$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Chip carrier for optical device 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-023/02
출원번호 US-0035949 (1993-03-23)
우선권정보 JP-0064818 (1992-03-23); JP-0228120 (1992-08-27)
발명자 / 주소
  • Nagano Tuyosi (Tokyo JPX)
출원인 / 주소
  • NEC Corporation (Tokyo JPX 03)
인용정보 피인용 횟수 : 37  인용 특허 : 0

초록

A chip carrier for an optical device according to the present invention has a carrier body of insulating material, an external electrode, a glass cover fixed on one end of the carrier body, and a metal cover fixed on the other end of the carrier body. The optical device is connected at an electrode

대표청구항

A chip carrier for an optical device, comprising: an insulating board with an aperture which is narrow enough to mount said optical device over said aperture on said insulating board and wide enough to optically couple said optical apparatus to an external device; a lead on said insulating board, sa

이 특허를 인용한 특허 (37)

  1. Tandy, Patrick W., Apparatus and method for marking defective sections of laminate substrates.
  2. Peterson, Kenneth A.; Watson, Robert D., Bi-level microelectronic device package with an integral window.
  3. Wang Bily,TWX, Folded heat sink for semiconductor device package.
  4. Patrick W. Tandy, Integrated circuit substrate having through hole markings to indicate defective/non-defective status of same.
  5. Boon,Suan Jeung; Chia,Yong Poo; Neo,Yong Loo; Chua,Swee Kwang; Low,Siu Waf, Leadless packaging for image sensor devices.
  6. Boon,Suan Jeung; Chia,Yong Poo; Neo,Yong Loo; Chua,Swee Kwang; Low,Siu Waf, Leadless packaging for image sensor devices and methods of assembly.
  7. Shiraishi, Akinori, Light transmissive cover, device provided with same and methods for manufacturing them.
  8. Shiraishi,Akinori, Light transmissive cover, device provided with same and methods for manufacturing them.
  9. Wang, Bily; Chang, Bill, Mass production technique for surface mount optical device with a focusing cup.
  10. Peterson, Kenneth A.; Watson, Robert D., Method of fabricating a microelectronic device package with an integral window.
  11. Murata,Akihiro, Method of manufacturing an optical device.
  12. Kenneth A. Peterson ; Robert D. Watson, Microelectronic device package with an integral window.
  13. Glenn Thomas P., Mounting for a semiconductor integrated circuit device.
  14. Glenn Thomas P., Mounting having an aperture cover with adhesive locking feature for flip chip optical integrated circuit device.
  15. Peterson, Kenneth A.; Watson, Robert D., Multilayered microelectronic device package with an integral window.
  16. Murata, Akihiro, Optical device and method of manufacture thereof, and electronic instrument.
  17. Camacho, Zigmund R.; Bathan, Henry D.; Tay, Lionel Chien Hui; Trasporto, Arnel Senosa, Optical semiconductor device having pre-molded leadframe with window and method therefor.
  18. Vittu, Julien, Optical semiconductor housing and method for making same.
  19. Brechignac,Remi; Exposito,Juan, Optical semiconductor package with incorporated lens and shielding.
  20. Ramchen, Johann; Zitzlsperger, Michael, Optoelectronic component.
  21. Hur Ki-Rok,KRX, Package for solid state image sensing device and method for manufacturing thereof.
  22. Sun, Cheng-Kuang; Cheng, Kuang-Chih; Lee, Kuang-Shin, Package structure for optical image sensing integrated circuits.
  23. Hodges Joe W., Packaging for bare dice employing EMR-sensitive adhesives.
  24. Haematsu,Hitoshi, Semiconductor device and manufacturing method thereof.
  25. Maekawa Hideaki,JPX, Semiconductor device having an improved structure for storing a semiconductor chip.
  26. Jeong, Moon Chea; Kim, Young Dae, Semiconductor device packages having semiconductor chips attached to circuit boards, and stack packages using the same.
  27. Tamaki, Hiroto; Nakabayashi, Takuya, Side-view light emitting device including base body having protruding component.
  28. Tamaki, Hiroto; Nakabayashi, Takuya, Side-view type light emitting device including base body having protruding component.
  29. Peterson, Kenneth A.; Watson, Robert D., Single level microelectronic device package with an integral window.
  30. Shinichi Nakada JP, Solid state image sensing device.
  31. Nakamura,Tsutomu; Hosokai,Shigeru; Miyata,Kenji, Solid-state image pickup apparatus having a hermetic seal portion and fabricating method thereof.
  32. Sano Yoshikazu,JPX ; Terakawa Sumio,JPX ; Tsujii Eiichi,JPX ; Asaumi Masaji,JPX ; Chatani Yoshikazu,JPX, Solid-state image sensing apparatus and manufacturing method thereof.
  33. Nakada Shinichi,JPX, Solid-state image sensing device.
  34. Shinichi Nakada JP, Solid-state image sensing device.
  35. Shimizu, Katsutoshi; Minamio, Masanori; Yamauchi, Kouichi, Solid-state imaging device.
  36. Shimizu, Katsutoshi; Minamio, Masanori; Yamauchi, Kouichi, Solid-state imaging device.
  37. Thomas P. Glenn, Surface acoustical wave flip chip.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로