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특허 상세정보

Thermal barrier for hot glue adhesive dispenser

특허상세정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판) B67D-005/62   
미국특허분류(USC) 222/1465 ; 219/421 ; 222/504 ; 392/484
출원번호 US-0235096 (1994-04-29)
발명자 / 주소
출원인 / 주소
인용정보 피인용 횟수 : 64  인용 특허 : 0
초록

An apparatus (10) for dispensing hot melt adhesives includes an air gap (100) in the adhesive manifold (16) of the dispenser (10). The apparatus (10) includes a heater (80), a temperature sensing device (RTD) (82) and adhesive passageway (84) located within the adhesive manifold (16) of the dispenser (10). The dispenser (10) delivers heated adhesive to a gun body (12) where it is applied to a substrate. The air gap (100) is interposed between the heater (80) and the adhesive passageway (84) and directs a majority of the heat generated by the heater (80) ...

대표
청구항

An apparatus for dispensing hot melt adhesives, said apparatus comprising: an adhesive manifold, said adhesive manifold having an adhesive passageway therethrough; heating means for heating said adhesive manifold, said heating means mounted within said adhesive manifold; temperature sensing means for sensing a temperature of said adhesive manifold, said temperature sensing means mounted within said adhesive manifold; and, redirecting means for redirecting heat to a first region of said apparatus and away from a second region of said apparatus, said redir...

이 특허를 인용한 특허 피인용횟수: 64

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