparatus having a shaped wick structure.

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59. Platt Richard, Printed circuit board with embedded integrated circuit.

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60. Mohammad A. Tantoush, Scalable and modular heat sink-heat pipe cooling system.

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61. Tantoush, Mohammad A., Scalable and modular heat sink-heat pipe cooling system.

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62. Belady Christian L., Semiconductor package lid with internal heat pipe.

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63. Park, JaeHong; Lee, Hanhong; Joo, Sungwoo; Baek, Woon-young, Semiconductor packages that include a heat pipe for exhausting heat from one or more ends of the package.

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64. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.

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65. Parish, IV,Overton L.; Quisenberry,Tony, Stacked low profile cooling system and method for making same.

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66. Stefanoski, Zoran; Kim, Jeong H., System for efficiently cooling a processor.

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67. Wu, Xin-Yi; Chou, Jui-Chih; Shen, Hsuan-Jen, Temperature control module for a socket.

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68. Thomas Daniel Lee, Thin planar heat spreader.

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69. Quisenberry,Tony; Hester,Darren C.; Parish,Overton L., Toroidal low-profile extrusion cooling system and method thereof.

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70. Patel, Sammit A.; Xu, Yongjie; Gu, Qiyun; Brown, Richard W., Vapor chamber amplifier module.

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71. Kroliczek, Edward J.; Wrenn, Kimberly R.; Wolf, Sr., David A., Wick having liquid superheat tolerance and being resistant to back-conduction, evaporator employing a liquid superheat tolerant wick, and loop heat pipe incorporating same.

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