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Electromagnetic shielding materials 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01B-001/00
  • H01B-001/20
  • H01B-001/22
출원번호 US-0878153 (1992-05-04)
발명자 / 주소
  • Varadan Vijay K. (State College PA) Varadan Vasundara V. (State College PA) Williams Neil R. (State College PA) Cresko Joseph W. (State College PA)
출원인 / 주소
  • The Penn State Research Foundation (University Park PA 02)
인용정보 피인용 횟수 : 49  인용 특허 : 0

초록

The present invention provides for conductive electromagnetic shielding (EMS) compositions which can be formulated to provide effective shielding over a broad range of frequencies, e.g. 30 MHz. to 110 GHz. which is based on a mixture of a polymeric or liquid matrix material and a synergestic combina

대표청구항

An electromagnetic shielding composition comprising a mixture of: i) a matrix component selected from the group consisting of silicone oils, curable elastomers, thermoplastic polymers, thermosetting polymers and mixtures thereof; and ii) a synergistic combination of electromagnetic shield enhancing

이 특허를 인용한 특허 (49)

  1. Lionetta,William G.; Yantosca, Jr.,Louis M.; Ventura,Daniel S.; Stiffler,Robert E.; Rich,David C., Combination metal and plastic EMI shield.
  2. Lionetta,William G.; Yantosca, Jr.,Louis M.; Ventura,Daniel S.; Severance,Christopher L.; Nobbs,Douglas; Stiffler,Robert E.; Rich,David C., Composite EMI shield.
  3. Glatkowski,Paul J.; Landrau,Nelson; Landis, Jr.,David H.; Piche,Joseph W.; Conroy,Jeffrey L., Conformal coatings comprising carbon nanotubes.
  4. Cho Nam-il,KRX ; Choi Kwang-moon,KRX ; Kim Tae-hwan,KRX ; Kim Gwang-hyeon,KRX, Display device having fire-retardant shield case.
  5. Miyake, Hiroshi, EMI shielding material having improved delamination behavior.
  6. Mark D. Elkovitch, EMI-shielding thermoplastic composition, method for the preparation thereof, and pellets and articles derived therefrom.
  7. Durant, Todd; Bolduc, Noel, EMR absorbing server vent.
  8. Memmer, Timothy L., Electrically conductive polymeric mixture, method of molding conductive articles using same, and electrically conductive articles formed therefrom.
  9. Memmer,Timothy L., Electrically conductive polymeric mixture, method of molding conductive articles using same, and electrically conductive articles formed therefrom.
  10. Narayan, Sujatha; Lunt, Michael; Kubick, Daniel J.; Hamilton, John A., Electrically conductive silicones and method of manufacture thereof.
  11. Ashcraft H. Carl ; May Walter B. ; Dowell Douglas R., Electromagnetic attenuating laminate and method for its formation.
  12. Kambe Nobuyuki ; Bi Xiangxin, Electromagnetic shielding.
  13. Maeda Takako,JPX ; Fujimoto Mitsuhiro,JPX, Electromagnetic wave absorbing thermoconductive silicone gel molded sheet and method for producing the same.
  14. Suzuki, Akio; Fuse, Naoki; Endo, Hiroshi, Electromagnetic wave absorbing, heat conductive silicone rubber compositions.
  15. Denman James R., Electronic assembly with charge-dissipating transparent conformal coating.
  16. Osamu Murasawa JP, Electronic device and shield.
  17. Long Barbara J. ; Haider M. Ishaq ; Menczel Joseph D. ; Stamatoff James B., Electronically and thermally conducting compositions for actuators.
  18. Ishibashi,Shin; Nagao,Hideyuki; Miyazaki,Tomiya, Fiber optic module.
  19. Ishibashi,Shin; Nagao,Hideyuki; Miyazaki,Tomiya, Fiber optic module.
  20. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with housing/shielding.
  21. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Fiber-optic modules with shielded housing/covers having mixed finger types.
  22. Kalinoski John P. ; Bunyan Michael H., Form-in-place EMI gaskets.
  23. Daly John J. ; Medina Raul, High speed interface converter module.
  24. Medina Raul ; Daly John J., High speed interface converter module.
  25. Kambe Nobuyuki ; Bi Xiangxin, Iron oxide particles.
  26. Hubbard Ronald N. ; Duhl Michael L., Low volume lightweight magnetodielectric materials.
  27. Hakotani, Masahiro; Akiyama, Koichi; Miyashita, Hiromu; Shibata, Takashi, Material for molding thermosetting resin sheet, production process, and molded product.
  28. Tsunashima,Makoto; Maeda,Yuusuke; Furuya,Nobuo, Metal coated fiber and electroconductive composition comprising the same and method for production thereof and use thereof.
  29. Rapp, Martin L.; McFadden, Jeff; McNally, Frank T., Method and apparatus for EMI shielding.
  30. Maeda, Takako; Fujimoto, Mitsuhiro, Method for producing an electromagnetic wave absorbing thermoconductive silicone gel molded sheet.
  31. Luippold David Arthur ; Brown Mark David ; Tully John Wilbur, Method for reducing reflected radio frequency electromagnetic radiation.
  32. Stanley Podlaseck ; Gene P. Shumaker ; Paul D. Rimer ; Roger A. Purcell, Method of dispersing fibers in electromagnetic-attenuating coating materials.
  33. Sinclair, Michael J., Method of manufacturing an accelerometer.
  34. Dair, Edwin; Jiang, Wenbin; Wei, Cheng Ping; Sim, Yong Peng, Methods and apparatus for fiber-optic modules with shielded housings/covers with fingers.
  35. Samela Francis M. ; Medina Raul ; Llorens Joseph R., Modified contact traces for interface converter.
  36. Kim, Sung-Jun; Ryu, Young-Sik, Multi-functional resin composite material and molded product using the same.
  37. Gilliland,Patrick B.; Jines,Carlos; Medina,Raul; McGinley,James W., Multi-port pluggable transceiver (MPPT) with multiple LC duplex optical receptacles.
  38. Poplawski Daniel S. ; Gilliland Patrick B. ; Wallenberg Alan J., Optoelectronic module with grounding means.
  39. Smith, Lyle James; Sagal, Mikhail; Miller, James D.; McCullough, Kevin A., Polymer composition with metal coated carbon flakes.
  40. Smith,David M., Radiation shielding.
  41. McGinley James W. ; Poplawski Daniel S., Removable optoelectronic module.
  42. Poplawski Daniel S. ; Gilliland Patrick B. ; McGinley James W., Removable transceiver module and receptacle.
  43. Hamilton, Brandon C.; Smith, Guy N.; Boone, Alan P., Shielding encapsulation for electrical circuitry.
  44. Rios, Victor; Daigle, Robert C.; Kubick, Daniel J.; Paciorek, Walter J.; Phifer, Karen; Sherman, Dave; Simpson, Scott S., Silicone compositions, methods of manufacture, and articles formed therefrom.
  45. Groth,Lauren A., Singular molded and co-molded electronic's packaging pre-forms.
  46. Misra, Sanjay; Timmerman, John; Seethamraju, Kasyap, Thermally conductive EMI suppression compositions.
  47. Hubbard Ronald N. ; Gulden Terry D. ; Martin Michael T., Thin film pigmented optical coating compositions.
  48. Poplawski Daniel S. ; McGinley James W., Transceive module with EMI shielding.
  49. Krupetsky, Dmitriy; Schmid, Anthony P.; Ludwig, Paul N., Tuned sealing material for sealing of a flat panel display.
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