[특허]Heat sink assembly for solid state devices

Heat sink assembly for solid state devices 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/02 H01L-023/42 H01L-023/44 H01L-023/40
출원번호	US-0097483 (1993-07-26)
발명자 / 주소	Tata Peter D. (Johnston RI) Rife William B. (Greenville RI)
출원인 / 주소	Square Head, Inc. (Warwick RI 02)
인용정보	피인용 횟수 : 95 인용 특허 : 0

초록 ▼

A heat sink assembly adapted for use with an electronic device package such as a microprocessor having a grid array is shown having, in a first embodiment, a threaded base of a finned heat sink adapted to be received in a threaded bore of an adaptor which mounts onto the electronic device package. Desired thermal coupling is achieved by screwing down the heat sink in biasing engagement with the package. Alternate embodiments show the heat sink which has a snap on flange to attach the heat sink to the adaptor and the adaptor extending down to engage with the socket in which the microprocessor is installed.

대표청구항 ▼

A heat sink assembly for removing heat from an electronic device package installed in a socket on a circuit board comprising an adaptor having a top wall and having a pair of opposed side walls depending downwardly therefrom, a groove formed in each side wall extending generally parallel to the top wall in alignment with and facing each other and being capable of slidably receiving said electronic device package and said socket simultaneously, said groove formed in each side wall having a width slightly greater than the combined thickness of said electronic device package and said socket, first and second planes lying respectively in the top and bottom of the grooves defining a space therebetween, the groove being adapted to clampingly receive opposite marginal portions of a socket carrying a electronic device package when inserted therein, a bore centrally located in the top wall and extending therethrough, a heat sink member having a cylindrical base member with a flat bottom surface adapted to be received through the bore in the top wall, the base member formed with means to engage with the periphery of the bore to secure and to attach the heat sink member to the adaptor with the flat bottom surface disposed in the space between the first and second planes whereby an electronic device package installed in a socket slidably inserted in the grooves will cause the top wall to bow through engagement with the flat bottom surface of the base.

이 특허를 인용한 특허 (95)

Palaniappa, Ilavarasan M.; Panavala, Vinayak Reddy; Fedde, Mickiel P., Adapter apparatus with deflectable element socket contacts.
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Kenny, Jr.,Thomas William; Goodson,Kenneth E.; Santiago,Juan G.; Everett, Jr.,George Carl, Apparatus for conditioning power and managing thermal energy in an electronic device.
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Kirkland Janet ; Schneider Mark R., Ball grid array with inexpensive threaded secure locking mechanism to allow removal of a threaded heat sink therefrom.
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Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers.
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Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover.
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Banton, Randall G.; Blanchet, Don W.; Bardo, Jason E.; Gust, Mike W.; Zuidema, Paul N., Circuit board assembly with integrated shaping and control of flow resistance curve.
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Correa, Adrian; Lin, Tien-Chieh (Eric); Hom, James; Shiomoto, Gregory; Chow, Norman; Leong, Brandon; Brewer, Richard Grant; Werner, Douglas E.; McMaster, Mark, Device and methodology for the removal of heat from an equipment rack by means of heat exchangers mounted to a door.
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Banton, Randall G.; Blanchet, Don W.; Freeburn, Jr., John R.; Bardo, Jason E.; Rocco, Jr., A. Gregory; Gust, Mike W.; Zuidema, Paul N., Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies.
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Chang, Chun-Yi, Electrical connector with loading component.
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Tustaniwskyj Jerry I. (Mission Viejo CA) Smiley Stephen A. (San Diego CA), Electromechanical module with post-solder attachable/removable heat sink frame and low profile.
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Blincoe, Patrick Stephen; Litteer, Andrew Adams, Lighting assemblies having controlled directional heat transfer.
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Blincoe, Patrick Stephen; Helmer, Clifford Randy; Litteer, Andrew Adams, Lighting fixture.
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Blincoe, Patrick Stephen; Helmer, Clifford Randy; Litteer, Andrew Adams, Lighting fixture.
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Blincoe, Patrick Stephen; Helmer, Clifford Randy; Litteer, Andrew Adams, Lighting fixture.
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Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Upadhya, Girish; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
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Upadhya, Girish; Munch, Mark; Chow, Norman; Tsao, Paul; Werner, Douglas E.; McMaster, Mark; Landry, Frederic; Spearing, Ian; Schrader, Tim, Liquid cooling loops for server applications.
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Datta, Madhav; McMaster, Mark; Brewer, Rick; Zhou, Peng; Tsao, Paul; Upadhaya, Girish; Munch, Mark, Method of fabricating high surface to volume ratio structures and their integration in microheat exchangers for liquid cooling system.
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Brewer, Richard Grant; Chow, Norman; Hom, James, Methodology of cooling multiple heat sources in a personal computer through the use of multiple fluid-based heat exchanging loops coupled via modular bus-type heat exchangers.
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Datta, Madhav; Leong, Brandon; McMaster, Mark, Microheat exchanger for laser diode cooling.
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Branch, Scott Michael; Distad, Eugene E.; Freitag, Ladd W.; Hanley, Michael Francis; Gaio, David Peter, Modular heat sinks.
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Rife William B., Multi-device heat sink assembly.
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Ilavarasan Palaniappa, Offset array adapter.
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Blasenheim, Barry J.; Kao, H. Pin; Oldham, Mark F., Optical camera alignment.
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Blasenheim, Barry J.; Kao, H. Pin; Oldham, Mark F., Optical camera alignment.
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Blasenheim, Barry; Kao, H. Pin; Oldham, Mark, Optical camera alignment.
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Upadhya, Girish; Herms, Richard; Zhou, Peng; Goodson, Kenneth; Hom, James, Optimal spreader system, device and method for fluid cooled micro-scaled heat exchange.
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Ilavarasan Palaniappa ; Mickiel Fedde, Packaged device adapter assembly and mounting apparatus.
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Palaniappa, Ilavarasan; Fedde, Mickiel; Cramer, Jason Allen, Packaged device adapter assembly with alignment structure and methods regarding same.
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McCullough Kevin Albert (Warwick RI), Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Munch,Mark; Goodson,Kenneth; Corbin,David; Zeng,Shulin; Kenny,Thomas W.; Shook,James Gill, Remedies to prevent cracking in a liquid system.
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Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on a sample block.
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Fawcett, Adrian, Sample block apparatus and method for maintaining a microcard on sample block.
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Frankeny Richard Francis ; Frankeny Jerome Albert ; Massey Danny Edward ; Vanderlee Keith Allan, Socket for semi-permanently connecting a solder ball grid array device using a dendrite interposer.
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Mertol Atila, Stiffener with slots for clip-on heat sink attachment.
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Freedman,Philip D., Structure with heat dissipating device and method.
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Burward-Hoy Trevor (Cupertino CA), Sub-ambient temperature electronic package.
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Bird, John; Bussiere, Paul; Dor?-North, Lyne; Allen, Amy; Larson, Ralph I., System and method for mounting a heat sink.
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Amber,Glenn M.; Weiss,Roger E., System for loading a heat sink mechanism independently of clamping load on electrical device.
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Wang Chong-Sheng, Vibration and shock resistant heat sink assembly.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
구성항목	기본정보 상세정보 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표IPC 관리번호, 국가코드, 자료구분, 상태, 출원번호, 출원일자, 공개번호, 공개일자, 공고번호, 공고일자, 등록번호, 등록일자, 발명명칭(한글), 발명명칭(영문), 출원인(한글), 출원인(영문), 출원인코드, 대표출원인, 출원인국적, 출원인주소, 발명자, 발명자E, 발명자코드, 발명자주소, 발명자 우편번호, 발명자국적, 대표IPC, IPC코드, 요약, 미국특허분류, 대리인주소, 대리인코드, 대리인(한글), 대리인(영문), 국제공개일자, 국제공개번호, 국제출원일자, 국제출원번호, 우선권, 우선권주장일, 우선권국가, 우선권출원번호, 원출원일자, 원출원번호, 지정국, Citing Patents, Cited Patents
저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
안내	총 건의 자료가 검색되었습니다. 다운받으실 자료의 인덱스를 입력하세요. (1-10,000) 검색결과의 순서대로 최대 10,000건 까지 다운로드가 가능합니다. 데이타가 많을 경우 속도가 느려질 수 있습니다.(최대 2~3분 소요) 다운로드 파일은 UTF-8 형태로 저장됩니다. 파일의 내용이 제대로 보이지 않을실 때는 웹브라우저 상단의 보기 -> 인코딩 -> 자동선택 여부를 확인하십시오. ~ Text(ASCII format) Excel format

연합인증

Heat sink assembly for solid state devices 원문보기

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이 특허를 인용한 특허 (95)

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Heat sink assembly for solid state devices 원문보기

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이 특허를 인용한 특허 (95)

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