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Modular packaging system

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05K-007/20
출원번호 US-0990515 (1992-12-15)
발명자 / 주소
  • Andersson Nils A. T. (Jarfalla SEX) Fagerstedt Nils U. H. (Jarfalla SEX) Gudmundsson Bjorn G. (Sollentuna SEX)
출원인 / 주소
  • Telefonaktiebolaget LM Ericsson (SEX 03)
인용정보 피인용 횟수 : 52  인용 특허 : 0

초록

In a modular packaging system for electrical equipment, two or more modules are arranged horizontally or vertically relative to one another. Each module includes electrical equipment, a cabinet in which the electrical equipment is disposed, and a fan assembly for forcing air through the cabinet to c

대표청구항

A modular packaging system for electrical equipment, comprising: two or more modules adapted to enclose electrical equipment, each module including a cabinet including an interior adapted to receive the electrical equipment, the cabinet including an inner cabinet wall and a rear cabinet wall, the in

이 특허를 인용한 특허 (52)

  1. Malone, Christopher G.; Simon, Glenn C., Air baffle for managing cooling air re-circulation in an electronic system.
  2. Brooks, Michael Alan; Wilson, Jeremy, Airflow blocker component that comprises a flexible flap portion.
  3. Karppinen,Veijo; Komulainen,Risto, Arrangement for the placement of frequency converters.
  4. Reynov, Boris; Kohn, Jack; Mowat, Euan F.; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  5. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  6. Reynov, Boris; Kohn, Jack; Mowat, Euan F; Siddhaye, Shreeram; Nitzan, Ben; Nagarajan, Mahesh, Chassis system with front cooling intake.
  7. Lambrecht J. Andrew, Chip chassis including a micro-backplane for receiving and connecting a plurality of computer chips.
  8. Dempsey, Daniel J., Compact air handler with multiple fans.
  9. Harvey Robert T. ; Reintjes Tina M., Compact ventilation unit for electronic apparatus.
  10. Harvey Robert T. ; Reintjes Tina M., Compact ventilation unit with exhaust ports for electronic apparatus.
  11. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer chassis for dual offset opposing main boards.
  12. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, Computer rack cooling system.
  13. Coglitore,Giovanni; Gallo,Nikolai; Randall,Jack, Computer rack cooling system.
  14. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  15. Osborn, Jay K.; Wilson, Helenaur, Computing apparatus with cooling fan.
  16. Komatsu Kazuo,JPX, Cooling apparatus and cooling method capable of cooling an encapsulated type housing in a high cooling efficiency.
  17. Garnett, Paul J; Ritson, Nigel D, Cooling computer systems.
  18. Siracki, Glenn T.; Rosswurm, Kim James; Riley, Patrick J.; Keegan, Jeremy J., Cooling duct attachment and sealing for a motor drive.
  19. Dickinson, Roger; O'Connor, John, Cooling module with parallel blowers.
  20. Nishiyama,Shinichi; Morishita,Yasuji; Katakura,Yasuyuki; Okabe,Youji; Maeda,Tadaharu, Cooling structure for electronic devices.
  21. Maherault, Vincent; Briend, Robert; Leturmy, Marc, Device for storing articles in controlled atmosphere.
  22. Matsuzawa, Tadashi; Kusaki, Syuichi, Electronic apparatus, fan unit, and subrack.
  23. Jones Clifford T., Electronics cabinet cooling system.
  24. Pispa, Matti, Enclosure of a power electronics appliance.
  25. Moore, Christopher Todd, Enclosure with duct mounted electronic components.
  26. Strobel,Larry A., Environmental control system for personal computers.
  27. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  28. Weiss, Bruce W., Heat sink cooling arrangement for multiple power electronic circuits.
  29. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  30. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  31. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage system.
  32. Giovanni Coglitore ; Nikolai Gallo ; Jack Randall, High density computer equipment storage system.
  33. Coglitore, Giovanni; Gallo, Nikolai; Randall, Jack, High density computer equipment storage systems.
  34. Niggl Heinz-Juergen,DEX ; Buchberger Georg,DEX ; Schwind Stefan,DEX ; Hannigan Matthew-T, Housing for electrical assemblies.
  35. Chung, Ming Tsai, Housing with hidden ventilation holes.
  36. Hartung,David, Method for electronics equipment cooling having improved EMI control and reduced weight.
  37. Lin, Hsin-An; Tsai, Kuo-Hsien, Modular backup power housing.
  38. Anderson Neil A. ; Dingfelder Donald W. ; Kyllo Mark L. ; Colbert John L. ; Ratajczyk Rodney G., Modular cabinet assembly for a computer.
  39. Modica, Steve, Modular fan brick and method for exchanging air in a brick-based computer system.
  40. Corbett, Jr., Jesse Vernon; Mignacci, Alfred A., Modular stacking equipment rack.
  41. Siracki, Glenn T.; Riley, Patrick J., Motor drive cooling duct system and method.
  42. English Susan I. ; Lecinski Daniel J. ; Laughlin Kenneth S., Mounting brace and cable management apparatus and method.
  43. Richter, John T, Multi-level thermal management system and method.
  44. Smith Grant M., Parallel cooling of high power devices in a serially cooled evironment.
  45. Graczyk, Frank J.; Ramey, Samuel C.; Fleming, James N.; Herbst, Paul M.; McGrath, Michael J.; Wentworth, Joseph D.; Eaton, Alva B., Passive cooling systems for network cabinet.
  46. Coglitore, Giovanni, Portion of a bank of computer chassis mounted to rack bars.
  47. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  48. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  49. Grouell, William L.; Chong, Jr., Fay, Storage device arrangement for increased cooling.
  50. Takahashi Tsutomu (Kawasaki JPX) Yamaji Hiroshi (Kawasaki JPX) Hayashi Hisao (Kawasaki JPX) Amagasa Shigeru (Kawasaki JPX) Sato Takashi (Kawasaki JPX) Hongoh Tomoyuki (Kawasaki JPX) Takahashi Tetsuya, Subrack device.
  51. Shariff, Zia; Hudz, Andrew; Sharp, Anthony Cormick, Systems and methods for base station enclosures.
  52. French,F. William; Nigro, Jr.,Arthur Robert, Techniques for cooling a set of circuit boards within a rack mount cabinet.
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