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Method and apparatus for hydrophobic treatment 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • B05C-011/00
  • C23C-016/00
출원번호 US-0136373 (1993-10-15)
우선권정보 JP-0302998 (1992-10-15)
발명자 / 주소
  • Shiraishi Masatoshi (Kikuchi JPX) Hamada Tomoko (Kumamoto JPX)
출원인 / 주소
  • Tokyo Electron Limited (Tokyo JPX 03) Tokyo Electron Kyushu Limited (Tosu JPX 03)
인용정보 피인용 횟수 : 85  인용 특허 : 0

초록 ▼

Adhesion apparatus for applying a hydrophobic treatment to a semiconductor wafer comprises a tank housing a treating agent of liquid HMDS and a process chamber into which a mixed gas consisting of a vaporized HMDS coming from the tank and a carrier gas is supplied for applying a hydrophobic treatmen

대표청구항 ▼

An apparatus for treating a surface of a substrate to make said surface hydrophobic comprising: a process chamber; support means for supporting a substrate, arranged within said process chamber; temperature adjusting means for adjusting treatment temperature of said substrate; a gas supply pipe comm

이 특허를 인용한 특허 (85)

  1. Fukuoka, Tetsuo; Kitano, Takahiro, Adhesion promoting process, adhesion promoting device, coating and developing system and storage medium.
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  3. Oikawa Akira (Kawasaki JPX) Tanaka Hiroyuki (Kawasaki JPX) Matsuda Hideyuki (Kawasaki JPX), Apparatus of formation of chemically amplified resist pattern.
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  6. Ishikawa, Tetsuya; Roberts, Rick J.; Armer, Helen R.; Volfovski, Leon; Pinson, Jay D.; Rice, Michael; Quach, David H.; Salek, Mohsen S.; Lowrance, Robert; Backer, John A.; Weaver, William Tyler; Carlson, Charles; Wang, Chongyang; Hudgens, Jeffrey; Herchen, Harald; Lue, Brian, Cluster tool architecture for processing a substrate.
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