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특허 상세정보

MyON담기
내보내기 페이스북 공유 카카오톡 공유

Electrodynamic pump for dispensing molten solder

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B22D-037/00   
미국특허분류(USC) 266/237 ; 222/590 ; 222/594
출원번호 US-0048446 (1993-04-16)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 64  인용 특허 : 0
초록
▼

A system is provided for depositing an extremely small amount of solder on a printed circuit board by varying the direction of an electric current applied to a solder stream. The force exerted on the solder can be substantially instantaneously reversed without the necessity of changing the form of the energy applied to the solder from electrical to vibratory, ultrasonic, magnetic, or the like. The direction and magnitude of the force is related to the cross product of an electric current vector and a magnetic field vector (F=I×B). A programmable current ...

대표
청구항
▼

A system for depositing a specific quantity of electrically conductive liquid on a component, comprising: means for supplying said conductive liquid; means for applying a magnetic field in a direction perpendicular to said means for supplying; means for transmitting electric current directly through said conductive liquid to exert a force on said conductive liquid in a first direction; and means for reversing a direction of said electric current to correspondingly reverse the direction of said force exerted on said conductive liquid to a second direction...

이 특허를 인용한 특허 피인용횟수: 64

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  31. Watts ; Jr. Hal G. ; Orme-Marmarelis Melissa E. ; Muntz Eric Phillip ; Pham-Van-Diep Gerald C. ; Smith ; Jr. Robert F. ; Balog Robert J. ; Freeman Gary T.. Jet soldering system and method. USP2001086276589.
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  39. Forbes Jones,Robin M.. Method and apparatus for treating articles during formation. USP2006107114548.
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  49. Forbes Jones,Robin M.; Kennedy,Richard L.; Conrad,Helmut Gerhard; Szylowiec,Ted; Conrad,Wayne; Phillips,Richard Stanley; Phillips,Andrew Richard Henry. Methods and apparatus for spray forming, atomization and heat transfer. USP2008057374598.
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  64. Tran, Dean; Akbany, Salim; Lowery, Maurice; Singleton, Jr., Leon M.; DePace, Ronald A.. Thermal solder writing eutectic bonding process and apparatus. USP2005096945447.

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