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Manufacturing method for semiconductor devices with source/drain formed in substrate projection. 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H01L-021/265
  • H01L-029/06
  • H01L-021/76
출원번호 US-0009747 (1993-01-27)
우선권정보 JP-0017176 (1992-01-31); JP-0017177 (1992-01-31); JP-0150682 (1992-06-10)
발명자 / 주소
  • Tada Yoshihide (Chiba JPX) Kunitomo Hiroyasu (Chiba JPX)
출원인 / 주소
  • Kawasaki Steel Corporation (Kobe JPX 03)
인용정보 피인용 횟수 : 103  인용 특허 : 0

초록

A projection is formed in a substrate by anisotropic etching and a transistor is contained in the projection. The central portion of the projection covered with a gate electrode is formed as a channel region, and drain and source regions are formed on both sides of the projection by oblique ion impl

대표청구항

A method of making a semiconductor device which includes at least one projection formed on a substrate having a conductivity type, the at least one projection including at least one vertical MOS transistor having a channel region, a source region and a drain region, the method comprising the steps o

이 특허를 인용한 특허 (103)

  1. Radosavljevic,Marko; Majumdar,Amlan; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark L.; Brask,Justin K.; Shah,Uday; Datta,Suman; Chau,Robert S., Block contact architectures for nanoscale channel transistors.
  2. Lindert, Nick; Cea, Stephen M., Bulk non-planar transistor having strained enhanced mobility and methods of fabrication.
  3. Doyle, Brian S.; Jin, Been-Yih; Kavalieros, Jack T.; Datta, Suman; Brask, Justin K.; Chau, Robert S., CMOS devices with a single work function gate electrode and method of fabrication.
  4. Ohmi, Tadahiro; Kotani, Koji; Sugawa, Shigetoshi, Complementary MIS device.
  5. Ohmi,Tadahiro; Kotani,Koji; Sugawa,Shigetoshi, Complementary MIS device.
  6. Brask, Justin K.; Datta, Suman; Doczy, Mark L.; Blackwell, James M.; Metz, Matthew V.; Kavalieros, Jack T.; Chau, Robert S., Dielectric interface for group III-V semiconductor device.
  7. Yeo, Yee-Chia; Wang, Ping-Wei; Chen, Hao-Yu; Yang, Fu-Liang; Hu, Chenming, Doping of semiconductor fin devices.
  8. Bryant, Andres; Ieong, Meikei; Muller, K. Paul; Nowak, Edward J.; Fried, David M.; Rankin, Jed, Double gated transistor and method of fabrication.
  9. Popp,Martin; Richter,Frank; Temmler,Dietmar; Wich Glasen,Andreas, Field effect transistor and method for fabricating it.
  10. Radosavljevic, Marko; Datta, Suman; Doyle, Brian S.; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Majumdar, Amian; Chau, Robert S., Field effect transistor with metal source/drain regions.
  11. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  12. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  13. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  14. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  15. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  16. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  17. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  18. Chau, Robert S.; Datta, Suman; Kavalieros, Jack; Brask, Justin K.; Doczy, Mark L.; Metz, Matthew, Field effect transistor with narrow bandgap source and drain regions and method of fabrication.
  19. Anderson, Brent A.; Bryant, Andres; Nowak, Edward J., Fin device with capacitor integrated under gate electrode.
  20. Anderson,Brent A.; Bryant,Andres; Nowak,Edward J., Fin device with capacitor integrated under gate electrode.
  21. McKee, Jeffrey A., Gate device with raised channel and method.
  22. Nowak,Edward J., High-density FinFET integration scheme.
  23. Nowak, Edward J., High-density finFET integration scheme.
  24. Fried, David M.; Nowak, Edward J.; Rankin, Jed H., Implanted asymmetric doped polysilicon gate FinFET.
  25. Fried,David M.; Nowak,Edward J.; Rankin,Jed H., Implanted asymmetric doped polysilicon gate FinFET.
  26. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors.
  27. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  28. Chang, Peter L. D.; Doyle, Brian S., Independently accessed double-gate and tri-gate transistors in same process flow.
  29. Nishimuta, Takefumi; Miyagi, Hiroshi; Ohmi, Tadahiro; Sugawa, Shigetoshi; Teramoto, Akinobu, MIS transistor and CMOS transistor.
  30. Quenette, Vincent, MOS transistor.
  31. Datta,Suman; Doyle,Brian S.; Chau,Robert S.; Kavalieros,Jack; Zheng,Bo; Hareland,Scott A., Method and apparatus for improving stability of a 6T CMOS SRAM cell.
  32. Datta,Suman; Doyle,Brian S.; Chau,Robert S.; Kavalieros,Jack; Zheng,Bo; Hareland,Scott A., Method and apparatus for improving stability of a 6T CMOS SRAM cell.
  33. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  34. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  35. Brask, Justin K.; Chau, Robert S.; Datta, Suman; Doczy, Mark L.; Doyle, Brian S.; Kavalieros, Jack T.; Majumdar, Amlan; Metz, Matthew V.; Radosavljevic, Marko, Method for fabricating transistor with thinned channel.
  36. Uenishi Akio,JPX ; Minato Tadaharu,JPX, Method for forming high breakdown semiconductor device.
  37. Iwamatsu Toshiaki,JPX ; Inoue Yasuo,JPX, Method for manufacturing a vertical mosfet including a back gate electrode.
  38. Anderson, Brent A.; Nowak, Edward J.; Rankin, Jed H., Method of fabricating a finfet.
  39. Shah,Uday; Doyle,Brian S.; Brask,Justin K.; Chau,Robert S., Method of fabricating a multi-cornered film.
  40. Ha Hyoung C. (Kwangmyungsi KRX), Method of fabricating a thin film transistor having vertical channel.
  41. Adkisson,James W.; Agnello,Paul D.; Ballantine,Arne W.; Divakaruni,Rama; Jones,Erin C.; Nowak,Edward J.; Rankin,Jed H., Method of fabricating semiconductor side wall fin.
  42. Adkisson,James W.; Agnello,Paul D.; Ballantine,Arne W.; Divakaruni,Rama; Jones,Erin C.; Nowak,Edward J.; Rankin,Jed H., Method of fabricating semiconductor side wall fin.
  43. Doyle,Brian S.; Datta,Suman; Kavalieros,Jack T.; Majumdar,Amlan, Method of ion implanting for tri-gate devices.
  44. Chui Benjamin W. ; Kenny Thomas W., Method of making electrical elements on the sidewalls of micromechanical structures.
  45. Chrong Jung Lin TW; Shui-Hung Chen TW; Di-Son Kuo TW, Method of manufacture of vertical split gate flash memory device.
  46. Jung Lin Chrong,TWX ; Chen Shui-Hung,TWX ; Kuo Di-Son,TWX, Method of manufacture of vertical split gate flash memory device.
  47. Lin Chrong-Jung,TWX ; Chen Shui-Hung,TWX ; Liang Mong-Song,TWX, Method of manufacture of vertical stacked gate flash memory device.
  48. Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Chau, Robert S., Method of patterning a film.
  49. Quek Shyue Fong,MYX ; Ang Ting Cheong,SGX ; Ong Puay Ink,MYX ; Loong Sang Yee,SGX, Method to fabricate a sub-quarter-micron MOSFET with lightly doped source/drain regions.
  50. Brask, Justin K.; Kavalieros, Jack; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S.; Doyle, Brian S., Methods for patterning a semiconductor film.
  51. Manning, H. Montgomery; Parekh, Kunal R.; Basceri, Cem; Sandhu, Gurtej S., Methods of forming vertical transistor structures.
  52. Manning, H. Montgomery; Parekh, Kunal R.; Basceri, Cem; Sandhu, Gurtej S., Methods of forming vertical transistor structures.
  53. Moroz, Victor, N-channel and P-channel end-to-end finFET cell architecture.
  54. Doyle,Brian S; Datta,Suman; Jin,Been Yih; Zelick,Nancy M; Chau,Robert, Non-planar pMOS structure with a strained channel region and an integrated strained CMOS flow.
  55. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  56. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  57. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  58. Shah, Uday; Doyle, Brian S.; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  59. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  60. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  61. Shah, Uday; Doyle, Brian; Brask, Justin K.; Chau, Robert S.; Letson, Thomas A., Nonplanar device with thinned lower body portion and method of fabrication.
  62. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  63. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Rios, Rafael; Linton, Tom; Datta, Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  64. Hareland,Scott A.; Chau,Robert S.; Doyle,Brian S.; Rios,Rafael; Linton,Tom; Datta,Suman, Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication.
  65. Brask, Justin K.; Dovle, Brian S.; Kavalleros, Jack; Doczy, Mark; Shah, Uday; Chau, Robert S., Nonplanar transistors with metal gate electrodes.
  66. Brask,Justin K.; Doyle,Brian S.; Doczy,Mark L.; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  67. Brask,Justin K.; Doyle,Brian S.; Kavalieros,Jack; Doczy,Mark; Shah,Uday; Chau,Robert S., Nonplanar transistors with metal gate electrodes.
  68. Chapple-Sokol Jonathan D. (Poughkeepsie NY) Subbanna Seshadri (Hopewell Junction NY) Tejwani Manu J. (Yorktown Heights NY), One dimensional silicon quantum wire devices and the method of manufacture thereof.
  69. Kavalieros, Jack T.; Brask, Justin K.; Doyle, Brian S.; Shah, Uday; Datta, Suman; Doczy, Mark L.; Metz, Matthew V.; Chau, Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  70. Kavalieros,Jack T.; Brask,Justin K.; Doyle,Brian S.; Shah,Uday; Datta,Suman; Doczy,Mark L.; Metz,Matthew V.; Chau,Robert S., Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby.
  71. Shoichi Iwasa JP; Tatsuya Kawamata JP, Semiconductor device and a method of manufacturing the same.
  72. Takaishi, Masaru, Semiconductor device and production method therefor.
  73. Takaishi, Masaru, Semiconductor device production method and semiconductor device.
  74. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  75. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  76. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  77. Brask, Justin K.; Kavalieros, Jack; Doyle, Brian S.; Shah, Uday; Datta, Suman; Majumdar, Amlan; Chau, Robert S., Semiconductor device structures and methods of forming semiconductor structures.
  78. Hueting, Raymond J. E.; Hijzen, Erwin A., Semiconductor device with FET MESA structure and vertical contact electrodes.
  79. Ammo, Hiroaki, Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus.
  80. Ammo, Hiroaki, Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus.
  81. Ammo, Hiroaki, Solid-state imaging device, method of manufacturing solid-state imaging device, and electronic apparatus.
  82. Balasinski, Artur P.; Huang, Kuei-Wu, Spacer-type thin-film polysilicon transistor for low-power memory devices.
  83. Hudait, Mantu K.; Shaheen, Mohamad A.; Chow, Loren A.; Tolchinsky, Peter G.; Fastenau, Joel M.; Loubychev, Dmitri; Liu, Amy W. K., Stacking fault and twin blocking barrier for integrating III-V on Si.
  84. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  85. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  86. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  87. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  88. Rakshit, Titash; Giles, Martin; Pillarisetty, Ravi; Kavalieros, Jack T., Stress in trigate devices using complimentary gate fill materials.
  89. Choi Jong M. (Seoul KRX) Kim Jong K. (Chungcheongbuk-do KRX), Structure and fabrication method for a thin film transistor.
  90. Evans Jonathan Leslie,GBX, Trench gated power device fabrication by doping side walls of partially filled trench.
  91. Uenishi Akio,JPX ; Minato Tadaharu,JPX, Trenched high breakdown voltage semiconductor device.
  92. Chau, Robert S.; Doyle, Brian S.; Kavalieros, Jack; Barlage, Douglas; Datta, Suman, Tri-gate devices and methods of fabrication.
  93. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman, Tri-gate devices and methods of fabrication.
  94. Chau,Robert S.; Doyle,Brian S.; Kavalieros,Jack; Barlage,Douglas; Datta,Suman, Tri-gate devices and methods of fabrication.
  95. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  96. Hareland, Scott A.; Chau, Robert S.; Doyle, Brian S.; Datta, Suman; Jin, Been-Yih, Tri-gate transistor device with stress incorporation layer and method of fabrication.
  97. Yu,Bin; Ahmed,Shibly S.; Wang,Haihong, Varying carrier mobility in semiconductor devices to achieve overall design goals.
  98. Oh, Chang-Woo; Park, Dong-Gun; Lee, Sung-Young; Choe, Jeong-Dong; Kim, Dong-Won, Vertical channel fin field-effect transistors having increased source/drain contact area and methods for fabricating the same.
  99. Cronin John Edward ; Gortych Joseph Edward, Vertical mask for defining a region on a wall of a semiconductor structure.
  100. Lin, Chrong Jung; Chen, Shui-Hung; Kuo, Di-Son, Vertical split gate flash memory device in an orthogonal array of rows and columns with devices in columns having shared source regions.
  101. Lin, Chrong-Jung; Chen, Shui-Hung; Liang, Mong-Song, Vertical stacked gate flash memory device.
  102. Chung, Woo Young, Vertical transistor of semiconductor device and method for forming the same.
  103. Chung, Woo Young, Vertical transistor of semiconductor device and method for forming the same.
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