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연합인증

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Packaging electrical components

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0177797 (1994-01-06)
발명자 / 주소
  • Vinciarelli Patrizio (Boston MA) Finnemore Fred (No. Reading MA) Balog John S. (Mendon MA) Johnson Brant T. (Concord MA)
출원인 / 주소
  • VLT Corporation (San Antonio TX 02)
인용정보 피인용 횟수 : 106  인용 특허 : 0

초록

A package for electrical components in which a circuit board holds the components. The package includes an enclosure having generally parallel, spaced apart upper and lower internal surfaces. The circuit board lies generally parallel to the lower internal surface with the electrical components held

대표청구항

A package for electrical components, comprising a circuit board for holding the electrical components, an enclosure having generally parallel, spaced apart upper and lower internal surfaces, the circuit board lying generally parallel to the lower internal surface with the electrical components held

이 특허를 인용한 특허 (106)

  1. Sharifipour, Bahman; Hu, Kaiti, AC-DC input adapter.
  2. Vinciarelli,Patrizio; Briere,Michael; Dumas,Jeffrey Gordon, Active filtering.
  3. Ye, Zhen Z.; Dunn, Jamie, Adaptive digital control of power factor correction front end.
  4. Sharifipour, Bahman; Jansen, Arian, Apparatus for and method of cooling electronic circuits.
  5. Sharifipour, Bahman; Jansen, Arian, Apparatus for and method of cooling molded electronic circuits.
  6. Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Apparatus for circuit encapsulation.
  7. Ye, Zhen Z.; Xu, Xiangping, Approach for generation of power failure warning signal to maximize useable hold-up time with AC/DC rectifiers.
  8. Musser, Jordon; Stratas, Chris, Automotive LED headlight cooling system.
  9. Chen Shiaw-Jong Steve ; Lin Feng, Auxiliary bias circuit for a power supply and a method of operation thereof.
  10. Chen Shiaw-Jong Steve ; Lin Feng, Board mounted power supply having an auxiliary output.
  11. Rozman Allen Frank ; Stevens David Leonard, Board-mountable power supply module.
  12. Telefus, Mark; Sharifipour, Bahman, Cascade power system architecture.
  13. John R. Saxelby, Jr. ; Walter R. Hedlund, III, Circuit encapsulation.
  14. Saxelby, Jr., John R.; Hedlund, III, Walter R., Circuit encapsulation.
  15. Saxelby ; Jr. John R. ; Hedlund ; III Walter R., Circuit encapsulation process.
  16. Wood Jonathan R., Circuit for use in a DC-DC converter having a booster module.
  17. Telefus, Mark, Closed loop negative feedback system with low frequency modulated gain.
  18. Parker, David Alan, Combination electrical power distribution and heat dissipating device.
  19. Teng, Shih-Liang; Lin, Wei-Liang; Teng, Po-Cheng; Yeh, Kuo-Chu, Compact server power supply having high power density.
  20. Vinciarelli,Patrizio; Prager,Jay, Components having actively controlled circuit elements.
  21. Montminy Steven Norman ; Shaffer Brian James ; Vinciarelli Patrizio, Configuring power converters.
  22. Schröder gen. Berghegger, Ralf; Malsch, Rüdiger, Control circuit for a primary controlled switched mode power supply with improved accuracy of the voltage control and primary controlled switched mode power supply.
  23. Telefus, Mark; Li, Wei, Control method to reduce switching loss on MOSFET.
  24. Hamstra, James R., Coordinated power sequencing to limit inrush currents and ensure optimum filtering.
  25. Telefus, Mark, Depletion MOSFET driver.
  26. Glickman, Michael James; Bergman, Mark; Vrtis, Joan, Diffuse fiber optic lighting for luggage.
  27. Telefus, Jr., Mark, Digital error signal comparator.
  28. Saxelby ; Jr. John R. ; Johnson Brant T., Direct metal bonding.
  29. Saxelby ; Jr. John R. ; Johnson Brant T., Direct metal bonding.
  30. Telefus, Mark, Electromagnetic interference emission suppressor.
  31. Nobori,Kazuhiro; Ikeda,Satoshi; Kato,Yasushi; Nakajima,Yasufumi, Electronic circuit device having circuit board electrically connected to semiconductor element via metallic plate.
  32. Nobori, Kazuhiro; Ikeda, Satoshi; Kato, Yasushi; Nakajima, Yasufumi, Electronic circuit device including metallic member having installation members.
  33. Jacobsson, Henrik; Yu, Pui Yin, Embedded coins for HDI or SEQ laminations.
  34. Bergman, Mark; Shang, Shurui; Vrtis, Joan K., Embedded components in a substrate.
  35. Kroener, Helmut; Sartorius, Peter, Embedded high frequency RFID.
  36. Lotfi Ashraf Wagih ; Weld John David ; Wolf Karl Erich ; Woods William Lonzo, Encapsulated package for power magnetic devices and method of manufacture therefor.
  37. Telefus, Mark, Energy conversion architecture with secondary side control delivered across transformer element.
  38. Yang, Zaohong; Garrity, Paul, Energy recovery snubber circuit for power converters.
  39. Cheung, Dason; Kurwa, Murad; Loi, Richard, Energy saving-exhaust control and auto shut off system.
  40. Lopez, Omar Garcia; Ahumada Quintero, Pedro Alejandro; Secada, Enrique Avelar; Kurwa, Murad; Gonzalez, Juan Carlos, Escape routes.
  41. Vinciarelli Patrizio ; Foley Jeremiah Noel ; Nowak Scott William ; Skoolicas Charles Steven, Fabrication rules based automated design and manufacturing system and method.
  42. Vinciarelli, Patrizio; Foley, Jeremiah Noel; Nowak, Scott William; Skoolicas, Charles Steven, Fabrication rules based automated design and manufacturing system and method.
  43. Nguyen, Jennifer; Geiger, David; Aranda, Ranilo; Sjoberg, Jonas; Mohammed, Anwar; Kurwa, Murad, Fixture design for pre-attachment package on package component assembly.
  44. Ead George J., Flowing solder in a gap.
  45. Patrizio Vinciarelli ; John R. Saxelby, Jr., Heat dissipation for electronic components.
  46. Shabany, Younes, Heat transfer system with integrated evaporator and condenser.
  47. Telefus, Mark, High power converter architecture.
  48. Telefus, Mark, High power converter architecture.
  49. Jungreis, Aaron, High power factor isolated buck-type power factor correction converter.
  50. Jacobsson, Henrik, Inlay PCB with embedded coin board.
  51. Tinkler Ian ; Milroy Terry J. ; Fordyce Graham T., Integrated inductive assembly.
  52. Andrus Lance L. ; Curhan Jeffrey A., Laser machining of molded assemblies.
  53. Jungreis, Aaron, Line switcher for power converters.
  54. Schroeder gen Berghegger, Ralf, Load change detection for switched mode power supply with low no load power.
  55. Langley Philip David ; Boone Douglas, Low EMI emissions heat sink device.
  56. Vinciarelli Patrizio ; Prager Jay, Low profile mounting of power converters with the converter body in an aperture.
  57. Evans Michael D. ; Goss James D. ; Curhan Jeffrey A. ; Vinciarelli Patrizio, Making a connection between a component and a circuit board.
  58. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  59. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  60. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  61. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  62. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  63. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  64. Bang, Hyo-jae; Kim, Do-geun; Kim, Hong-kyun; Jeon, Young-bok, Memory device.
  65. Ye, Zhen Z., Method and implementation for eliminating random pulse during power up of digital signal controller.
  66. Telefus, Mark, Method of suppressing electromagnetic interference emission.
  67. Schroeder gen Berghegger, Ralf, Method to control a minimum pulsewidth in a switch mode power supply.
  68. Yang, Ping-Long; Li, Chia-Hsiang, Modular direct-current power conversion system and direct-current power conversion module thereof.
  69. Glickman, Michael James, Nano-copper solder for filling thermal vias.
  70. Telefus, Mark, No load detection.
  71. Telefus, Mark, No load detection and slew rate compensation.
  72. Weiss, Vernon; Faulk, Brett; Lam, Kean W.; Teltz, Richard W.; Hua, Fang, Notebook power supply with integrated subwoofer.
  73. Vinciarelli Patrizio ; Belland Robert E. ; Ead George J. ; Finnemore Fred M. ; Andrus Lance L., Packaging electrical circuits.
  74. Vinciarelli Patrizio ; Belland Robert E. ; Ead George J. ; Finnemore Fred M. ; Andrus Lance L., Packaging electrical circuits.
  75. Vinciarelli Patrizio ; Belland Robert E. ; Ead George J. ; Finnemore Fred M. ; Andrus Lance L., Packaging electrical circuits.
  76. Vinciarelli Patrizio ; Belland Robert E. ; Ead George J. ; Finnemore Fred M. ; Andrus Lance L., Packaging electrical circuits.
  77. Telefus, Mark, Peak power control technique for primary side controller operation in continuous conduction mode.
  78. Zhang, Xiaoyang, Power adaptor and storage unit for portable devices.
  79. Vinciarelli, Patrizio; Finnemore, Fred M.; Lafleur, Michael B.; McCauley, Charles I.; Keay, Gary C.; Nowak, Scott W.; Thompson, Basil, Power converter.
  80. Vinciarelli, Patrizio; LaFleur, Michael B., Power converter.
  81. Saxelby, Jr., John R.; Evans, Michael D.; Vinciarelli, Patrizio, Power converter assembly.
  82. Vinciarelli,Patrizio; Finnemore,Fred M.; McCauley,Charles I.; Keay,Gary C.; Nowak,Scott W.; Thompson,Basil, Power converter body.
  83. Vinciarelli,Patrizio; Bufano,Louis A., Power converter configuration, control, and construction.
  84. Keay Gary C. ; Vinciarelli Patrizio, Power converter connector assembly.
  85. Vinciarelli, Patrizio; LaFleur, Michael B.; McCauley, Charles I.; Starenas, Paul V., Power converter package and thermal management.
  86. Vinciarelli,Patrizio; Lafleur,Michael B.; McCauley,Charles I.; Starenas,Paul V., Power converter package and thermal management.
  87. Patrizio Vinciarelli ; Fred M. Finnemore ; Michael B. Lafleur ; Charles I. McCauley, Power converter packaging.
  88. Jungreis, Aaron; Brinlee, Antony; Garrity, Paul, Power converter using multiple phase-shifting quasi-resonant converters.
  89. Zhang, Michael; Jungreis, Aaron, Power converter with boost-buck-buck configuration utilizing an intermediate power regulating circuit.
  90. Telefus, Mark, Power converter with noise immunity.
  91. Telefus, Mark; Sharifipour, Bahman, Power converters with quasi-zero power consumption.
  92. Telefus, Mark, Power management integrated circuit partitioning with dedicated primary side control winding.
  93. Plougsgaard Helge S.o slashed.e,DKX ; Olesen Klaus,DKX, Power module for a frequency converter.
  94. Smejtek, Dalibor, Printed circuit assembly.
  95. Vinciarelli Patrizio ; Curhan Jeffrey A., Protective coating for an electronic device.
  96. Vinciarelli, Patrizio; Curhan, Jeffrey A., Protective coating for an electronic device.
  97. Pen, Kwan, Recessed cavity in printed circuit board protected by LPI.
  98. Telefus, Mark, Reconstruction pulse shape integrity in feedback control environment.
  99. Jungreis, Aaron; Garrity, Paul, Resonant power factor correction converter.
  100. Kodaira, Yoshihiro, Semiconductor device and method for manufacturing same.
  101. Berghegger, Ralf Schröder Genannt, Simplified primary triggering circuit for the switch in a switched-mode power supply.
  102. Moussaoui, Zaki; Kelkar, Nikhil Vishwanath, Stacked inductor-electronic package assembly and technique for manufacturing same.
  103. Telefus, Mark, Switching mode power converter using coded signal control.
  104. Vinciarelli, Patrizio; Lafleur, Michael B., System and apparatus for efficient heat removal from heat-generating electronic modules.
  105. Liu, Martin, Two stage resonant converter enabling soft-switching in an isolated stage.
  106. Telefus, Mark; Sharifipour, Bahman, Virtual parametric high side MOSFET driver.
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