$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

Surface pit and mound detection and discrimination system and method 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • G01N-021/88
출원번호 US-0981745 (1992-11-25)
발명자 / 주소
  • Allen Nicholas C. (Bedford MA) Broude Sergey V. (Newton Centre MA) Chase Eric T. (Nashua NH) Miller Pascal (North Chelmsford MA) Ormsby Jay L. (Salem NH) Rostaing Bruno (Medford MA) Quackenbos Lloyd
출원인 / 주소
  • QC Optics, Inc. (Burlington MA 02)
인용정보 피인용 횟수 : 45  인용 특허 : 0

초록

A surface pit and mound detection and discrimination system including a device for scanning a beam of radiation over a surface, and a mechanism for detecting a local slope on the surface for differentiating between whether the beam of radiation is scanning a pit or a mound on the surface.

대표청구항

A surface defect pit and mound detection and discrimination system comprising: means for scanning a beam of radiation over a surface; means for separately sensing radiation scattered from the surface in the near-specular region and in the far specular region for differentiating between pits and moun

이 특허를 인용한 특허 (45)

  1. Jann Peter C. ; Li Wayne W. ; Iosilevsky Igor ; Womack Kenneth H. ; Cejna Vlastimil ; Burt ; Jr. George A., Apparatus and method for surface inspection by specular interferometric and diffuse light detection.
  2. Berman Michael J., Automated endpoint detection system during chemical-mechanical polishing.
  3. Berman Michael J., Automated inspection system for residual metal after chemical-mechanical polishing.
  4. Fairley,Christopher R.; Fu,Tao Yi; Tsai,Bin Ming Benjamin; Young,Scott A., Confocal wafer depth scanning inspection method.
  5. Fairley, Christopher R.; Fu, Tao-Yi; Tsai, Bin-Ming Benjamin; Young, Scott A., Confocal wafer inspection method and apparatus using fly lens arrangement.
  6. Fairley,Christopher R.; Fu,Tao Yi; Tsai,Bin Ming Benjamin; Young,Scott A., Confocal wafer inspection method and apparatus using fly lens arrangement.
  7. Fairley, Christopher R.; Fu, Tao-Yi; Tsai, Bin-Ming Benjanim; Young, Scott A., Confocal wafer inspection system and method.
  8. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  9. Vaez-Iravani, Mehdi; Rzepiela, Jeffrey Alan; Treadwell, Carl; Zeng, Andrew; Fiordalice, Robert, Defect detection system.
  10. Xu,James J.; Lee,Ken K., Defect review system with 2D scanning and a ring detector.
  11. Tohyama,Keiichi; Noji,Nobuharu; Yoshikawa,Shoji, Information recording medium examining apparatus and method.
  12. Vaez Iravani,Mehdi, Inspection system for integrated applications.
  13. Pressesky Jason L., Method and apparatus for detecting surface discontinuities based on changes in an optical path length during beam scanni.
  14. Eremin Yuri A.,RUX ; Stover John C. ; Scheer Craig A., Method and apparatus for distinguishing particles from subsurface defects on a substrate using polarized light.
  15. Treves, David; O'Dell, Thomas A., Method and apparatus for inspecting substrates.
  16. Treves, David; O'Dell, Thomas A.; Hsieh, Yung-Chieh, Method and apparatus for inspecting substrates.
  17. Iwata Tetsuya,JPX ; Tsuchida Shigeru,JPX, Method and apparatus of surface inspection of a disk.
  18. John C. Stover ; Yuri A. Eremin RU, Method for discriminating between holes in and particles on a film covering a substrate.
  19. Bareket, Noah; Desplat, Christian G.; Glasser, Lance A., Method for inspecting a reticle.
  20. Shortt, David; Biellak, Stephen; Belyaev, Alexander, Methods and systems for inspection of a wafer.
  21. Sopori,Bhushan L.; Hambarian,Artak, Optic probe for semiconductor characterization.
  22. Broude Sergey V. (Newton Centre MA) Allen Nicholas (Bedford MA) Boudour Abdu (West Newton MA) Chase Eric (Carlisle MA) Johnson Carl (Tewksbury MA) Miller Pascal (North Chelmsford MA) Ormsby Jay (Sale, Optical inspection system and method for detecting flaws on a diffractive surface.
  23. Guetta, Avishay, Optical inspection system with dual detection heads.
  24. Marxer Norbert,LIX ; Gross Kenneth P. ; Altendorfer Hubert ; Kren George, Process and assembly for non-destructive surface inspections.
  25. Marxer, Norbert; Gross, Kenneth P.; Altendorfer, Hubert; Kren, George, Process and assembly for non-destructive surface inspections.
  26. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  27. Marxer,Norbert; Gross,Kenneth P.; Altendorfer,Hubert; Kren,George, Process and assembly for non-destructive surface inspections.
  28. Mehdi Vaez-Iravani ; Stanley Stokowski ; Guoheng Zhao, Sample inspection system.
  29. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  30. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  31. Vaez Iravani,Mehdi; Stokowski,Stanley; Zhao,Guoheng, Sample inspection system.
  32. Vaez-Iravani Mehdi ; Stokowski Stanley ; Zhao Guoheng, Sample inspection system.
  33. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  34. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  35. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  36. Vaez-Iravani, Mehdi; Stokowski, Stanley; Zhao, Guoheng, Sample inspection system.
  37. Xu,James J.; Lee,Ken K., Surface inspection system.
  38. Keshavmurthy Shyam P., System and method for detecting defects in a surface of a workpiece.
  39. Green, Paul M.; Robinson, Bob C.; O'Brien, Eric Christian; York, Elmer Tyree, System and method for detecting manufacturing marks on sputtered disks.
  40. Biellak, Steve; Stokowski, Stanley E.; Vaez-Iravani, Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  41. Biellak,Steve; Stokowski,Stanley E.; Vaez Iravani,Mehdi, Systems and methods for a wafer inspection system using multiple angles and multiple wavelength illumination.
  42. Green Paul M. ; Leung Wai C., Thin film disk media using optimum surface orientation to written data tracks.
  43. Fossey Michael E. ; Stover John C., Wafer inspection system for distinguishing pits and particles.
  44. Fossey Michael E. ; Stover John C. ; Clementi Lee D., Wafer inspection system for distinguishing pits and particles.
  45. Fossey, Michael E.; Stover, John C.; Clementi, Lee D., Wafer inspection system for distinguishing pits and particles.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로