[특허]Flexible thermal transfer apparatus for cooling electronic components

Flexible thermal transfer apparatus for cooling electronic components 원문보기

IPC분류정보
국가/구분	United States(US) Patent 등록
국제특허분류(IPC7판)	H01L-023/473
출원번호	US-0226272 (1994-04-11)
발명자 / 주소	Tousignant Lew A. (Shoreview MN)
출원인 / 주소	Minnesota Mining and Manufacturing Company (St. Paul MN 02)
인용정보	피인용 횟수 : 45 인용 특허 : 0

초록 ▼

A thermal transfer apparatus adapted for thermal connection to a heat source for conducting heat away from the heat source. The thermal transfer apparatus includes a container which is substantially impermeable to fluid and forms an expandable compartment that is substantially gas-free. A thermal transfer liquid is positioned within the expandable compartment for thermal connection to the heat source. The thermal transfer liquid has a boiling point that is at or below an operating temperature of the heat source. When the heat source is in a non-operating state, the thermal transfer liquid is compressed and substantially fills the expandable compartment. When the heat source is in an operating state, the thermal transfer liquid conducts heat from the heat source. The liquid vaporizes and forms a vapor within the expandable compartment which causes the expandable compartment to expand and create a vapor space above the liquid. A condenser condenses the vapor into a condensate at a location remote from the heat source. The condensate then returns to the body of liquid for additional cooling of the heat source.

대표청구항 ▼

A two-phase thermal transfer apparatus adapted for thermal connection to a heat source, the thermal transfer apparatus comprising: a flexible bag which is substantially impermeable to fluid and has at least one compartment that is expandable between a first volume and a second volume; a thermal transfer liquid which is thermally connected to the heat source and is positioned within the flexible bag; and a rigid condenser which is sealably attached to the flexible bag, has a high thermal conductivity, has an extended condensing surface positioned within the flexible bag and has an extended heat dissipating surface positioned external to the flexible bag.

이 특허를 인용한 특허 (45)

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Borkar Shekhar Yeshwant ; Dreyer Robert S. ; Mulder Hans, Apparatus for mounting a very large scale integration (VLSI) chip to a computer chassis for cooling.
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser block structures with cavities facilitating vapor condensation cooling of coolant.
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser fin structures facilitating vapor condensation cooling of coolant.
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Condenser structures with fin cavities facilitating vapor condensation cooling of coolant.
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Brown, Jason D.; Staheli, Clinton C.; Meeks, Anthony D., Condenser systems for fluid processing systems.
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Campbell, Levi A.; Chu, Richard C.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Cooled electronic module with pump-enhanced, dielectric fluid immersion-cooling.
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Chu, Richard C.; Ellsworth, Jr., Micheal J.; Simons, Robert E., Cooling system and cooled electronics assembly employing partially liquid filled thermal spreader.
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DiGiacomo Giulio ; Iruvanti Sushumna ; Womac David J., Direct chip-cooling through liquid vaporization heat exchange.
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Damren, Richard; Touhey, Colin; Erdenberger, Thomas; Fisher, Michael; Hodge, Geoffrey L.; Guertin, Patrick M.; Galliher, Parrish M., Disposable bioreactor condenser bag and filter heater.
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Tsenter Boris, Electrochemical heat exchanger.
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Tsenter Boris, Electrochemical heat exchanger.
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Jeffries John ; Wang Ray, Heat dissipator with multiple thermal cooling paths.
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Batchelder John Samuel, Heat exchange apparatus.
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Staheli, Clinton C.; Jones, Nephi D.; Goodwin, Michael E., Heat exchanger system with flexible bag.
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Staheli, Clinton C.; Jones, Nephi D.; Goodwin, Michael E., Heat exchanger system with flexible bag.
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Gilliland, Don Alan; Holahan, Maurice Francis; Huettner, Cary Michael, Heat sink apparatus with extendable pin fins.
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Gengel Glenn W., Heat sink structure comprising a microarray of thermal metal heat channels or vias in a polymeric or film layer.
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Haj-Hariri, Hossein; Miralipour, Seyed Reza Monazami, Heat transfer device for high heat flux applications and related methods thereof.
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Monson, Robert J.; Thorson, Kevin J., Heat transfer device with flexible cooling layer.
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Lee Sui Yung,TWX ; Hsu Chien-hung,TWX, Heat-radiating structure.
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Bishop Michael,CAX ; Zapach Trevor,CAX ; Moss John,CAX, Liquid immersion cooling apparatus for electronic systems operating in thermally uncontrolled environments.
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Borkar Shekhar Yeshwant ; Dreyer Robert S. ; Mulder Hans ; Obinata Naomi ; Wells Calvin E., Method and apparatus for mounting a very large scale integration (VLSI) chip package to a computer chasis for cooling.
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Shekhar Yeshwant Borkar ; Robert S. Dreyer ; Hans J. Mulder, Method and apparatus for retrofit mounting a VLSI chip to a computer chassis for current supply.
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Staheli, Clinton C.; Jones, Nephi D.; Goodwin, Michael E., Methods for condensing a humid gas.
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Staheli, Clinton C.; Jones, Nephi D.; Goodwin, Michael E., Mixing system with condenser.
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Campbell, Levi A.; Chu, Richard C.; David, Milnes P.; Ellsworth, Jr., Michael J.; Iyengar, Madhusudan K.; Simons, Robert E., Multi-fluid, two-phase immersion-cooling of electronic component(s).
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Parallel thermoelectric heat exchange systems.
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Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Physically separated hot side and cold side heat sinks in a thermoelectric refrigeration system.
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Jones, Nephi D.; Brau, Christopher D., Regulated vacuum off-gassing of gas filter for fluid processing system and related methods.
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Jones, Nephi D.; Brau, Christopher D., Regulated vacuum off-gassing of gas filter for fluid processing system and related methods.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Thermoelectric heat exchange system comprising cascaded cold side heat sinks.
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June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek; Edwards, Jesse W., Thermoelectric heat exchanger component including protective heat spreading lid and optimal thermal interface resistance.
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Edwards, Jesse W.; Therrien, Robert Joseph; June, M. Sean, Thermoelectric refrigeration system control scheme for high efficiency performance.
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Puckett John Christopher, Two-phase constant-pressure closed-loop water cooling system for a heat producing device.
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Edwards, Jesse W.; June, M. Sean; Therrien, Robert Joseph; Yadav, Abhishek, Two-phase heat exchanger mounting.
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Tuma, Phillip E., Variable position cooling apparatus.
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IPC	Description
A	생활필수품
A62	인명구조; 소방(사다리 E06C)
A62B	인명구조용의 기구, 장치 또는 방법(특히 의료용에 사용되는 밸브 A61M 39/00; 특히 물에서 쓰이는 인명구조 장치 또는 방법 B63C 9/00; 잠수장비 B63C 11/00; 특히 항공기에 쓰는 것, 예. 낙하산, 투출좌석 B64D; 특히 광산에서 쓰이는 구조장치 E21F 11/00)
A62B-1/08	.. 윈치 또는 풀리에 제동기구가 있는 것

내보내기 구분	파일저장 인쇄 메일전송
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저장형식	Text(ASCII format) Excel format PIAS분석(.xls)
메일정보	받는사람 (필수) @ 보내는사람 (선택) @ 제목 내용 KISTI 검색결과 이메일 서비스
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연합인증

Flexible thermal transfer apparatus for cooling electronic components 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

이 특허를 인용한 특허 (45)

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연합인증

Flexible thermal transfer apparatus for cooling electronic components 원문보기

초록 ▼

대표청구항 ▼

연구과제 타임라인

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이 특허를 인용한 특허 (45)

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