$\require{mediawiki-texvc}$

연합인증

연합인증 가입 기관의 연구자들은 소속기관의 인증정보(ID와 암호)를 이용해 다른 대학, 연구기관, 서비스 공급자의 다양한 온라인 자원과 연구 데이터를 이용할 수 있습니다.

이는 여행자가 자국에서 발행 받은 여권으로 세계 각국을 자유롭게 여행할 수 있는 것과 같습니다.

연합인증으로 이용이 가능한 서비스는 NTIS, DataON, Edison, Kafe, Webinar 등이 있습니다.

한번의 인증절차만으로 연합인증 가입 서비스에 추가 로그인 없이 이용이 가능합니다.

다만, 연합인증을 위해서는 최초 1회만 인증 절차가 필요합니다. (회원이 아닐 경우 회원 가입이 필요합니다.)

연합인증 절차는 다음과 같습니다.

최초이용시에는
ScienceON에 로그인 → 연합인증 서비스 접속 → 로그인 (본인 확인 또는 회원가입) → 서비스 이용

그 이후에는
ScienceON 로그인 → 연합인증 서비스 접속 → 서비스 이용

연합인증을 활용하시면 KISTI가 제공하는 다양한 서비스를 편리하게 이용하실 수 있습니다.

High efficiency heat removal system for electric devices and the like 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • F28D-015/02
출원번호 US-0031225 (1993-03-12)
발명자 / 주소
  • Budelman Gerald A. (Aloha OR)
출원인 / 주소
  • Intel Corporation (Santa Clara CA 02)
인용정보 피인용 횟수 : 61  인용 특허 : 0

초록

A heat removal system employing fluid circulation and vaporization for transferring heat from a primary heat sink to a secondary heat sink where the heat is dissipated into the surrounding air is disclosed. The present invention comprises a primary heat sink coupled to a secondary heat sink via flex

대표청구항

A heat removal system for removing heat from an electric device, said system comprising: a primary heat sink coupled to said electric device, said primary heat sink having a primary coolant channel therein, said primary coolant channel being an etched or molded serpentine groove in said primary heat

이 특허를 인용한 특허 (61)

  1. Ishimine Junichi,JPX ; Suzuki Masahiro,JPX, Air-cooled electronic apparatus.
  2. Senyk, Borys S.; Moresco, Larry L., Apparatus for cooling a computer.
  3. Daniel N. Donahoe ; Michael T. Gill, Apparatus for liquid cooling of specific computer components.
  4. Donahoe Daniel N. ; Gill Michael T., Apparatus for liquid cooling of specific computer components.
  5. Tsuji Hiroyuki,JPX ; Kato Keiichi,JPX, Apparatus for radiating heat for use in computer system.
  6. Rochel Sohail ; Norvell Gene Edgar, Car amplifier incorporating a peltier device for cooling.
  7. Wu,Wei Fang; Huang,Yu Hung; Chen,Chin Ming, Circulative cooling apparatus.
  8. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Cold plate for dual refrigeration systems.
  9. Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Combined air and refrigeration cooling for computer systems.
  10. Scott, Alexander Robin Walter, Computer cooling apparatus.
  11. Scott, Alexander Robin Walter, Computer cooling apparatus.
  12. Scott,Alexander Robin Walter, Computer cooling apparatus.
  13. Lyon, Geoff Sean; Holden, Michael James, Computer cooling system with preferential cooling device selection.
  14. Joshi,Shrikant M.; Bhatti,Mohinder S.; Reyzin,Ilya E.; Johnson,Russell S., Cooling assembly with spirally wound fin.
  15. Tonosaki, Minehiro; Kato, Eisaku; Ohmi, Motosuke; Yajima, Takashi, Cooling device, electronic apparatus and acoustic apparatus, and method for producing the cooling device.
  16. Cosley,Michael R.; Fischer,Richard L., Cooling system for densely packed electronic components.
  17. Miyazaki, Ryuuji; Suzuki, Masumi; Hirano, Minoru, Cooling unit.
  18. Miyazaki,Ryuuji; Suzuki,Masumi; Hirano,Minoru, Cooling unit.
  19. Ohashi Shigeo,JPX ; Hatada Toshio,JPX ; Tanaka Shinji,JPX, Cooling unit for electronic equipment.
  20. Ishikawa, Kenichi; Hisano, Katsumi, Cooling unit including radiator for radiating heat of heat generating component, and electronic apparatus including the cooling unit.
  21. Lee, Rong-Jung, Device and method for removing heat from object by spraying cooling agent.
  22. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
  23. Kondo, Yoshihiro; Matsushita, Shinji; Ohashi, Shigeo; Naganawa, Takashi; Minamitani, Rintaro; Nakagawa, Tsuyoshi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime, Electronic apparatus.
  24. Bilski, W. John, Electronics cabinet and rack cooling system and method.
  25. Heady,Gregory S., Heat collector plate for an electronic display.
  26. Yeh, Lan Kai; Lin, Che Wei; Tsai, Ming Jye; Chen, Shao Wen; Shyu, Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.
  27. Yeh,Lan Kai; Lin,Che Wei; Tsai,Ming Jye; Chen,Shao Wen; Shyu,Jin Cherng, Heat dissipating apparatus having micro-structure layer and method of fabricating the same.
  28. Batchelder John Samuel, Heat exchange apparatus.
  29. Budelman Gerald A., Heatsink with integrated blower for improved heat transfer.
  30. Moore, David A.; Tracy, Mark S., Hinge connector with liquid coolant path.
  31. Mok,Lawrence Shungwei; Yuan,Tsorng Dih, Increased efficiency in liquid and gaseous planar device cooling technology.
  32. Symons,Robert S., Integrated liquid cooling device for electronic components.
  33. Symons,Robert S., Integrated liquid cooling device with immersed electronic components.
  34. Wilson, Gregg; Weaver, Jason P., Light fixture having modular accessories and method of forming same.
  35. Wilson, Gregg; Weaver, Jason P., Light fixture using modular accessories.
  36. Ohashi, Shigeo; Kondo, Yoshihiro; Minamitani, Rintaro; Naganawa, Takashi; Yoshitomi, Yuuji; Nakanishi, Masato; Katou, Hajime; Nakagawa, Tsuyoshi, Liquid circulation cooling system for electronic apparatus.
  37. Huang,Jung Fong; Huang,Chih Chien, Liquid-cooled heat radiator kit.
  38. Tillotson,Brian J., Magnetically enhanced convection heat sink.
  39. Yazawa, Kazuaki; Bar-Cohen, Avram, Method and apparatus for converting dissipated heat to work energy.
  40. Gerald A. Budelman, Method and apparatus for improving the thermal performance of heat sinks.
  41. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Method of cooling electronic devices using a tube in plate heat sink.
  42. Yeh, Lan-Kai; Lin, Che-Wei; Tsai, Ming-Jye; Chen, Shao-Wen; Shyu, Jin-Cherng, Method of fabricating heat dissipating apparatus.
  43. Hardesty, Robert E., Micro-channel pulsating heat pipe.
  44. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  45. Hare Jeffrey J. ; Harris Willard S. ; Hickey Jody A. ; Schmidt Roger R. ; Seminaro Edward J. ; Chrysler Gregory M. ; Chu Richard C. ; Goth Gary F. ; Simons Robert E., Modular refrigeration system.
  46. Nam Sang Sig,KRX ; Kwak Ho Young,KRX ; Kim Jae Hee,KRX, Multi chip module cooling apparatus.
  47. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  48. Van Brocklin Andrew L. ; Bausch James F. ; Sterner John R., Multi-mode heat transfer using a thermal heat pipe valve.
  49. Huang Bin-Juine,TWX, Network-type heat pipe device.
  50. Malone,Christopher Gregory; Simon,Glenn Cochran, One or more heat exchanger components in major part operably locatable outside computer chassis.
  51. Mochizuki Masataka,JPX ; Saito Yuji,JPX ; Hasegawa Masashi,JPX ; Ono Motoyuki,JPX, Personal computer cooling device having hinged heat pipe.
  52. Pokharna,Himanshu; DiStefano,Eric, Pumped loop cooling with remote heat exchanger and display cooling.
  53. Cao, Yiding; Gao, Mingcong, Reciprocating-mechanism driven heat loop.
  54. Chu, Richard C.; Ellsworth, Jr., Michael J.; Schmidt, Roger R.; Simons, Robert E., Scalable coolant conditioning unit with integral plate heat exchanger/expansion tank and method of use.
  55. Cosley, Michael R.; Fischer, Richard L.; Thiesen, Jack H.; Willen, Gary S., Small scale chip cooler assembly.
  56. Rossi,Thomas M.; Pokharna,Himanshu, System to improve display efficiency based on recycling local heat source.
  57. Carr, Richard P., Temperature control system using aqueous 1,3-propanediol solution.
  58. Khrustalev, Dmitry; Zuo, Jon, Thermal bus for cabinets housing high power electronics equipment.
  59. Thomas Daniel Lee, Thin, planar heat spreader.
  60. Galyon George Tipton ; Kemink Randall Gail ; Schmidt Roger Ray, Tube in plate heat sink.
  61. Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
섹션별 컨텐츠 바로가기

AI-Helper ※ AI-Helper는 오픈소스 모델을 사용합니다.

AI-Helper 아이콘
AI-Helper
안녕하세요, AI-Helper입니다. 좌측 "선택된 텍스트"에서 텍스트를 선택하여 요약, 번역, 용어설명을 실행하세요.
※ AI-Helper는 부적절한 답변을 할 수 있습니다.

선택된 텍스트

맨위로