이 특허를 인용한 특허 (27)

1. Hogan Daniel Mathew ; Scarnecchia Vincent, Adsorbent lid construction.

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2. Stewart, Steven L.; Ash, Carlton E., Attachment of surface mount devices to printed circuit boards using a thermoplastic adhesive.

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3. Xie, Jian, Cochlear implant for an implantable cochlear stimulation system and method of assembly.

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4. Boroson, Michael L.; Hamer, John W., Desiccant sealing arrangement for OLED devices.

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5. Boroson, Michael L.; Serbicki, Jeffrey P.; Bessey, Peter G.; Irvin, Glen C.; Rowley, Lawrence A.; Kaminsky, Cheryl J., Desiccants and desiccant packages for highly moisture-sensitive electronic devices.

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6. Boroson Michael L. ; Serbicki Jeffrey P. ; Bessey Peter G., Desiccation of moisture-sensitive electronic devices.

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7. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.

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8. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.

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9. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.

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10. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.

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11. Allemand, Pierre-Marc, Devices including, methods using, and compositions of reflowable getters.

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12. Becker, Franz-Josef; Klein, Robert-Peter, Drying device and method for producing the same.

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13. Ramakrishnan, Ed Sundaram; Prakash, Shiva, Electronic device including an organic active layer and process for forming the electronic device.

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14. McCormick, Fred B.; Baude, Paul F.; Haase, Michael A., Encapsulation of organic electronic devices using adsorbent loaded adhesives.

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15. Jacobs, Simon Joshua, Getter for enhanced micromechanical device performance.

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16. Boroson, Michael L.; Schmittendorf, John; Serbicki, Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication.

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17. Boroson,Michael L.; Schmittendorf,John; Serbicki,Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication.

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18. Boroson, Michael L.; Schmittendorf, John; Bessey, Peter G.; Serbicki, Jeffrey P., Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.

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19. Michael L. Boroson ; John Schmittendorf ; Peter G. Bessey ; Jeffrey P. Serbicki, Highly moisture-sensitive electronic device element and method for fabrication utilizing vent holes or gaps.

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20. Smith Henry M. ; Schicker James R., Hydrogen and moisture getter and absorber for sealed devices.

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21. Colello Gary M. ; Hartzell Dennis E., Low cost high power hermetic package with electrical feed-through bushings.

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22. Bonucci, Antonio; Rondena, Sergio; Longoni, Giorgio; Amiotti, Marco; Toia, Luca, Method for manufacturing photovoltaic panels by the use of a polymeric tri-layer comprising a composite getter system.

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23. Hakey, Mark C.; Holmes, Steven J.; Horak, David V.; Linde, Harold G.; Sprogis, Edmund J., Method of assembling a plurality of semiconductor devices having different thickness.

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24. Tourino, Cory G.; Rice, Janet L.; Flynn, Gregory, Packaging of MEMS devices using a thermoplastic.

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25. Cao, Jie; Herr, Donald E., Radiation-curable desiccant-filled adhesive/sealant.

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26. Boroson, Michael L.; Schmittendorf, John; Bessey, Peter G.; Serbicki, Jeffrey P., Sealing structure for highly moisture-sensitive electronic device element and method for fabrication.

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27. Ghosh, Syamal K.; He, Fugui; Moore, Harold, Ultrasonically sealing the cover plate to provide a hermetic enclosure for OLED displays.

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