[특허]Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for

Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-035/28
출원번호	US-0128697 (1993-09-30)
우선권정보	JP-0266126 (1992-10-05); JP-0105526 (1993-05-06)
발명자 / 주소	Watanabe Hideo (Kawasaki JPX) Sakai Motohiro (Yokohama JPX) Hisano Fumio (Noboribetsu JPX) Osawa Atsushi (Yokohama JPX) Tezuka Hirofusa (Noboribetsu JPX)
출원인 / 주소	Thermovonics Co., Ltd. (JPX 03)
인용정보	피인용 횟수 : 62 인용 특허 : 0

초록 ▼

A thermoelectric cooling device for a thermoelectric refrigerator is described. The device is composed of p-type and n-type semiconductor layers, a first inner heat conductor, a first outer heat conductor, a second inner heat conductor, and a second outer heat conductor. The p-type and n-type semiconductor layers are electrically connected in series via the electrodes. The p-type and n-type semiconductor layers have a specific average thickness. The average figures of merit of the p-type and n-type semiconductor layers are controlled to a particular value. The thermal conductances of the first and second, inner and outer heat conductors fall within specific ranges, respectively. The coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6. Also described are a process for the fabrication of a semiconductor suitable for use in the thermoelectric cooling device and also a thermoelectric refrigerator using the thermoelectric cooling device.

대표청구항 ▼

A thermoelectric cooling device for a thermoelectric refrigerator, said device being composed of: a number of p-type semiconductor layers and n-type semiconductor layers arranged side by side, a first inner heat conductor having heat-absorbing-side electrodes disposed outside heat-absorbing-side ends of the p-type and n-type semiconductor layers, a first outer heat conductor disposed outside the first inner heat conductor, a second inner heat conductor having heat-dissipating-side electrodes disposed outside heat-dissipating-side ends of the p-type and n-type semiconductor layers, and a second outer heat conductor disposed outside the second inner heat conductor, said p-type semiconductor layers and said n-type semiconductor layers being electrically connected in alternating series via said heat-absorbing-side electrodes and said heat-dissipating-side electrodes, wherein said p-type semiconductor layers and n-type semiconductor layers have an average thickness of at least 0.08 but greater than 0 cm, and the average figures of merit of said p-type semiconductor layers and n-type semiconductor layers are controlled at 2.7×10-3 /k or above, the thermal conductance of said first inner heat conductor within a range of 8-20 w/°C.cm2 of the cross-sectional area of both the p-type and n-type semiconductor layers, the thermal conductance of said first outer heat conductor within a range of 3-10 w/°C.cm2 of the cross-sectional area of both the p-type and n-type semiconductor layers, the thermal conductance of said second inner heat conductor within a range of 8-20 w/°C.cm2 of the cross-sectional area of both the p-type and n-type semiconductor layers, and the thermal conductance (of said second outer heat conductor within a range of 3-10 w/°C.cm2 of the cross-sectional area of both the p-type and n-type semiconductor layers, whereby the coefficient of performance defined in terms of the ratio of the quantity of absorbed heat to inputted power is at least 0.6.

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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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연합인증

Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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연합인증

Thermoelectric cooling device for thermoelectric refrigerator, process for the fabrication of semiconductor suitable for 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

전체(0) 논문(0) 특허(0) 보고서(0)

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이 특허를 인용한 특허 (62)

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특허 원문 보기

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