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Adaptive cooling system 원문보기

IPC분류정보
국가/구분 United States(US) Patent 등록
국제특허분류(IPC7판)
  • H05H-007/20
출원번호 US-0104518 (1993-08-10)
발명자 / 주소
  • Barker
  • III Charles R. (Harvard MA) Olson Richard E. (Rindge NH)
출원인 / 주소
  • Digital Equipment Corporation (Maynard MA 02)
인용정보 피인용 횟수 : 69  인용 특허 : 0

초록

A parallel air flow system which automatically maintains proper coolant flow regardless of the number of circuit boards installed in an enclosure. The enclosure is constructed such that air flow path through any one slot does not affect the air flow through any other slot. Proper air flow through th

대표청구항

An apparatus for packaging and cooling electronic components, the components mounted on a plurality of circuit boards, the apparatus comprising: A. an enclosure, including a plurality of parallel enclosure slots, each of said enclosure slots including: (i) a top wall, (ii) a bottom wall (iii) longit

이 특허를 인용한 특허 (69)

  1. Malone, Christopher G.; Simon, Glenn C., Air baffle for managing cooling air re-circulation in an electronic system.
  2. Doll, Wade J.; Kelley, Douglas P., Air conditioning systems for computer systems and associated methods.
  3. Bland, Patrick M.; Kamath, Vinod; Foster, Sr., Jimmy G.; Zapata, Ivan R., Airflow barriers for efficient cooling of memory modules.
  4. Malone,Christopher G., Airflow distribution control system for usage in a raised-floor data center.
  5. Tsai, Ho Chin; Lee, Sheng Hung; Chen, Li Ping, Airflow-guiding device and computer having same.
  6. VanGilder, James William; Healey, Christopher M.; Zhang, Xuanhang, Analysis of effect of transient events on temperature in a data center.
  7. Yoshimaru, Masaki; Kajio, Naohiko; Imamoto, Takashi, Apparatus, mounting structure, and mounting method.
  8. Yatskov,Alexander I., Apparatuses and methods for cooling electronic devices in computer systems.
  9. Yatskov,Alexander I., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  10. Yatskov,Alexander I.; Hellriegel,Stephen V. R., Assemblies for holding heat sinks and other structures in contact with electronic devices and other apparatuses.
  11. Yatskov,Alexander I.; Hellriegel,Stephen V.R., Assemblies for mounting electronic devices and associated heat sinks to computer modules and other structures.
  12. Claassen, Alan; Hansen, Dennis; Huettner, Cary; Iyengar, Madhusudan; Schmidt, Roger; Schneebeli, Kenneth; Weber, Jr., Gerard, Bidirectional and expandable heat flow measurement tool for units of air cooled electrical equipment.
  13. Hayes Hasler R.,CAX ; Daniels Michael H.,CAX ; Atkinson John C.,CAX, Circuit packs and circuit pack and shelf assemblies.
  14. Takahashi, Tsutomu; Fujii, Katsuya; Hayashi, Hisao; Tani, Shiro; Oomori, Kazunori; Namimatsu, Koichi; Zenitani, Hideki; Konishi, Masato, Communication device and plug-in unit therefor.
  15. Wilson, Jeremy I.; Robertus, Todd D.; Hahn, Steven R.; Brooks, Michael A., Composite construction baffle for modular electronic systems.
  16. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  17. Doll, Wade J., Computer cabinets having progressive air velocity cooling systems and associated methods of manufacture and use.
  18. Coglitore,Giovanni, Computer rack cooling system with variable airflow impedance.
  19. Olesiewicz,Timothy W.; White,M. Sean, Configurable flow control air baffle.
  20. Malone, Christopher G.; Simon, Glenn C., Controllable flow resistance in a cooling apparatus.
  21. Dobbs, Robert W.; Koch, James K.; Wilson, Jeremy I., Cooling fan control based on cabinet intrusion.
  22. Willers, Arthur G.; Kent, Stanton, Cooling system.
  23. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  24. Borror, Steven A.; DiPaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  25. Borror, Steven A.; Dipaolo, Franklin E.; Harvey, Thomas E.; Madara, Steven M.; Mam, Reasey J.; Sillato, Stephen C., Cooling system for high density heat load.
  26. Borror, Steven A; DiPaolo, Franklin E; Harvey, Thomas E; Madara, Steven M; Mam, Reasey J; Sillato, Stephen C, Cooling system for high density heat load.
  27. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  28. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  29. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  30. Yatskov, Alexander I., Cooling systems and heat exchangers for cooling computer components.
  31. McGuff,Matthew Stanley; Cauthern,Sabrina D., Directing airflow for an information handling system.
  32. Guan, Zhi-Bin, Electronic device with air guiding plates.
  33. Madara, Steven M.; Sillato, Steve; Harvey, Thomas E.; Dukes, David A., Electronic equipment cabinet with integrated, high capacity, cooling system, and backup ventilation.
  34. Ghose, Kanad, Energy aware processing load distribution system and method.
  35. Hamlet Darrel J. ; Franklin Eric G., Face plate for a chassis for high frequency components.
  36. Claassen, Alan; Hansen, Dennis John; Huettner, Cary Michael; Iyengar, Madhusudan K; Schmidt, Roger R; Schneebeli, Kenneth Robert; Weber, Jr., Gerard Vincent, Heat flow measurement tool for a rack mounted assembly of electronic equipment.
  37. Doll,Wade J., Heat-spreading devices for cooling computer systems and associated methods of use.
  38. Sygulla, John Michael; Ramakrishnan, Arun; Slowiak, Greg, Hierarchical system manager rollback.
  39. Kelley,Douglas P.; Yatskov,Alexander I., Inlet flow conditioners for computer cabinet air conditioning systems.
  40. Madara,Steven; Sillato,Stephen; Harvey,Thomas; Baer,Daniel, Integrated heat exchangers in a rack for vertical board style computer systems.
  41. Sojka, Matthew, Intelligent rack enclosure.
  42. Anderl, William J.; Erie, Cody J., Memory slot filler.
  43. Korvenheimo Petteri,FIX ; Riekki Eero,FIX, Method and an arrangement for cooling an apparatus cabinet.
  44. Baer, Daniel B, Method and apparatus for cooling electronic enclosures.
  45. Romes, Gary E.; Yarbrough, David W., Method and/or system for compensating for effects of heat flow and/or air flow through fiberglass insulation.
  46. Doll, Wade J., Multi-stage air movers for cooling computer systems and for other uses.
  47. Biemer, Michael G.; Konsowski, Stephen C.; Haas, Tiffani; Krywicki, Jason, Ruggedized, self aligning, sliding air seal for removable electronic units.
  48. Stoll, Oliver; Roesser, Christian; Engelhardt, Joerg, Sensor plug for combined pressure and temperature measurement.
  49. Murayama, Dai; Takagi, Yasuo; Hanada, Yuuichi; Ootani, Hideyoshi; Kinoshita, Tomoyuki; Morimoto, Hiroshi; Takahashi, Koubun, Server room managing air conditioning system and air conditioning control method.
  50. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  51. Kinstle, Robert Michael; Schlichter, Kevin; Barron, Seitu, Server with heat pipe cooling.
  52. Chia, Vic; Dang, Long Huu; Huynh, Hong, Slot-filler blanking tray.
  53. Miyamoto,Kenich; Okabe,Yoji, Storage device, and storage part and dummy unit for storage device.
  54. Shrivastava, Saurabh K.; VanGilder, James W., System and method for arranging equipment in a data center.
  55. Healey, Christopher; Zhang, Xuanhang; VanGilder, James W., System and method for measurement aided prediction of temperature and airflow values in a data center.
  56. VanGilder, James W.; Sheffer, Zachary R.; Zhang, Xuanhang, System and method for predicting perforated tile airflow in a data center.
  57. VanGilder, James W.; Zhang, Xuanhang; Healey, Christopher M., System and method for predicting temperature values in a data center.
  58. Zhang, Xuanhang; VanGilder, James W., System and method for predicting transient cooling performance for a data center.
  59. Zhang, Xuanhang; VanGilder, James William, System and method for predicting transient cooling performance for data center.
  60. VanGilder, James William, System and method for prediction of temperature values in an electronics system.
  61. Healey, Christopher M.; Zhang, Xuanhang, System and method for sequential placement of cooling resources within data center layouts.
  62. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  63. Kelley, Douglas P.; Doll, Wade J.; Yatskov, Alexander I., Systems and associated methods for controllably cooling computer components.
  64. Peterson, Chris E.; Curtis, Robert, Systems and methods for cooling an information handling system and components thereof.
  65. Hellriegel,Stephen V. R.; Yatskov,Alexander I.; Kelley,Douglas P., Systems and methods for cooling computer modules in computer cabinets.
  66. Dalgas, Mikkel; VanGilder, James W.; Healey, Christopher; Johansen, Martin, Systems and methods for predicting fluid dynamics in a data center.
  67. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James A.; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore G., Techniques for data center cooling.
  68. Claassen, Alan; Hamann, Hendrik F.; Iyengar, Madhusudan K.; Lacey, James Andrew; Martin, Yves C.; Schmidt, Roger R.; van Kessel, Theodore Gerard, Techniques for data center cooling.
  69. Crippen, Martin Joseph; Matteson, Jason Aaron; Piazza, William Joseph, Thermal analysis in a data processing system.
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