[특허]Cooling apparatus of electronic equipment

Cooling apparatus of electronic equipment 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H05K-007/20
출원번호	US-0115669 (1993-09-02)
우선권정보	JP-0284263 (1990-10-24)
발명자 / 주소	Kondou Yoshihiro (Ibaraki JPX) Matsushima Hitoshi (Ryugasaki JPX) Hatada Toshio (Tsuchiura JPX) Inouye Hiroshi (Ibaraki JPX) Komatsu Toshihiro (Ibaraki JPX) Ohba Takao (Hadano JPX) Yamagiwa Akira (Ha
출원인 / 주소	Hitachi Ltd. (Tokyo JPX 03)
인용정보	피인용 횟수 : 90 인용 특허 : 0

초록 ▼

In a cooling apparatus of an electronic equipment, a plurality each of integrated circuit devices and large-scale integrated circuit devices are mounted onto a plurality of substrates, respectively, and a cooling fan supplies cooling air from outside to each of these integrated circuit devices. A duct having a comb-tooth shape suitable for encompassing each substrate and defining flow paths along the substrates introduces the cooling air supplied by the cooling fan to each of the integrated circuit devices. The duct includes a plurality of small holes disposed at positions corresponding to the positions of the integrated circuit devices on the substrates and having open areas corresponding to the heating values of the integrated circuit devices. The small holes flow the cooling air supplied by the cooling fan as jet streams to the integrated circuit devices. This jet stream cooling improves cooling performance and can make uniform the temperature distribution of the integrated circuit devices.

대표청구항 ▼

In combination, an electronic equipment and a jet stream cooling apparatus for the electronic equipment, said electronic equipment including a plurality of substrates, each of said substrates having a plurality of IC chips and LSI packages mounted thereto; said cooling apparatus including first fan means provided at one end of said substrates for supplying a fresh cooling fluid to said IC chips and LSI packages; a duct provided between said first fan means and said IC ships and LSI packages, said duct having comb-tooth shaped projections, said comb-tooth shaped projections forming flow paths along the substrates; and one or more second fan means provided on a part of said projections and opposite to said IC chips or LSI packages provided on said substrates for cooling said IC chips or said LSI packages, said first fan means and said second fan means cooperating to impinge said fresh cooling fluid as a jet stream on said IC chips or LSI packages for cooling.

이 특허를 인용한 특허 (90)

Kondou Yoshihiro,JPX ; Nakajima Tadakatsu,JPX ; Ohashi Shigeo,JPX ; Iwai Susumu,JPX ; Miyazaki Masayoshi,JPX ; Fuse Shoohei,JPX ; Morita Kazuo,JPX ; Fukunaka Hidetada,JPX, Air cooled electronic equipment apparatus.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Bernstein, Kerry; Brunschwiler, Thomas; Michel, Bruno, Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly.
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Hoffman, Mark S.; Drahms, David C., Circuit board cover with exhaust apertures for cooling electronic components.
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Garner, Scott D., Thermal management system and method for electronics system.
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Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
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Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
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Brunschwiler, Thomas J.; Linderman, Ryan J.; Michel, Bruno; Ruetsche, Erich M., Variable flow computer cooling system for a data center and method of operation.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Cooling apparatus of electronic equipment 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (90)

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연합인증

Cooling apparatus of electronic equipment 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

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이 특허를 인용한 특허 (90)

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