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| 국가/구분 | United States(US) Patent 등록 |
|---|---|
| 국제특허분류(IPC7판) |
|
| 출원번호 | US-0212961 (1994-03-15) |
| 발명자 / 주소 |
|
| 출원인 / 주소 |
|
| 인용정보 | 피인용 횟수 : 1201 인용 특허 : 0 |
An improved method is provided for making thin film electrochemical sensors, such as subcutaneous glucose sensors used to monitor blood glucose levels in a diabetic patient. The fabrication method comprises placing a thin film base layer of insulative material onto a rigid flat substrate, with a cur
An improved method is provided for making thin film electrochemical sensors, such as subcutaneous glucose sensors used to monitor blood glucose levels in a diabetic patient. The fabrication method comprises placing a thin film base layer of insulative material onto a rigid flat substrate, with a curable adhesive interposed between the perimeter of the base layer and substrate to define a shallow cavity underlying a central portion of the base layer. The subassembly is subjected to heat and pressure to cure the adhesive, resulting in air expulsion from the cavity such that the central portion of the base layer is drawn into intimate contact with the substrate. Appropriate conductor elements for one or more sensors are formed on the base layer as by conventional contact mask photolithography, and a thin film cover layer of insulative material is applied thereover with apertures in the cover layer exposing distal end sensor electrodes and proximal end contact pads. The insulative cover and base layers are then cut along a line surrounding each finished sensor which is lifted and separated easily from the substrate.
A method of making a thin film electrochemical sensor, said method comprising the steps of: applying a curable adhesive in a closed loop pattern to a flat surface of a rigid substrate; assembling a base layer of insulative sheet material with the substrate, with the adhesive interposed between the s
A method of making a thin film electrochemical sensor, said method comprising the steps of: applying a curable adhesive in a closed loop pattern to a flat surface of a rigid substrate; assembling a base layer of insulative sheet material with the substrate, with the adhesive interposed between the substrate and the base layer generally at the perimeter of the base layer, so that a shallow cavity is formed between the substrate and a central portion of the base layer; applying heat and pressure to the assembled base layer and substrate to expel air from the cavity and to position the central portion of the base layer in intimate surface contact with the substrate, and further to cure the adhesive to seal the cavity and thereby prevent air return flow into the cavity; forming at least one conductive sensor element on the base layer; forming a cover layer of insulative material to cover the at least one conductive sensor element and to extend beyond the marginal edges thereof in sealed contact with the base layer; and removing the sensor from the substrate by cutting through the cover and base layers along a line circumscribing and spaced outwardly from the at least one sensor element.
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