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Electrodynamic pump for dispensing molten solder 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B22D-037/00
출원번호 US-0048446 (1993-04-16)
발명자 / 주소
  • Smith Ted M. (Austin TX) Winstead Russell E. (Raleigh NC)
출원인 / 주소
  • International Business Machines Corporation (Armonk NY 02)
인용정보 피인용 횟수 : 64  인용 특허 : 0

초록

A system is provided for depositing an extremely small amount of solder on a printed circuit board by varying the direction of an electric current applied to a solder stream. The force exerted on the solder can be substantially instantaneously reversed without the necessity of changing the form of t

대표청구항

A system for depositing a specific quantity of electrically conductive liquid on a component, comprising: means for supplying said conductive liquid; means for applying a magnetic field in a direction perpendicular to said means for supplying; means for transmitting electric current directly through

이 특허를 인용한 특허 (64)

  1. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  2. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  3. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  4. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  5. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  6. Forbes Jones, Robin M.; Kennedy, Richard L., Apparatus and method for clean, rapidly solidified alloys.
  7. Matsuda Tetsuo,JPX ; Ronay Maria, Apparatus and method for forming thin film using ink-jet mechanism.
  8. Kuo, Wen-Chang; Wang, Szu-Yao, Bumping process.
  9. Forbes Jones, Robin M.; Shaffer, Sterry A., Casting apparatus and method.
  10. Forbes Jones, Robin M.; Shaffer, Sterry A., Casting apparatus and method.
  11. Forbes Jones, Robin M.; Shaffer, Sterry A., Casting apparatus and method.
  12. Vader, Scott; Vader, Zachary, Conductive liquid three dimensional printer.
  13. Farnworth Warren M., Continuous mode solder jet apparatus.
  14. Farnworth Warren M., Continuous mode solder jet apparatus.
  15. Farnworth Warren M., Continuous mode solder jet apparatus.
  16. Farnworth, Warren M., Continuous mode solder jet apparatus.
  17. Farnworth,Warren M., Continuous mode solder jet apparatus.
  18. Warren M. Farnworth, Continuous mode solder jet apparatus.
  19. Farnworth, Warren M., Continuous mode solder jet method.
  20. Rasa, Mircea V.; Berkhout, Ronald; Classens, Wilhelmus P. J.; Van Genuchten, Henricus C. M.; Kuznetsov, Evgenij V., Device for ejecting droplets of a fluid having a high temperature.
  21. Nagasaki, Tatsuo; Kobayashi, Hiroyoshi; Kitahara, Toshihiro, Electric wiring forming system.
  22. Bouras, Carlos E.; La., Duong T.; Lewis, Alan R.; Meier, Mark S.; Babiarz, Alec J., Flip chip underfill system and method.
  23. Muntz Eric Phillip ; Orme-Marmarelis Melissa E. ; Pham-Van-Diep Gerald C. ; Balog Robert J., High speed jet soldering system.
  24. Muntz Eric Phillip ; Orme-Marmarelis Melissa E. ; Pham-Van-Diep Gerald C. ; Balog Robert J., High speed jet soldering system.
  25. Pham-Van-Diep Gerald ; Muntz E. Philip ; Watts Hal ; Johnson William ; Main Melvin ; Smith Robert F. ; Orme-Marmarelis Melissa E., High speed jet soldering system.
  26. Forbes Jones, Robin M., Ion plasma electron emitters for a melting furnace.
  27. Orme-Marmarelis Melissa E. ; Muntz Eric Phillip, Jet soldering system and method.
  28. Orme-Marmarelis Melissa E. ; Muntz Eric Phillip, Jet soldering system and method.
  29. Orme-Marmarelis Melissa E. ; Muntz Eric Phillip ; Pham-Van-Diep Gerald C. ; Smith ; Jr. Robert F., Jet soldering system and method.
  30. Watts ; Jr. Hal G. ; Balog Robert J. ; Freeman Gary T., Jet soldering system and method.
  31. Watts ; Jr. Hal G. ; Orme-Marmarelis Melissa E. ; Muntz Eric Phillip ; Pham-Van-Diep Gerald C. ; Smith ; Jr. Robert F. ; Balog Robert J. ; Freeman Gary T., Jet soldering system and method.
  32. Sachs, Emanuel Michael; Gibson, Mark Gardner; Hoisington, Paul A.; Fontana, Richard Remo, Magnetohydrodynamic deposition of metal in manufacturing.
  33. Sachs, Emanuel Michael; Fontana, Richard Remo, Material interfaces for magnetohydrodynamic metal manufacturing.
  34. Forbes Jones, Robin M.; Kennedy, Richard L., Melting furnace including wire-discharge ion plasma electron emitter.
  35. Forbes Jones, Robin M.; Kennedy, Richard L., Melting furnace including wire-discharge ion plasma electron emitter.
  36. Yost Frederick G. ; Frear Darrel R. ; Schmale David T., Method and apparatus for jetting, manufacturing and attaching uniform solder balls.
  37. Forbes Jones, Robin M., Method and apparatus for producing large diameter superalloy ingots.
  38. Forbes Jones, Robin M., Method and apparatus for producing large diameter superalloy ingots.
  39. Forbes Jones,Robin M., Method and apparatus for treating articles during formation.
  40. Akin James Sherill ; Menard Edward Blakley ; Schiesser Thomas Alan ; Smith Ted Minter, Method and system for introducing flux onto at least one surface of a solder pump.
  41. Farnworth, Warren M., Method for continuous mode solder jet apparatus.
  42. Rasa, Mircea V.; Slot, Marcel; Van Genuchten, Henricus C. M.; Classens, Wilhelmus P. J., Method for controlling the temperature of a jetting device.
  43. Rasa, Mircea V., Method for ejecting molten metals.
  44. Warren M. Farnworth, Method for generating continuous stream of liquid metal droplets.
  45. Joppen, Sandor H. G.; Wijshoff, Hermanus M. A., Method for jetting droplets of an electrically conductive fluid.
  46. Bouras, Carlos E.; La, Duong T.; Gamelin, Andre S.; Lewis, Alan R.; Meier, Mark S.; Babiarz, Alec J., Method of dispensing a viscous material.
  47. Valery G. Kagan, Method, system and apparatus employing permanent magnets having reach-out magnetic fields for electromagnetically transferring, braking, and metering molten metals feeding into metal casting machines.
  48. Forbes Jones, Robin M.; Kennedy, Richard L.; Conrad, Helmut Gerhard; Szylowiec, Ted; Conrad, Wayne; Phillips, Richard Stanley; Phillips, Andrew Richard Henry, Methods and apparatus for spray forming, atomization and heat transfer.
  49. Forbes Jones,Robin M.; Kennedy,Richard L.; Conrad,Helmut Gerhard; Szylowiec,Ted; Conrad,Wayne; Phillips,Richard Stanley; Phillips,Andrew Richard Henry, Methods and apparatus for spray forming, atomization and heat transfer.
  50. Straub Marc Alan ; DiPiazza Frank Burke ; Jairazbhoy Vivek Amir ; Goenka Lakhi Nandial ; Stevenson Randy Claude, Molten solder dispensing system.
  51. Straub Marc Alan ; DiPiazza Frank Burke ; Jairazbhoy Vivek Amir ; Goenka Lakhi Nandial ; Stevenson Randy Claude, Molten solder dispensing system.
  52. Predetechensky Mikhail,RUX, Molten solder drop ejector.
  53. Jerome M. Eldridge, Print head for ejecting liquid droplets.
  54. Jerome M. Eldridge, Print head for ejecting liquid droplets and associated methods.
  55. Ayers Scott D. ; Hayes Donald J. ; Boldman Michael T. ; Wallace David B., Printhead for liquid metals and method of use.
  56. Hayes Donald J., Process for manufacturing metal ball electrodes for a semiconductor device.
  57. Kennedy, Richard L.; Forbes Jones, Robin M., Processes, systems, and apparatus for forming products from atomized metals and alloys.
  58. Forbes Jones, Robin M.; Kennedy, Richard L.; Minisandram, Ramesh S., Refining and casting apparatus and method.
  59. Forbes Jones, Robin M.; Shaffer, Sterry A., Refining and casting apparatus and method.
  60. Forbes Jones, Robin M.; Shaffer, Sterry A., Refining and casting apparatus and method.
  61. Baba, Shunji; Yamakami, Takatoyo; Kainuma, Norio; Kobae, Kenji; Kira, Hidehiko; Kobayashi, Hiroshi, Resin coating method.
  62. Tsung Pan Alfred I. ; Allen Ross R. ; Hanson Eric G., Solder jet printhead.
  63. Akin James Sherill ; Menard Edward Blakley ; Schiesser Thomas Alan ; Smith Ted Minter, Stability enhancement of molten solder droplets as ejected from a nozzle of droplet pump.
  64. Tran, Dean; Akbany, Salim; Lowery, Maurice; Singleton, Jr., Leon M.; DePace, Ronald A., Thermal solder writing eutectic bonding process and apparatus.
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