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Wedge bump bonding apparatus and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/607
출원번호 US-0060085 (1993-05-10)
발명자 / 주소
  • Davidson R. Paul (Plymouth MN)
출원인 / 주소
  • Hughes Aircraft Company (Los Angeles CA 02)
인용정보 피인용 횟수 : 90  인용 특허 : 0

초록 ▼

An apparatus for applying interconnect bumps to an integrated circuit comprising a wedge bonder assembly (10) including a bonding tool (14) adapted to be selectively moved relative to the integrated circuit (42) and to transmit ultrasonic force to bond wire or ribbon (62) located between the bonding

대표청구항 ▼

A bonding tool for use with a wedge bonder assembly for applying interconnect bumps to an integrated circuit, which bonding tool comprises: a tool body having a longitudinal axis and a distal end; a bonding portion on said distal end having a flat bonding face perpendicular to said longitudinal axis

이 특허를 인용한 특허 (90)

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